| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/28/2011 | CN101814586B Clamping type substrate turnover device |
| 09/28/2011 | CN101802993B Semiconductor device and wire bonding method |
| 09/28/2011 | CN101785099B 电子零件 Electronic Parts |
| 09/28/2011 | CN101764178B Preparation method for silicon-based solar energy thin film |
| 09/28/2011 | CN101764070B Resin adhesive vacuum encapsulation device and process thereof |
| 09/28/2011 | CN101764047B Method of thinning a semiconductor substrate |
| 09/28/2011 | CN101764045B Cavity door fixing device |
| 09/28/2011 | CN101752373B Anti-static protection structure and manufacturing method thereof |
| 09/28/2011 | CN101752225B Multistage etching and filling method of ultra-deep groove |
| 09/28/2011 | CN101740404B Structure of semiconductor packaging piece and manufacture method thereof |
| 09/28/2011 | CN101740324B Silicon wafer cleaner and silicon wafer cleaning method |
| 09/28/2011 | CN101728378B Organic light emitting diode display device and manufacturing method thereof |
| 09/28/2011 | CN101692432B Combined push rod mechanism |
| 09/28/2011 | CN101689524B Device and method for exposing wafers to a liquid |
| 09/28/2011 | CN101689502B Cu wiring film |
| 09/28/2011 | CN101685790B Front-opened cassette configured with inflatable strutting piece modules |
| 09/28/2011 | CN101681877B Light emitting diode with vertical structure |
| 09/28/2011 | CN101677078B Substrate positioning device |
| 09/28/2011 | CN101675498B Method and system for flip chip packaging of micro-mirror devices |
| 09/28/2011 | CN101673696B Front-opening unified pod with wafer constraints arranged on door |
| 09/28/2011 | CN101656193B Technique for processing silicon chip |
| 09/28/2011 | CN101644864B Array substrate for in-plane switching mode liquid crystal display device and method of fabricating the same |
| 09/28/2011 | CN101641765B Transition type deposition system and deposition method and device |
| 09/28/2011 | CN101636844B Planar extended drain transistor and method of producing the same |
| 09/28/2011 | CN101635281B Semiconductor device packages with electromagnetic interference shielding and its forming method |
| 09/28/2011 | CN101630668B Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element |
| 09/28/2011 | CN101615499B Electronic component and manufacture method thereof |
| 09/28/2011 | CN101601128B Test device for semiconductor device |
| 09/28/2011 | CN101593753B Nonvolatile memory and manufacturing method thereof |
| 09/28/2011 | CN101589466B Electronic component |
| 09/28/2011 | CN101587883B Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof |
| 09/28/2011 | CN101573786B Method of fabrication of highly heat dissipative substrates |
| 09/28/2011 | CN101569001B Method for manufacturing flexible semiconductor device and flexible semiconductor device |
| 09/28/2011 | CN101562139B Luminescence chip encapsulating structure for avoiding reducing luminous efficiency and manufacture method thereof |
| 09/28/2011 | CN101551659B Storage monitoring system integrating wireless radio-frequency identification |
| 09/28/2011 | CN101542685B Methods to reduce the critical dimension of semiconductor devices and partially fabricated semiconductor devices having reduced critical dimensions |
| 09/28/2011 | CN101527300B 堆叠式集成电路与其制造方法 Stacked ICs and its manufacturing method |
| 09/28/2011 | CN101526706B Pixel structure of liquid crystal display |
| 09/28/2011 | CN101512755B Semiconductor device with capacitor and producing method thereof |
| 09/28/2011 | CN101510528B P-N junction diode structure of metal oxide semiconductor and method for producing the same |
| 09/28/2011 | CN101504940B Semiconductor package, and method of manufacturing semiconductor package |
| 09/28/2011 | CN101490831B Mounting method using thermocompression head |
| 09/28/2011 | CN101471344B Semiconductor device and its manufacture method and design method |
| 09/28/2011 | CN101465315B Integrated circuit structure and its forming method |
| 09/28/2011 | CN101459093B Method for verifying asymmetric high voltage field effect tube drifting region resistor |
| 09/28/2011 | CN101456150B Chemical mechanical polishing method |
| 09/28/2011 | CN101452805B Processing container and plasma processing device |
| 09/28/2011 | CN101447492B Semiconductor display device |
| 09/28/2011 | CN101432877B Method for forming a semiconductor device having a fin and structure thereof |
| 09/28/2011 | CN101425478B Method for providing self-alignment contact in semiconductor device set |
| 09/28/2011 | CN101404246B Epitaxial growth method for large scale InGaSb quantum point |
| 09/28/2011 | CN101401202B 选择性沉积 Selective deposition |
| 09/28/2011 | CN101378026B Wafer transmission sheet |
| 09/28/2011 | CN101356627B Enhanced multi-volatile memory device with resonant tunnel barrier |
| 09/28/2011 | CN101345251B Memory unit array on semiconductor substrate and its manufacture method |
| 09/28/2011 | CN101345212B Wafer dividing method |
| 09/28/2011 | CN101321893B Gas head and thin-film manufacturing device |
| 09/28/2011 | CN101308781B Semiconductor apparatus, thin film transistor substrate, display apparatus and method for making same |
| 09/28/2011 | CN101286444B Method for manufacturing an soi substrate |
| 09/28/2011 | CN101276805B Semiconductor encapsulation structure with electromagnetic interference shield function and manufacturing method thereof |
| 09/28/2011 | CN101261395B Liquid crystal display |
| 09/28/2011 | CN101246813B Substrate processing apparatus |
| 09/28/2011 | CN101221363B Lithographic apparatus and device manufacturing method |
| 09/28/2011 | CN101220244B High surface quality GaN wafer and method of fabricating same |
| 09/28/2011 | CN101215447B Composition for polishing |
| 09/28/2011 | CN101213654B Technique for forming contact insulation layers and silicide regions with different characteristics |
| 09/28/2011 | CN101203954B Semiconductor device and method for making the same |
| 09/28/2011 | CN101189625B Semiconductor device, method for manufacturing the same, and method for manufacturing antenna |
| 09/28/2011 | CN101188204B Semiconductor device and manufacturing method therefor |
| 09/28/2011 | CN101187776B Method for transferring self-assembled dummy pattern to substrate |
| 09/28/2011 | CN101174579B Method of fabricating semiconductor device having fine contact holes |
| 09/28/2011 | CN101140901B Method for manufacturing semiconductor device |
| 09/28/2011 | CN101131546B Wet etching solution |
| 09/28/2011 | CN101127119B Pattern detecting device and semiconductor detecting system |
| 09/28/2011 | CN101091257B Method and process intermediate for electrostatic discharge protection in flat panel imaging detectors |
| 09/28/2011 | CN101013138B System and method for detecting wafer |
| 09/28/2011 | CN101010793B Method for manufacturing an electric device with a layer of conductive material contacted by nanowire |
| 09/27/2011 | US8028208 Wireless radio frequency technique design and method for testing of integrated circuits and wafers |
| 09/27/2011 | US8027554 Thermo-optic phase shifter and method for manufacturing same |
| 09/27/2011 | US8027553 Connected body and optical transceiver module |
| 09/27/2011 | US8026991 Thin film transistor substrate |
| 09/27/2011 | US8026877 Element substrate and light-emitting device |
| 09/27/2011 | US8026613 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 09/27/2011 | US8026612 Semiconductor device and method of manufacturing semiconductor device |
| 09/27/2011 | US8026606 Interconnect layers without electromigration |
| 09/27/2011 | US8026605 Interconnect structure and method of manufacturing a damascene structure |
| 09/27/2011 | US8026596 Thermal designs of packaged gallium nitride material devices and methods of packaging |
| 09/27/2011 | US8026590 Die package and method of manufacturing the same |
| 09/27/2011 | US8026588 Method of wire bonding over active area of a semiconductor circuit |
| 09/27/2011 | US8026587 Semiconductor package including top-surface terminals for mounting another semiconductor package |
| 09/27/2011 | US8026584 Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof |
| 09/27/2011 | US8026583 Flip-chip module and method for the production thereof |
| 09/27/2011 | US8026577 Semiconductor apparatus having a triple well structure and manfacturing method thereof |
| 09/27/2011 | US8026572 Semiconductor device and method for manufacturing same |
| 09/27/2011 | US8026570 Semiconductor integrated circuit device having power switch controller with gate insulator thickness for controlling multiple power switches |
| 09/27/2011 | US8026568 Second Schottky contact metal layer to improve GaN Schottky diode performance |
| 09/27/2011 | US8026566 Semiconductor device and method for manufacturing semiconductor device |
| 09/27/2011 | US8026565 Thin film semiconductor device comprising nanocrystalline silicon powder |
| 09/27/2011 | US8026563 Spin transistor based on the spin-filter effect, and non-volatile memory using spin transistors |
| 09/27/2011 | US8026561 Spin MOSFET and reconfigurable logic circuit |