Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/16/2011US7999255 Hydrazine-free solution deposition of chalcogenide films
08/16/2011US7999242 Substrate holding apparatus, and inspection or processing apparatus
08/16/2011US7999241 Extreme ultraviolet light source apparatus
08/16/2011US7999210 Heating device for manufacturing semiconductor
08/16/2011US7999016 Semiconductor encapsulating epoxy resin composition and semiconductor device
08/16/2011US7998914 Cleaning solution for semiconductor device or display device, and cleaning method
08/16/2011US7998884 Method of forming a light emitting device with a nanocrystalline silicon embedded insulator film
08/16/2011US7998883 Process for producing zirconium oxide thin films
08/16/2011US7998882 Particle reduction in PECVD processes for depositing low-k material by using a plasma assisted post-deposition step
08/16/2011US7998881 Method for making high stress boron-doped carbon films
08/16/2011US7998880 Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties
08/16/2011US7998879 Insulation structure for high temperature conditions and manufacturing method thereof
08/16/2011US7998878 Method for selective deposition and devices
08/16/2011US7998877 Diffraction grating in conjunction with reduced thickness to increase efficiency of solar cells
08/16/2011US7998876 Method of producing semiconductor element
08/16/2011US7998875 Vapor phase repair and pore sealing of low-K dielectric materials
08/16/2011US7998874 Method for forming hard mask patterns having a fine pitch and method for forming a semiconductor device using the same
08/16/2011US7998873 Method for fabricating low-k dielectric and Cu interconnect
08/16/2011US7998872 Method for etching a silicon-containing ARC layer to reduce roughness and CD
08/16/2011US7998871 Mask forming and implanting methods using implant stopping layer
08/16/2011US7998870 Semiconductor device and method for forming using the same
08/16/2011US7998869 Contact patterning method with transition etch feedback
08/16/2011US7998868 Self-aligned masks using multi-temperature phase-change materials
08/16/2011US7998867 Method for manufacturing epitaxial wafer
08/16/2011US7998866 Silicon carbide polishing method utilizing water-soluble oxidizers
08/16/2011US7998865 Systems and methods for removing wafer edge residue and debris using a residue remover mechanism
08/16/2011US7998864 Noble metal cap for interconnect structures
08/16/2011US7998863 High efficiency solar cell fabrication
08/16/2011US7998862 Method for fabricating semiconductor device
08/16/2011US7998861 Method of manufacturing through-via
08/16/2011US7998860 Method for fabricating semiconductor components using maskless back side alignment to conductive vias
08/16/2011US7998859 Surface preparation process for damascene copper deposition
08/16/2011US7998858 Vertical interconnect structure, memory device and associated production method
08/16/2011US7998856 Interconnects with a dielectric sealant layer
08/16/2011US7998855 Solving via-misalignment issues in interconnect structures having air-gaps
08/16/2011US7998854 Wafer level integration module with interconnects
08/16/2011US7998853 Semiconductor device with through substrate vias
08/16/2011US7998852 Methods for forming an RF device with trench under bond pad feature
08/16/2011US7998851 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same
08/16/2011US7998850 Semiconductor device and method for manufacturing the same
08/16/2011US7998849 Semiconductor device used as high-speed switching device and power device
08/16/2011US7998848 Method of producing field effect transistor
08/16/2011US7998847 III-nitride crystal manufacturing method, III-nitride crystal substrate, and III-nitride semiconductor device
08/16/2011US7998846 3-D integrated circuit system and method
08/16/2011US7998845 Semiconductor device and method of manufacturing the same
08/16/2011US7998844 Method for manufacturing a semiconductor device
08/16/2011US7998843 Method of forming amorphous silicon layer and method of fabricating LCD using the same
08/16/2011US7998842 Atomic layer deposition metallic contacts, gates and diffusion barriers
08/16/2011US7998841 Method for dehydrogenation treatment and method for forming crystalline silicon film
08/16/2011US7998840 Wafer laser processing method and apparatus
08/16/2011US7998839 Semiconductor device and method for manufacturing the same
08/16/2011US7998838 Method and apparatus for scribing a line in a thin film using a series of laser pulses
08/16/2011US7998837 Method for fabricating semiconductor device using spacer patterning technique
08/16/2011US7998836 Method for fabricating gallium nitride based semiconductor electronic device
08/16/2011US7998835 Strain-direct-on-insulator (SDOI) substrate and method of forming
08/16/2011US7998834 Substrate level bonding method and substrate level package
08/16/2011US7998833 Method for bonding wafers
08/16/2011US7998831 Planarized passivation layer for semiconductor devices
08/16/2011US7998830 Semiconductor device with both I/O and core components and method of fabricating same
08/16/2011US7998829 Semiconductor structure and method of manufacture
08/16/2011US7998828 Method of forming metal ion transistor
08/16/2011US7998827 Method of forming a multi-level interconnect structure by overlay alignment procedures
08/16/2011US7998826 Method of forming mark in IC-fabricating process
08/16/2011US7998825 Method for fabricating semiconductor device
08/16/2011US7998823 Method for reducing leakage currents caused by misalignment of a contact structure by increasing an error tolerance of the contact patterning process
08/16/2011US7998822 Semiconductor fabrication process including silicide stringer removal processing
08/16/2011US7998821 Method of manufacturing complementary metal oxide semiconductor transistor
08/16/2011US7998820 High-k gate dielectric and method of manufacture
08/16/2011US7998819 Lateral drain MOSFET with improved clamping voltage control
08/16/2011US7998818 Method for making semiconductor element structure
08/16/2011US7998817 Method of fabricating a high-voltage transistor with an extended drain structure
08/16/2011US7998816 Method for fabricating semiconductor device having vertical gate
08/16/2011US7998815 Shallow trench isolation
08/16/2011US7998814 Semiconductor memory device and method of fabricating the same
08/16/2011US7998813 Methods of fabricating an access transistor having a polysilicon-comprising plug on individual of opposing sides of gate material
08/16/2011US7998812 Semiconductor device
08/16/2011US7998811 Semiconductor device and method for semiconductor device
08/16/2011US7998810 Methods of forming integrated circuit devices having stacked gate electrodes
08/16/2011US7998809 Method for forming a floating gate using chemical mechanical planarization
08/16/2011US7998808 Semiconductor device fabrication using spacers
08/16/2011US7998807 Method for increasing the speed of a light emitting biopolar transistor device
08/16/2011US7998806 Semiconductor device and method of manufacturing the same
08/16/2011US7998805 Component with sensitive component structures and method for the production thereof
08/16/2011US7998804 Nonvolatile memory device including nano dot and method of fabricating the same
08/16/2011US7998803 Pixel structure and method for manufacturing the same
08/16/2011US7998802 Method of manufacturing semiconductor device with offset sidewall structure
08/16/2011US7998801 Manufacturing method of thin film transistor having altered semiconductor layer
08/16/2011US7998800 Method for manufacturing semiconductor device
08/16/2011US7998798 Method of cutting electrical fuse
08/16/2011US7998797 Semiconductor device
08/16/2011US7998796 Semiconductor device and manufacturing method thereof
08/16/2011US7998795 Method of manufacturing a semiconductor device including plural semiconductor chips
08/16/2011US7998794 Resin molded semiconductor device and manufacturing method thereof
08/16/2011US7998793 Light illumination during wafer dicing to prevent aluminum corrosion
08/16/2011US7998792 Semiconductor device assemblies, electronic devices including the same and assembly methods
08/16/2011US7998791 Panel level methods and systems for packaging integrated circuits with integrated heat sinks
08/16/2011US7998790 Integrated circuit packaging system with isolated pads and method of manufacture thereof
08/16/2011US7998789 Method and system for forming copper indium gallium sulfur selenide absorption layer and cadmium sulfide buffer layer under non-vacuum condition
08/16/2011US7998786 Method of manufacturing a TFT array panel
08/16/2011US7998785 Film deposition of amorphous films with a graded bandgap by electron cyclotron resonance