| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/22/2011 | US20110228241 Lithographic apparatus and device manufacturing method |
| 09/22/2011 | US20110228151 Photoelectric conversion film-stacked solid-state imaging device without microlenses, its manufacturing method, and imaging apparatus |
| 09/22/2011 | US20110227878 Semiconductor device, method for manufacturing same, and display device using semiconductor device |
| 09/22/2011 | US20110227794 Package inverted f-antenna |
| 09/22/2011 | US20110227232 Crenulated wiring structure and method for integrated circuit interconnects |
| 09/22/2011 | US20110227230 Through-silicon via fabrication with etch stop film |
| 09/22/2011 | US20110227229 Semiconductor wafer processing |
| 09/22/2011 | US20110227228 Filling composition, semiconductor device including the same, and method of fabricating the semiconductor device |
| 09/22/2011 | US20110227227 Integrated circuit having tsvs including hillock suppression |
| 09/22/2011 | US20110227224 Semiconductor device and method for manufacturing the same |
| 09/22/2011 | US20110227223 Embedded die with protective interposer |
| 09/22/2011 | US20110227222 Surface-mounted electronic component |
| 09/22/2011 | US20110227221 Electronic device having interconnections and pads |
| 09/22/2011 | US20110227220 Stackable semiconductor package and manufacturing method thereof |
| 09/22/2011 | US20110227217 Semiconductor package with stacked chips and method for manufacturing the same |
| 09/22/2011 | US20110227216 Under-Bump Metallization Structure for Semiconductor Devices |
| 09/22/2011 | US20110227215 Electronic device, package including the same and method of fabricating the package |
| 09/22/2011 | US20110227214 Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
| 09/22/2011 | US20110227213 Method for fabricating semiconductor devices and a semiconductor device made therefrom |
| 09/22/2011 | US20110227212 Semiconductor device package and method of fabricating the same |
| 09/22/2011 | US20110227211 Integrated circuit packaging system with package leads and method of manufacture thereof |
| 09/22/2011 | US20110227210 Chip package and method for forming the same |
| 09/22/2011 | US20110227209 Integrated circuit package system with package stacking and method of manufacture thereof |
| 09/22/2011 | US20110227208 Structure and Manufacture Method For Multi-Row Lead Frame and Semiconductor Package |
| 09/22/2011 | US20110227207 Stacked dual chip package and method of fabrication |
| 09/22/2011 | US20110227206 Integrated circuit packaging system with lead frame and method of manufacture thereof |
| 09/22/2011 | US20110227205 Multi-layer lead frame package and method of fabrication |
| 09/22/2011 | US20110227204 Semiconductor device and method for manufacturing a semiconductor device |
| 09/22/2011 | US20110227203 Method of Providing a Semiconductor Device With a Dielectric Layer and Semiconductor Device Thereof |
| 09/22/2011 | US20110227202 Silicon wafer and fabrication method thereof |
| 09/22/2011 | US20110227201 Semiconductor chip with a rounded corner |
| 09/22/2011 | US20110227200 Alignment structures for integrated-circuit packaging |
| 09/22/2011 | US20110227199 Method for producing semiconductor substrate, semiconductor substrate, method for manufacturing electronic device, and reaction apparatus |
| 09/22/2011 | US20110227198 Semipolar semiconductor crystal and method for manufacturing the same |
| 09/22/2011 | US20110227194 Method for forming a three-dimensional structure of metal-insulator-metal type |
| 09/22/2011 | US20110227191 Silicon-on-insulator devices with buried depletion shield layer |
| 09/22/2011 | US20110227188 Integrated circuits including dummy structures and methods of forming the same |
| 09/22/2011 | US20110227180 Solid-state imaging device and method for manufacturing same |
| 09/22/2011 | US20110227179 Magnetoresistive element, method of manufacturing the same, and magnetic memory |
| 09/22/2011 | US20110227174 Semiconductor physical quantity sensor and method of manufacturing the same |
| 09/22/2011 | US20110227170 Mosfet structure and method of fabricating the same |
| 09/22/2011 | US20110227169 Semiconductor device |
| 09/22/2011 | US20110227167 Reduced substrate coupling for inductors in semiconductor devices |
| 09/22/2011 | US20110227162 Method of making a finfet, and finfet formed by the method |
| 09/22/2011 | US20110227161 Method of fabricating hybrid impact-ionization semiconductor device |
| 09/22/2011 | US20110227160 Semiconductor Device and Method of Manufacturing the Same |
| 09/22/2011 | US20110227159 Thin-box metal backgate extremely thin soi device |
| 09/22/2011 | US20110227158 3d integrated circuit structure, semiconductor device and method of manufacturing same |
| 09/22/2011 | US20110227157 Etsoi with reduced extension resistance |
| 09/22/2011 | US20110227155 Integration of a sense fet into a discrete power mosfet |
| 09/22/2011 | US20110227154 Semiconductor device and method of manufacturing the same |
| 09/22/2011 | US20110227150 Semiconductor device and method for manufacturing the same |
| 09/22/2011 | US20110227149 Closed cell trench power mosfet structure and method to fabricate the same |
| 09/22/2011 | US20110227147 Super junction device with deep trench and implant |
| 09/22/2011 | US20110227144 High-performance semiconductor device and method of manufacturing the same |
| 09/22/2011 | US20110227142 Fortification of charge-storing material in high-k dielectric environments and resulting appratuses |
| 09/22/2011 | US20110227140 Semiconductor memory device and method for manufacturing same |
| 09/22/2011 | US20110227136 Spacer protection and electrical connection for array device |
| 09/22/2011 | US20110227129 Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate |
| 09/22/2011 | US20110227126 Electronics device, semiconductor device, and method for manufacturing the same |
| 09/22/2011 | US20110227101 Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof |
| 09/22/2011 | US20110227094 Strained silicon carbide channel for electron mobility of nmos |
| 09/22/2011 | US20110227093 Field effect transistor and method of manufacturing the same |
| 09/22/2011 | US20110227084 Method of manufacturing a flexible electronic device and flexible device |
| 09/22/2011 | US20110227079 Thin film transistor, display device thereof, and manufacturing method thereof |
| 09/22/2011 | US20110227077 Repair method and active device array substrate |
| 09/22/2011 | US20110227073 Transistor substrate and manufacturing method of the same |
| 09/22/2011 | US20110227071 Semiconductor Constructions, Semiconductor Processing Methods, And Methods Of Forming Isolation Structures |
| 09/22/2011 | US20110227070 Gettering members, methods of forming the same, and methods of performing immersion lithography using the same |
| 09/22/2011 | US20110227068 Method for manufacturing composite substrate comprising wide bandgap semiconductor layer |
| 09/22/2011 | US20110227064 Thin film transistors, methods of manufacturing thin film transistors, and semiconductor device including thin film transistors |
| 09/22/2011 | US20110227061 Semiconductor oxide nanofiber-nanorod hybrid structure and environmental gas sensor using the same |
| 09/22/2011 | US20110227059 Glassy carbon nanostructures |
| 09/22/2011 | US20110227056 Forming agent for gate insulating film of thin film transistor |
| 09/22/2011 | US20110227055 Process for the preparation of organic electronic devices |
| 09/22/2011 | US20110227045 Voltage-Controlled Switches |
| 09/22/2011 | US20110227043 Graphene sensor |
| 09/22/2011 | US20110227042 Method for producing semiconductor substrate, semiconductor substrate, method for manufacturing electronic device, and reaction apparatus |
| 09/22/2011 | US20110227040 Temperature sensor and manufacturing method of temperature sensor |
| 09/22/2011 | US20110227034 Quantum dot-block copolymer hybrid, methods of fabricating and dispersing the same, light emitting device including the same, and fabrication method thereof |
| 09/22/2011 | US20110227032 Memristor with Nanostructure Electrodes |
| 09/22/2011 | US20110227029 Memory elements using self-aligned phase change material layers and methods of manufacturing same |
| 09/22/2011 | US20110227026 Non-volatile storage with metal oxide switching element and methods for fabricating the same |
| 09/22/2011 | US20110227025 Semiconductor memory device and method of manufacturing same |
| 09/22/2011 | US20110227024 Resistance-switching memory cell with heavily doped metal oxide layer |
| 09/22/2011 | US20110227022 Memristor Having a Nanostructure Forming An Active Region |
| 09/22/2011 | US20110227020 Bottom electrodes for use with metal oxide resistivity switching layers |
| 09/22/2011 | US20110227019 Non-volatile memory device and manufacturing method thereof |
| 09/22/2011 | US20110227018 Magnetoresistance element, method of manufacturing the same, and storage medium used in the manufacturing method |
| 09/22/2011 | US20110227017 Semiconductor memory device including variable resistance element or phase-change element |
| 09/22/2011 | US20110226981 Multilayered cap barrier in microelectronic interconnect structures |
| 09/22/2011 | US20110226626 Apparatus and method for treating substrate |
| 09/22/2011 | US20110226421 Plasma processing apparatus |
| 09/22/2011 | US20110226419 Process Chamber, Semiconductor Manufacturing Apparatus and Substrate Processing Method Having the Same |
| 09/22/2011 | US20110226418 Method of manufacturing semiconductor device |
| 09/22/2011 | US20110226303 Method of manufacturing thermoelectric conversion element and thermoelectric conversion element |
| 09/22/2011 | US20110226069 Flexible force or pressure sensor array using semiconductor strain gauge, fabrication method thereof and measurement method thereof |
| 09/22/2011 | DE10240415B4 Halbleiteranordnung mit einem in einem Hohlraum eingebetteten Modul und Verfahren zum Herstellen derselben A semiconductor device comprising an embedded in a cavity module and method for manufacturing the same |
| 09/22/2011 | DE102010016021A1 Transport apparatus e.g. rotating cylinder, for cooling soldered semiconductor wafers, has heating device formed such that warm air flow is partially oriented along path such that sloping temperature gradient is formed along path |
| 09/22/2011 | DE102010013610A1 Method for firmly bonded connection of e.g. semiconductor components or contact elements and printed circuit boards, involves transferring metal alloy, and manufacturing connection between components or elements and substrates after cooling |