| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/28/2011 | CN102201436A Semiconductor structure and manufacturing method thereof |
| 09/28/2011 | CN102201435A Semiconductor structure and production method thereof |
| 09/28/2011 | CN102201434A High-frequency thyristor |
| 09/28/2011 | CN102201433A Semiconductor device and method of manufacturing the same |
| 09/28/2011 | CN102201430A Organic electroluminescent display device and method of fabricating the same |
| 09/28/2011 | CN102201429A Resistive Random Access Memory (RRAM) unit |
| 09/28/2011 | CN102201428A Photonic device and manufacturing method thereof |
| 09/28/2011 | CN102201420A Photoelectric conversion apparatus, image pickup system, and manufacturing method therefor |
| 09/28/2011 | CN102201418A Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus |
| 09/28/2011 | CN102201416A Three-dimensional semiconductor memory devices and methods of fabricating the same |
| 09/28/2011 | CN102201414A Semiconductor memory device and manufacturing the same |
| 09/28/2011 | CN102201412A Single-gate nonvolatile flash memory unit, memory device and manufacturing method thereof |
| 09/28/2011 | CN102201411A Moire nonvolatile flash storage unit, storage device and manufacturing method thereof |
| 09/28/2011 | CN102201410A Semiconductor device |
| 09/28/2011 | CN102201409A Power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device with tungsten spacing layer and production method thereof |
| 09/28/2011 | CN102201406A Bipolar CMOS DMOS (BCD) integrated device based on N type extension layer and manufacture method thereof |
| 09/28/2011 | CN102201405A Imaging-based silicon-on-insulator-electro-static discharge (SOI-ESD) protective device and manufacturing method thereof |
| 09/28/2011 | CN102201404A SOI (silicon on insulator)-based ESD (electro-static discharge) protection device and production method thereof |
| 09/28/2011 | CN102201398A Resin sealed semiconductor device and manufacturing method therefor |
| 09/28/2011 | CN102201396A Large insulated gate bipolar translator (IGBT) module and packaging method thereof |
| 09/28/2011 | CN102201395A Multi-layer semiconductor module packaging structure with anti-surge function and manufacturing method thereof |
| 09/28/2011 | CN102201394A Semiconductor wafer and its manufacture method, and semiconductor chip |
| 09/28/2011 | CN102201391A Semiconductor device and method of manufacturing the same |
| 09/28/2011 | CN102201390A Chip on film (COF) packaging substrate for high-pixel camera module and manufacturing method thereof |
| 09/28/2011 | CN102201389A Semiconductor device provided with tin diffusion inhibiting layer and manufacturing method of the same |
| 09/28/2011 | CN102201388A QFN semiconductor package and fabrication method thereof |
| 09/28/2011 | CN102201387A OFN semiconductor package and fabrication method thereof |
| 09/28/2011 | CN102201386A QFN semiconductor package and fabricating method thereof |
| 09/28/2011 | CN102201385A QFN semiconductor package and fabricating method thereof |
| 09/28/2011 | CN102201383A Electronic device package and fabricating method thereof |
| 09/28/2011 | CN102201382A Semiconductor packaging piece and manufacturing method thereof |
| 09/28/2011 | CN102201379A Device packaging structure and packaging method thereof |
| 09/28/2011 | CN102201376A Optical cover plate with improved solder mask dam on galss for image sensor package and fabrication method thereof |
| 09/28/2011 | CN102201374A Semiconductor chip with packaging ring and manufacturing method thereof |
| 09/28/2011 | CN102201373A Manufacture method of SOI (silicon on insulator)-based electronic fuse line |
| 09/28/2011 | CN102201372A Semiconductor device and manufacturing method thereof |
| 09/28/2011 | CN102201371A Trench manufacturing method |
| 09/28/2011 | CN102201370A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/28/2011 | CN102201369A Method for manufacturing complementary metal oxide semiconductor (CMOS) device with stress layer |
| 09/28/2011 | CN102201368A Production method and structure of silicon chip and substrate co-constructed surface adhesive diode element |
| 09/28/2011 | CN102201367A Thin film transistor array panel and method of fabricating the same |
| 09/28/2011 | CN102201366A Trench type power semiconductor structure with Schottky diode and manufacturing method thereof |
| 09/28/2011 | CN102201365A Method for producing semiconductor device |
| 09/28/2011 | CN102201364A Method for preparing germanium-on-insulator (GeOI) substrate |
| 09/28/2011 | CN102201363A Shallow trench isolation structure forming method for flash memory device |
| 09/28/2011 | CN102201362A Method for preparing the substrate with insulating buried layer and arbitrary thickness |
| 09/28/2011 | CN102201361A Method for reducing dislocation effectively and semiconductor device |
| 09/28/2011 | CN102201360A STI (Shallow Trench Isolation) structure and manufacturing method thereof |
| 09/28/2011 | CN102201359A Method for forming double-trench isolation structure |
| 09/28/2011 | CN102201358A Device and method for characterizing substrate surface property |
| 09/28/2011 | CN102201357A Equipment for extracting, turning and setting wafer-level packaged microchip |
| 09/28/2011 | CN102201356A Substrate mounting table |
| 09/28/2011 | CN102201355A Substrate holding device and defect correcting device using the same |
| 09/28/2011 | CN102201354A Workpiece transport method and workpiece transport device |
| 09/28/2011 | CN102201353A Electromagnetic vibrating type conveying device for grains |
| 09/28/2011 | CN102201352A Receiving container for dustproof thin film component and trolley for transporting the same |
| 09/28/2011 | CN102201351A Semiconductor device and method for forming dual UBM structure for lead free bump connection |
| 09/28/2011 | CN102201350A Manufacture method for semiconductor device |
| 09/28/2011 | CN102201349A Circuit component built-in module and manufacturing method therefor |
| 09/28/2011 | CN102201348A Array cutting type quad flat non-leaded packaging method |
| 09/28/2011 | CN102201347A Manufacturing methods of oxide thin film transistor and display apparatus |
| 09/28/2011 | CN102201346A CCD (charge coupled device) production method capable of improving yield |
| 09/28/2011 | CN102201345A Production method of termination structure used for deep-trench super junction MOS (Metal Oxide Semiconductor) device |
| 09/28/2011 | CN102201344A Gate metal routing for transistor with checkerboarded layout |
| 09/28/2011 | CN102201343A Preparation method of Nano MOS (Metal Oxide Semiconductor) device and Nano MOS device |
| 09/28/2011 | CN102201342A Method for improving reverse breakdown voltage from P-well to N-well and CMOS (Complementary Metal-Oxide-Semiconductor) silicon device |
| 09/28/2011 | CN102201341A Method for manufacturing NMOS (N-channel Metal Oxide Semiconductor) transistor |
| 09/28/2011 | CN102201340A Double-positive angle mesa forming method for thyristor chip |
| 09/28/2011 | CN102201339A Method for reducing capacity of B-C junction of InP DHBT (Indium Phosphide Double Heterojunction Bipolar Transistor) |
| 09/28/2011 | CN102201338A Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
| 09/28/2011 | CN102201337A Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
| 09/28/2011 | CN102201336A Method for removing residue of etched oxide layer on semiconductor device layer |
| 09/28/2011 | CN102201335A Manufacturing method of grid of MOS (metal oxide semiconductor) transistor with stable stress |
| 09/28/2011 | CN102201334A Method for manufacturing T-shaped grid structure with U-shaped grid feet |
| 09/28/2011 | CN102201333A Photoresists and methods for use thereof |
| 09/28/2011 | CN102201332A Preparation method of GaN substrate |
| 09/28/2011 | CN102201331A Substrate processing method |
| 09/28/2011 | CN102201330A Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
| 09/28/2011 | CN102201329A Quartz heating groove |
| 09/28/2011 | CN102201328A Welding head mechanism of die bonder |
| 09/28/2011 | CN102201327A Adhesive tape joining method and adhesive tape joining apparatus |
| 09/28/2011 | CN102201326A Wireless communication small card embedding device and manufacturing method thereof |
| 09/28/2011 | CN102201325A Flexible wafer picking and placing mechanism of crystal fixing machine |
| 09/28/2011 | CN102201324A Method and system for manufacturing semiconductor |
| 09/28/2011 | CN102201323A Method and system for manufacturing semiconductor, and method for manufacturing semiconductor device |
| 09/28/2011 | CN102201189A Flat panel display device and method for manufacturing thereof |
| 09/28/2011 | CN102200696A Method for determining optimal photoetching process parameters by using focusing and exposure matrix |
| 09/28/2011 | CN102200686A Mask layout and method for monitoring process window for chemical mechanical polishing by using the same |
| 09/28/2011 | CN102200665A High light transmittance in-plane switching liquid crystal display device and method for manufacturing the same |
| 09/28/2011 | CN102200552A Method and equipment for testing square resistor of silicon sheet |
| 09/28/2011 | CN102200181A Z-axis transmission structure |
| 09/28/2011 | CN102199404A Film-like circuit connecting material and connection structure for circuit member |
| 09/28/2011 | CN102199399A Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride |
| 09/28/2011 | CN102198925A MEMS device and forming method thereof |
| 09/28/2011 | CN102198572A Soldering flux and method for manufacturing a semiconductor device using the same |
| 09/28/2011 | CN101986208B Support structure of lithographic apparatus |
| 09/28/2011 | CN101887864B Three-dimension packaging method |
| 09/28/2011 | CN101877315B Method for improving breakdown voltage of LDMOS devices |
| 09/28/2011 | CN101853789B Method for manufacturing golden finger of soldering-pan of flexible package carrying board |
| 09/28/2011 | CN101834129B Method for preparing nano spacing planar electrode |