H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/10/2011	CN102148260A Integrated trench guarded Schottky diode structure compatible with power chip and method
08/10/2011	CN102148259A Thin film transistor, array substrate and manufacturing methods thereof and liquid crystal display
08/10/2011	CN102148258A Thin film transistor, method of manufacturing thin film transistor, display unit, and electronic device
08/10/2011	CN102148257A Thin film transistor and manufacturing method thereof
08/10/2011	CN102148255A Grid-control schottky junction field effect transistor with tunneling dielectric layer and formation method
08/10/2011	CN102148253A Semiconductor device and manufacturing method thereof
08/10/2011	CN102148252A Manufacturing method for apparatus and semiconductor device
08/10/2011	CN102148250A High-speed low-noise semiconductor device structure and method for forming same
08/10/2011	CN102148249A SiC semiconductor device and method of manufacturing the same
08/10/2011	CN102148248A High voltage metal oxide semiconductor element and manufacturing method
08/10/2011	CN102148245A Intrinsic MOS (metal oxide semiconductor) transistor and forming method thereof
08/10/2011	CN102148244A Semiconductor device and method for producing the same
08/10/2011	CN102148239A Insulated gate semiconductor device
08/10/2011	CN102148238A Composite dielectric material doped with rare-earth metal oxide and manufacturing method thereof
08/10/2011	CN102148236A Semiconductor device and method of manufacturing the same
08/10/2011	CN102148230A 影像感测模块及其封装方法 Image sensing module and packaging method
08/10/2011	CN102148229A Memory element, and semiconductor device
08/10/2011	CN102148228A Semiconductor device and manufacturing method of semiconductor device
08/10/2011	CN102148221A Electronic component package and manufacturing method therefor
08/10/2011	CN102148217A Interlayer insulating film and wiring structure, and process for producing the same
08/10/2011	CN102148216A Semiconductor structure for interconnection process and manufacturing method thereof
08/10/2011	CN102148215A Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method
08/10/2011	CN102148213A Lead frame of high-power chip package structure and manufacturing method thereof
08/10/2011	CN102148211A Semiconductor assembly, semiconductor device and manufacturing method
08/10/2011	CN102148210A Semiconductor device and method for manufacturing the same
08/10/2011	CN102148206A Semiconductor packaging structure and producing method thereof
08/10/2011	CN102148203A Semiconductor chip and method for forming conductive pillar
08/10/2011	CN102148202A Chip package and method for forming the same
08/10/2011	CN102148201A Semiconductor element, packaging structure and forming method of semiconductor element
08/10/2011	CN102148200A Method for forming active layer pattern of memory
08/10/2011	CN102148199A Manufacturing methods of static random access memory and semiconductor device
08/10/2011	CN102148198A Method for fabricating integrated circuit and gate structure
08/10/2011	CN102148197A Method of fabricating semiconductor device
08/10/2011	CN102148196A TFT-LCD (thin film transistor-liquid crystal display) array substrate and manufacturing method therefor
08/10/2011	CN102148195A TFT-LCD (thin film transistor-liquid crystal display) array substrate and manufacturing method thereof
08/10/2011	CN102148194A Thin film transistor, liquid crystal display panel and manufacturing method thereof
08/10/2011	CN102148193A Dielectric-layer through hole filling method in wafer preparation process
08/10/2011	CN102148192A Method for growing blocking layer and seed layer on surface of silicon through hole
08/10/2011	CN102148191A Formation method for contact hole
08/10/2011	CN102148190A Method for manufacturing semiconductor interconnection structure
08/10/2011	CN102148189A Method for forming contact hole
08/10/2011	CN102148188A Semiconductor device and fabricating method thereof
08/10/2011	CN102148187A Method for removing etching residues of Kelvin through hole
08/10/2011	CN102148186A Method for manufacturing semiconductor device
08/10/2011	CN102148185A Method for forming interconnection structure
08/10/2011	CN102148184A Method for improving roughness of side wall of shallow trench isolation
08/10/2011	CN102148183A Method for forming SOI (Silicon On Insulator) with stepped buried oxide layer
08/10/2011	CN102148182A Method for forming shallow trench isolation structure
08/10/2011	CN102148181A Method for forming shallow trench isolation structure
08/10/2011	CN102148180A Clamping removal device for process component and method therefor
08/10/2011	CN102148179A Using method of bonding film
08/10/2011	CN102148178A Die adhesive film, reel for die adhesive film, mounting apparatus and electronic device comprising the same
08/10/2011	CN102148177A Film adhesion device for film active release
08/10/2011	CN102148176A Lifting device and semiconductor device processing equipment with same
08/10/2011	CN102148175A Semiconductor chip template structure
08/10/2011	CN102148174A Semiconductor defect signal grasping and counting system and method
08/10/2011	CN102148173A Attaching passive component to semiconductor package
08/10/2011	CN102148172A Semiconductor process, semiconductor component and package structure with semiconductor component
08/10/2011	CN102148171A Modular molding assembly for electronic devices
08/10/2011	CN102148170A Substrate adhesion method
08/10/2011	CN102148169A Silicon carbide power module and packaging method thereof
08/10/2011	CN102148168A Method for manufacturing semiconductor package with improved standoff
08/10/2011	CN102148167A Method for manufacturing stackable packaging structure
08/10/2011	CN102148166A Method and structure for filling clearances among stacked multi-layer wafers
08/10/2011	CN102148165A Method for producing housing part for power semiconductor module and Method for producing power semiconductor module
08/10/2011	CN102148164A Formation method for VDMOS (vertical double-diffused metal oxide semiconductor) device
08/10/2011	CN102148163A Methods for manufacturing superjunction structure and superjunction semiconductor device
08/10/2011	CN102148162A Laterally diffused metal oxide semiconductor transistor and method of fabricating the same
08/10/2011	CN102148161A Method for preparing P-type Si3N4 nano wire field effect transistor
08/10/2011	CN102148160A Method for preparing P-type SiC nanowire filed-effect tube
08/10/2011	CN102148159A Method of forming a self-aligned charge balanced power DMOS
08/10/2011	CN102148158A Body contact device structure and manufacturing method therefor
08/10/2011	CN102148157A Producing method of enhanced HEMT with self-aligned filed plate
08/10/2011	CN102148156A Manufacturing method for SiGe heterojunction bipolar transistor
08/10/2011	CN102148155A Silicon wafer and production method therefor
08/10/2011	CN102148154A Multilayer ohmic contact system of gallium nitride device with composite metal barrier layer
08/10/2011	CN102148153A Substrate cleaning method and substrate cleaning apparatus
08/10/2011	CN102148152A Process for stripping photoresist by heavily doped injection
08/10/2011	CN102148151A Etching equipment and etching method of silicon nitride
08/10/2011	CN102148150A Novel normal-pressure free radical beam cleaning method for technical node lower than 32 nanometers
08/10/2011	CN102148149A Method for forming grid of semiconductor device
08/10/2011	CN102148148A Semiconductor device and method for fabricating an integrated circuit device
08/10/2011	CN102148147A Method of manufacturing semiconductor element metal gate stack
08/10/2011	CN102148146A Formation method for grid structure
08/10/2011	CN102148145A Preparation method and detection source-compensating method for boron diffused source film
08/10/2011	CN102148144A Method of manufacturing silicon carbide semiconductor device
08/10/2011	CN102148143A Structure and method for post oxidation silicon trench bottom shaping
08/10/2011	CN102148142A Control and monitoring system for thin die detachment and pick-up
08/10/2011	CN102148141A GaN衬底和半导体器件 GaN substrate and a semiconductor device
08/10/2011	CN102148140A Silicon wafer and manufacturing method thereof
08/10/2011	CN102148139A Improved method for eliminating residual stress of GaN epitaxial wafer by laser quasi-stripping
08/10/2011	CN102148138A Method of joining adhesive tape and apparatus using the same
08/10/2011	CN102148137A MIM (metal injection molding) capacitor and formation technology therefor
08/10/2011	CN102148136A Wafer drying system
08/10/2011	CN102148135A Printing ink dotting device
08/10/2011	CN102148134A Method for isolated and discretized process sequence integration
08/10/2011	CN102148133A Single-wafer drying device and method
08/10/2011	CN102148132A 光学检测装置 Optical detection means
08/10/2011	CN102148131A Method and device for cleaning wafer
08/10/2011	CN102148130A Method for improving control capability of surface photoetching process sensitive to external environment

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