| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/20/2011 | US8022520 System for hermetically sealing packages for optics |
| 09/20/2011 | US8022518 Semiconductor device having a sealing body and partially exposed conductors |
| 09/20/2011 | US8022513 Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same |
| 09/20/2011 | US8022509 Crack stopping structure and method for fabricating the same |
| 09/20/2011 | US8022504 Semiconductor device having capacitor with upper electrode whose circumference is made long and its manufacture method |
| 09/20/2011 | US8022503 Anti-fusse structure and method of fabricating the same |
| 09/20/2011 | US8022501 Semiconductor device and method for isolating the same |
| 09/20/2011 | US8022500 Semiconductor device having a high aspect ratio isolation trench |
| 09/20/2011 | US8022488 High-performance FETs with embedded stressors |
| 09/20/2011 | US8022487 Increasing body dopant uniformity in multi-gate transistor devices |
| 09/20/2011 | US8022482 Device configuration of asymmetrical DMOSFET with schottky barrier source |
| 09/20/2011 | US8022476 Semiconductor device having vertical and horizontal type gates and method for fabricating the same |
| 09/20/2011 | US8022473 Semiconductor device having reduced sub-threshold leakage |
| 09/20/2011 | US8022459 Metal source and drain transistor having high dielectric constant gate insulator |
| 09/20/2011 | US8022454 Ferroelectric thin films |
| 09/20/2011 | US8022444 Biosensor and method of manufacturing the same |
| 09/20/2011 | US8022440 Compound semiconductor epitaxial substrate and manufacturing method thereof |
| 09/20/2011 | US8022439 Semiconductor device comprising gate electrode surrounding entire circumference of channel region and method for manufacturing the same |
| 09/20/2011 | US8022438 Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer |
| 09/20/2011 | US8022433 Semiconductor sensor device and method for manufacturing same |
| 09/20/2011 | US8022427 Nitride-based semiconductor device and method of manufacturing the same |
| 09/20/2011 | US8022423 Standing transparent mirrorless light emitting diode |
| 09/20/2011 | US8022409 Semiconductor device with omega gate and method for fabricating a semiconductor device |
| 09/20/2011 | US8022385 Memory devices with buried lines |
| 09/20/2011 | US8022380 Laser irradiation method in which a distance between an irradiation object and an optical system is controlled by an autofocusing mechanism and method for manufacturing semiconductor device using the same |
| 09/20/2011 | US8022376 Method for manufacturing semiconductor device or photomask |
| 09/20/2011 | US8022332 Laser processing device |
| 09/20/2011 | US8022291 Method of making front electrode of photovoltaic device having etched surface and corresponding photovoltaic device |
| 09/20/2011 | US8022214 N,N-disubstituted perylene-3,4:9,10-bis(dicarboximides), used as n-type junctions, integrated in various device designs including, circuits, thin film transistors, light-emitting diodes, photoelectric cells, detectors and capacitors |
| 09/20/2011 | US8022145 Dicing and die attach adhesive |
| 09/20/2011 | US8022012 Device and method for fabricating thin films by reactive evaporation |
| 09/20/2011 | US8021993 Method of carrying out an exposure process for a liquid crystal display device |
| 09/20/2011 | US8021992 High aspect ratio gap fill application using high density plasma chemical vapor deposition |
| 09/20/2011 | US8021991 Technique to radiation-harden trench refill oxides |
| 09/20/2011 | US8021990 Gate structure and method |
| 09/20/2011 | US8021989 Method for high topography patterning |
| 09/20/2011 | US8021988 Method of forming semiconductor device and semiconductor device |
| 09/20/2011 | US8021987 Method of modifying insulating film |
| 09/20/2011 | US8021986 Method for producing a transistor with metallic source and drain |
| 09/20/2011 | US8021985 Method to form semiconductor laser diode |
| 09/20/2011 | US8021984 Method for manufacturing semiconductor |
| 09/20/2011 | US8021983 Method of forming pattern of inorganic material film comprising thermally induced cracking |
| 09/20/2011 | US8021982 Method of silicide formation by adding graded amount of impurity during metal deposition |
| 09/20/2011 | US8021981 Redistribution layers for microfeature workpieces, and associated systems and methods |
| 09/20/2011 | US8021980 Methods of manufacturing semiconductor devices including a copper-based conductive layer |
| 09/20/2011 | US8021979 Method of manufacturing semiconductor device |
| 09/20/2011 | US8021978 Methods of fabricating flash memory devices having shared sub active regions |
| 09/20/2011 | US8021977 Methods of forming contact structures and semiconductor devices fabricated using contact structures |
| 09/20/2011 | US8021976 Method of wire bonding over active area of a semiconductor circuit |
| 09/20/2011 | US8021975 Plasma processing method for forming a film and an electronic component manufactured by the method |
| 09/20/2011 | US8021974 Structure and method for back end of the line integration |
| 09/20/2011 | US8021973 System and method to reduce the bondwire/trace inductance |
| 09/20/2011 | US8021972 Method of manufacturing array substrate |
| 09/20/2011 | US8021971 Structure and method to form a thermally stable silicide in narrow dimension gate stacks |
| 09/20/2011 | US8021970 Method of annealing a dielectric layer |
| 09/20/2011 | US8021969 Semiconductor device and method for fabricating the same |
| 09/20/2011 | US8021968 Susceptor and method for manufacturing silicon epitaxial wafer |
| 09/20/2011 | US8021967 Nanoscale wicking methods and devices |
| 09/20/2011 | US8021966 Method fabricating nonvolatile memory device |
| 09/20/2011 | US8021965 Inter-chip communication |
| 09/20/2011 | US8021964 Method of producing segmented chips |
| 09/20/2011 | US8021963 Wafer treating method |
| 09/20/2011 | US8021962 Functional film containing structure and method of manufacturing functional film |
| 09/20/2011 | US8021961 Process of fabricating microfluidic device chips and chips formed thereby |
| 09/20/2011 | US8021960 Method for manufacturing semiconductor device |
| 09/20/2011 | US8021959 Method for the ultrasonic planarization of a substrate, from one surface of which a buried weakened layer has been uncovered by fracture |
| 09/20/2011 | US8021958 Method for manufacturing SOI substrate and method for manufacturing semiconductor device |
| 09/20/2011 | US8021957 Process of forming an electronic device including insulating layers having different strains |
| 09/20/2011 | US8021956 Ultrathin SOI CMOS devices employing differential STI liners |
| 09/20/2011 | US8021955 Method characterizing materials for a trench isolation structure having low trench parasitic capacitance |
| 09/20/2011 | US8021954 Integrated circuit system with hierarchical capacitor and method of manufacture thereof |
| 09/20/2011 | US8021953 Method for making PMC type memory cells |
| 09/20/2011 | US8021952 Integrated transistor, particularly for voltages and method for the production thereof |
| 09/20/2011 | US8021951 Formation of longitudinal bipolar transistor with base region in trenches having emitter and collector regions disposed along portions of side surfaces of base region |
| 09/20/2011 | US8021950 Semiconductor wafer processing method that allows device regions to be selectively annealed following back end of the line (BEOL) metal wiring layer formation |
| 09/20/2011 | US8021949 Method and structure for forming finFETs with multiple doping regions on a same chip |
| 09/20/2011 | US8021947 Method of forming an insulated gate field effect transistor device having a shield electrode structure |
| 09/20/2011 | US8021946 Nonvolatile memory device and method for fabricating the same |
| 09/20/2011 | US8021945 Bottle-shaped trench capacitor with enhanced capacitance |
| 09/20/2011 | US8021944 Method for fabricating semiconductor device |
| 09/20/2011 | US8021943 Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology |
| 09/20/2011 | US8021942 Method of forming CMOS device having gate insulation layers of different type and thickness |
| 09/20/2011 | US8021941 Bias-controlled deep trench substrate noise isolation integrated circuit device structures |
| 09/20/2011 | US8021940 Methods for fabricating PMOS metal gate structures |
| 09/20/2011 | US8021939 High-k dielectric and metal gate stack with minimal overlap with isolation region and related methods |
| 09/20/2011 | US8021938 Semiconductor device and method for fabricating the same |
| 09/20/2011 | US8021937 Array substrate including thin film transistor and method of fabricating the same |
| 09/20/2011 | US8021936 Method of manufacturing thin film transistor |
| 09/20/2011 | US8021935 Thin film device fabrication process using 3D template |
| 09/20/2011 | US8021934 Method for making a transistor with metallic source and drain |
| 09/20/2011 | US8021933 Integrated circuit including structures arranged at different densities and method of forming the same |
| 09/20/2011 | US8021932 Semiconductor device, and manufacturing method therefor |
| 09/20/2011 | US8021930 Semiconductor device and method of forming dam material around periphery of die to reduce warpage |
| 09/20/2011 | US8021929 Apparatus and method configured to lower thermal stresses |
| 09/20/2011 | US8021928 System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices |
| 09/20/2011 | US8021927 Die down ball grid array packages and method for making same |
| 09/20/2011 | US8021926 Methods for forming semiconductor devices with low resistance back-side coupling |
| 09/20/2011 | US8021924 Encapsulant cavity integrated circuit package system and method of fabrication thereof |
| 09/20/2011 | US8021923 Semiconductor package having through-hole vias on saw streets formed with partial saw |
| 09/20/2011 | US8021921 Method of joining chips utilizing copper pillar |