Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2011
09/14/2011CN1959954B Film pattern forming method, device, electro-optical apparatus, and electronic appliance
09/14/2011CN1941339B Semiconductor IC-embedded substrate and method for manufacturing same
09/14/2011CN1940722B Novel tarc material for impregnation type microimage process and method for impregnation type microimage process
09/14/2011CN1886803B Flash memory device
09/14/2011CN1842254B Double-sided wiring board fabrication method and double-sided wiring board
09/14/2011CN1841746B Semiconductor device and fabricating method of the same
09/14/2011CN1684002B Flat plate printing apparatus and device manufacturing method
09/14/2011CN1672098B Method for forming and correcting lithographic template having a repaired gap defect
09/14/2011CN102187749A Method to form solder deposits on substrates
09/14/2011CN102187748A Apparatus for adhering anisotropic conductive film
09/14/2011CN102187742A Methods and apparatus for rapidly responsive heat control in plasma processing devices
09/14/2011CN102187741A Lower electrode assembly of plasma processing chamber
09/14/2011CN102187482A Method for manufacturing nitride semiconductor light emitting element and method for manufacturing epitaxial wafer
09/14/2011CN102187479A Semiconductor optical element array and manufacturing method therefore
09/14/2011CN102187474A Removal of a sheet from a production apparatus
09/14/2011CN102187467A Thin film transistor and method for manufacturing same
09/14/2011CN102187464A Electrode, semiconductor device, and method for manufacturing the semiconductor device
09/14/2011CN102187463A Semiconductor device and method for manufacturing same
09/14/2011CN102187460A Multi-transistor memory cell
09/14/2011CN102187459A Oc dram cell with increased sense margin
09/14/2011CN102187455A Method of making a split gate memory cell
09/14/2011CN102187454A Semiconductor device and manufacturing method thereof
09/14/2011CN102187453A Contacts and vias of a semiconductor device formed by a hardmask and double exposure
09/14/2011CN102187452A Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
09/14/2011CN102187451A Method for producing a stack of semi-conductor thin films
09/14/2011CN102187450A Gapfill improvement with low etch rate dielectric liners
09/14/2011CN102187449A Microelectronic assembly with improved isolation voltage performance and a method for forming the same
09/14/2011CN102187448A Apparatus and method for peeling sheet
09/14/2011CN102187447A Method for inspecting electrostatic chuck, and electrostatic chuck apparatus
09/14/2011CN102187446A Electrostatic chuck, and method for manufacturing the chuck
09/14/2011CN102187445A Apparatus for adhering adhesive tape, and pressure bonding apparatus
09/14/2011CN102187444A Conductive bumps, wire loops, and methods of forming the same
09/14/2011CN102187443A Wire-bonding method, and semiconductor device
09/14/2011CN102187442A Method for manufacturing semiconductor device and semiconductor device
09/14/2011CN102187441A Ultraviolet reflector with coolant gas holes and method
09/14/2011CN102187440A Capacitors, dielectric structures, and methods of forming dielectric structures
09/14/2011CN102187439A Plasma etching method and plasma etching device
09/14/2011CN102187438A Method and apparatus for removing photoresist
09/14/2011CN102187437A Silicon etch with passivation using chemical vapor deposition
09/14/2011CN102187436A Pre-coating and wafer-less auto-cleaning system and method
09/14/2011CN102187435A Silicon etch with passivation using plasma enhanced oxidation
09/14/2011CN102187434A Composition for polishing silicon nitride and method for controlling selectivity using same
09/14/2011CN102187433A Iii nitride semiconductor electronic device, method for manufacturing iii nitride semiconductor electronic device, and iii nitride semiconductor epitaxial wafer
09/14/2011CN102187432A Method for depositing conformal amorphous carbon film by plasma-enhanced chemical vapor deposition (pecvd)
09/14/2011CN102187431A Control of erosion profile on a dielectric RF sputter target
09/14/2011CN102187430A In/out door for a vacuum chamber
09/14/2011CN102187429A Methods and apparatus for recovering heat from processing systems
09/14/2011CN102187282A Resist pattern coating agent and resist pattern forming method using same
09/14/2011CN102187278A Photosensitive resin composition, method for forming silica coating film, and apparatus and member each comprising silica coating film
09/14/2011CN102187277A Positive photosensitive resin composition for spray coating and method for producing through electrode using same
09/14/2011CN102187275A Mask blank substrate
09/14/2011CN102187020A Indium phosphide substrate manufacturing method, epitaxial wafer manufacturing method, indium phosphide substrate, and epitaxial wafer
09/14/2011CN102187011A Cvd precursors
09/14/2011CN102186890A Fluorine-containing sulfonates having polymerizable anions and manufacturing method therefor, fluorine-containing resins, resist compositions, and pattern-forming method using same
09/14/2011CN102186753A Method and device for temporarily storing glass plates for photovoltaic modules
09/14/2011CN102186748A Substrate storing tray
09/14/2011CN102186639A Conveying device and vacuum device
09/14/2011CN102186627A Method and apparatus for polishing a substrate
09/14/2011CN102186620A Bonding device, ultrasonic transducer, and bonding method
09/14/2011CN102185575A Method for removing frequency chip protective glass
09/14/2011CN102185108A Semiconductor memory structure and control method thereof
09/14/2011CN102185044A High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould
09/14/2011CN102185015A Rework processing method for silicon wafer
09/14/2011CN102184970A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/14/2011CN102184968A Thin film transistor with single-gate double-channel structure and manufacturing method thereof
09/14/2011CN102184964A N-channel accumulative SiC IEMOSFET (Implantation and Epitaxial Metal-Oxide-Semiconductor Field Effect Transistor) device and manufacturing method thereof
09/14/2011CN102184962A Metal oxide semiconductor (MOS) device and manufacturing method thereof
09/14/2011CN102184961A Asymmetrical gate metal oxide semiconductor (MOS) device and manufacturing method thereof
09/14/2011CN102184960A Power metal oxide semiconductor field-effect tube and forming method thereof
09/14/2011CN102184959A Power MOS (Metal-Oxide Semiconductor) tube and manufacturing method thereof
09/14/2011CN102184958A Vertical double-diffusion MOS (Metal-Oxide Semiconductor) tube and manufacturing method thereof
09/14/2011CN102184957A UMOS (U-groove-metal-oxide-silicon) transistor and forming method thereof
09/14/2011CN102184956A Longitudinal conduction GaN enhancement type MISFET (Metal Integrated Semiconductor Field Effect Transistor) device and manufacturing method thereof
09/14/2011CN102184955A Complementary tunneling field effect transistor and forming method thereof
09/14/2011CN102184954A Ge channel device and forming method thereof
09/14/2011CN102184953A Stress GeOI structure and forming method thereof
09/14/2011CN102184952A Vertical capacitive depletion field effect transistors (VCDFETS) and methods for fabricating VCDFETS
09/14/2011CN102184947A High-voltage semiconductor structure and preparation method thereof
09/14/2011CN102184946A Metal semiconductor compound film, DRAM (Dynamic Random Access Memory) storage unit and preparation method thereof
09/14/2011CN102184945A Trench type MOSFET (metal-oxide-semiconductor field effect transistor) device
09/14/2011CN102184943A Enhanced AlGaN/GaN HEMT (High Electron Mobility Transistor) device and manufacturing method thereof
09/14/2011CN102184940A 半导体结构及其形成方法 And a method for forming a semiconductor structure
09/14/2011CN102184928A 显示元件及其制造方法 Element and manufacturing method thereof
09/14/2011CN102184927A Device having a contact between semiconductor regions through a buried insulating layer, and process for fabricating said device
09/14/2011CN102184926A Memory cell in which the channel passes through a buried dielectric layer
09/14/2011CN102184925A Strain dynamic random access memory cell structure and manufacturing method thereof
09/14/2011CN102184924A Semiconductor memory device and method for fabricating the same
09/14/2011CN102184923A Silicon nanowire transistor device programmable array and preparation method thereof
09/14/2011CN102184922A Monolithic output stage with vertical high-side PMOS and vertical low-side NMOS interconnected using buried metal, structure and method
09/14/2011CN102184921A Current sensor for semiconductor device and system
09/14/2011CN102184920A Voltage converter and systems including same
09/14/2011CN102184916A Optical module and manufacturing method of the module
09/14/2011CN102184912A Lamination contact structure and preparation method of metallic copper and nickel-silicon compound
09/14/2011CN102184908A Advanced square flat pin-free encapsulating structure and manufacturing method thereof
09/14/2011CN102184906A Packaging substrate with well structure filled with insulator and manufacturing method thereof
09/14/2011CN102184903A Encapsulated semiconductor chip and manufacturing method of through holes thereof
09/14/2011CN102184898A Method for manufacturing semiconductor device and method for manufacturing SiGe HBT (Heterojunction Bipolar Transistor)
09/14/2011CN102184897A Manufacturing process of DBICMOS (Diffused/Bipolar Complementary Metal Oxide Semiconductors) integrated circuit
09/14/2011CN102184896A Technique method for restraining flash memory programming interference
09/14/2011CN102184895A Side wall of high-voltage complementary metal-oxide-semiconductor transistor (CMOS) device and manufacturing method thereof