| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/21/2011 | CN102193326A Proximity exposure device, carrying stage temperature control method and manufacturing method for panel substrate |
| 09/21/2011 | CN102192908A Polysilicon thin film inspection method and device thereof |
| 09/21/2011 | CN102192337A Flap transfer valve with pivoting valve closure boards |
| 09/21/2011 | CN102191552A Improved semi-insulating group III metal nitride and method of manufacture |
| 09/21/2011 | CN102191539A Method of growing nitride semiconductor and nitride semiconductor substrate formed using the same |
| 09/21/2011 | CN102191502A Gas shower structure and substrate processing apparatus |
| 09/21/2011 | CN102191486A Laser processing device |
| 09/21/2011 | CN102191479A Methods to prepare silicon-containing films |
| 09/21/2011 | CN102191474A Vertical heat treatment apparatus and assembly of pressure detection system and temperature sensor |
| 09/21/2011 | CN102191473A Vertical heat treatment apparatus and method for cooling the apparatus |
| 09/21/2011 | CN102191472A Method for recycling separation blade |
| 09/21/2011 | CN102191467A Metal line, manufacturing method of thin film, TFT array panel, and method for manufacturing the same |
| 09/21/2011 | CN102191063A Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrate |
| 09/21/2011 | CN102191005A Adhesive composition and sheet for forming semiconductor wafer-protective film |
| 09/21/2011 | CN102190981A Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor device |
| 09/21/2011 | CN102190977A Dicing die-bonding film |
| 09/21/2011 | CN102190975A Die bond film, dicing die bond film, and semiconductor device |
| 09/21/2011 | CN102190973A Film for manufacturing semiconductor device and method of manufacturing semiconductor device |
| 09/21/2011 | CN102190963A Polishing composition and polishing method using the same |
| 09/21/2011 | CN102190962A Polishing composition and polishing method using the same |
| 09/21/2011 | CN102190961A Polishing composition and polishing method using the same |
| 09/21/2011 | CN102190864A Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereof |
| 09/21/2011 | CN102190156A Tray-type substrate conveying system, film formation method and manufacturing method of electronic device |
| 09/21/2011 | CN102190131A Storage box |
| 09/21/2011 | CN102189736A Film cutting mechanism for wafer film laminator |
| 09/21/2011 | CN102189542A Manipulator for conveying semiconductor wafers |
| 09/21/2011 | CN102189506A 微孔抛光垫 Porous polishing pad |
| 09/21/2011 | CN102189469A Method for dynamically adjusting time limit of chemically-mechanical polishing |
| 09/21/2011 | CN102189340A Laser processing device |
| 09/21/2011 | CN102189052A Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method |
| 09/21/2011 | CN101877309B Epitaxy method for improving 4H-SiC basal plane dislocation conversion rate |
| 09/21/2011 | CN101847578B Method for growing semi-polar GaN based on Al2O3 substrate with m sides |
| 09/21/2011 | CN101807517B Method for forming copper-interconnection MIM capacitor structure and formed structure thereof |
| 09/21/2011 | CN101789443B Pixel structure and manufacturing method thereof and manufacturing method of electronic device |
| 09/21/2011 | CN101789386B Method for chip alignment |
| 09/21/2011 | CN101765902B Apparatus for generating dielectric barrier discharge gas |
| 09/21/2011 | CN101755329B Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device |
| 09/21/2011 | CN101720500B Inductively coupled dual zone processing chamber with single planar antenna |
| 09/21/2011 | CN101720497B Variable volume plasma processing chamber and associated methods |
| 09/21/2011 | CN101681849B Bonding apparatus, and bonding method |
| 09/21/2011 | CN101666591B Radiating fin, radiating module and assembling method thereof |
| 09/21/2011 | CN101656260B Antistatic GaN-based luminescent device and preparation method thereof |
| 09/21/2011 | CN101636828B Active matrix substrate |
| 09/21/2011 | CN101625965B Device for processing substrate |
| 09/21/2011 | CN101557682B Method for manufacturing electronic component supporting plate |
| 09/21/2011 | CN101536176B A transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor |
| 09/21/2011 | CN101519183B Mems packaging including integrated circuit dies |
| 09/21/2011 | CN101493494B Semiconductor element test method and system |
| 09/21/2011 | CN101454125B Work transfer system |
| 09/21/2011 | CN101349872B Photolithography exposure apparatus, system and photolithography patterning method |
| 09/21/2011 | CN101339904B Method of manufacturing semiconductor device |
| 09/21/2011 | CN101335242B Method for fabricating semiconductor device |
| 09/21/2011 | CN101325154B Germanium-painting structure for insulating layer of mixed graphical monocrystaline silicon as well as method and application thereof |
| 09/21/2011 | CN101312136B Solder ball printing device |
| 09/21/2011 | CN101303371B Probe card and method for fabricating the same |
| 09/21/2011 | CN101258606B Semiconductor device |
| 09/21/2011 | CN101251698B Liquid crystal display panel and method for making the same |
| 09/21/2011 | CN101236892B Ion beam apparatus having plasma sheath controller |
| 09/21/2011 | CN101234383B The sorting apparatus for semiconductor chip |
| 09/21/2011 | CN101230241B Adhesive for electrode connection and connecting method using it |
| 09/21/2011 | CN101211895B Structure for supervising memory array unit interval and the method |
| 09/21/2011 | CN101211765B Shallow impurity drain domain logical operation method capable of diminishing ion implantation shadow effect |
| 09/21/2011 | CN101197347B Interconnection and its forming method |
| 09/21/2011 | CN101183198B Liquid crystal display device and manufacturing method thereof |
| 09/21/2011 | CN101179009B Jet cleaning method and device |
| 09/21/2011 | CN101144000B Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package |
| 09/21/2011 | CN101135033B Conductive, plasma-resistant member |
| 09/21/2011 | CN101124666B Method for reducing trap density in semiconductor wafer |
| 09/21/2011 | CN101118837B Process device for executing leaching, suction and drying process |
| 09/21/2011 | CN101114604B Apparatus and method for transferring substrate |
| 09/21/2011 | CN101100243B Conveyor apparatus for brittle substrate |
| 09/21/2011 | CN101075577B Method of manufacturing semiconductor device |
| 09/21/2011 | CN101049045B Reduction of air damping in mems device |
| 09/21/2011 | CN101043003B Process for fabricating a semiconductor device with metallic gate and semiconductor device |
| 09/21/2011 | CN101013261B Mold for imprint, process for producing minute structure using the mold, and process for producing the mold |
| 09/20/2011 | US8024676 Multi-pitch scatterometry targets |
| 09/20/2011 | US8024065 Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
| 09/20/2011 | US8023248 Electrostatic chuck |
| 09/20/2011 | US8023247 Electrostatic chuck with compliant coat |
| 09/20/2011 | US8023246 Electrostatic chuck and method of manufacturing the same |
| 09/20/2011 | US8023112 Alignment apparatus and fabrication apparatus for planar member and alignment method and fabrication method for planar member |
| 09/20/2011 | US8023100 Exposure apparatus, supply method and recovery method, exposure method, and device producing method |
| 09/20/2011 | US8023086 Pad structure of liquid crystal display device and fabrication method thereof |
| 09/20/2011 | US8023057 Thin film transistor array panel used for liquid crystal display and a manufacturing method thereof |
| 09/20/2011 | US8023042 Semiconductor device and method of manufacturing therefor |
| 09/20/2011 | US8023019 Image-sensing chip package module for reducing its whole thickness |
| 09/20/2011 | US8022610 Electronic device containing carbon nanotubes |
| 09/20/2011 | US8022559 Substrate for a display panel, and a display panel having the same |
| 09/20/2011 | US8022555 Semiconductor package and method of forming the same |
| 09/20/2011 | US8022551 Solder composition for electronic devices |
| 09/20/2011 | US8022550 Semiconductor integrated circuit device |
| 09/20/2011 | US8022548 Method for fabricating conducting plates for a high-Q MIM capacitor |
| 09/20/2011 | US8022546 Top layers of metal for high performance IC's |
| 09/20/2011 | US8022545 Top layers of metal for high performance IC's |
| 09/20/2011 | US8022538 Base package system for integrated circuit package stacking and method of manufacture thereof |
| 09/20/2011 | US8022537 Semiconductor device |
| 09/20/2011 | US8022536 Semiconductor substrate for build-up packages |
| 09/20/2011 | US8022533 Circuit apparatus provided with asperities on substrate surface |
| 09/20/2011 | US8022529 Semiconductor device and method for manufacturing the same |
| 09/20/2011 | US8022525 Semiconductor device and method of manufacturing semiconductor device |