| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/25/2012 | CN102332487A Transplanting and sucking device of full-automatic solar cell testing and separation equipment |
| 01/25/2012 | CN102332474A InGaZnO (indium-gallium-zinc-oxide) Schottky diode device and manufacturing method thereof |
| 01/25/2012 | CN102332472A Integrated circuit using complementary junction field effect transistor and mos transistor in silicon and silicon alloys |
| 01/25/2012 | CN102332471A Semiconductor device and manufacturing method thereof |
| 01/25/2012 | CN102332470A Semiconductor device and manufacturing method of the same |
| 01/25/2012 | CN102332469A Longitudinally-conductive GaN (gallium nitride) normally-closed MISFET (metal integrated semiconductor field effect transistor) device and manufacturing method thereof |
| 01/25/2012 | CN102332463A Image sensor with insulating buried layer and fabrication method thereof |
| 01/25/2012 | CN102332460A Image sensor with insulating buried layer and manufacturing method thereof |
| 01/25/2012 | CN102332454A One-time programmable memory cell, memory and preparation method thereof |
| 01/25/2012 | CN102332453A Semiconductor devices and methods of fabricating the same |
| 01/25/2012 | CN102332452A Structure of TFT (thin film transistor) array and manufacturing method thereof |
| 01/25/2012 | CN102332451A Nano-wire stacked structure, formation method thereof and semiconductor layer patterning method |
| 01/25/2012 | CN102332448A System and method for providing alignment mark for high-k metal gate process |
| 01/25/2012 | CN102332447A Capacitor and forming method thereof |
| 01/25/2012 | CN102332445A Semiconductor device and method of manufacturing the same |
| 01/25/2012 | CN102332435A Electronic component and manufacturing method of same |
| 01/25/2012 | CN102332434A Semiconductor structure and method of forming devices |
| 01/25/2012 | CN102332433A Memorizer and formation method thereof |
| 01/25/2012 | CN102332432A Method for manufacturing semiconductor integrated device |
| 01/25/2012 | CN102332431A Semiconductor device structure and fabrication method thereof |
| 01/25/2012 | CN102332430A Fabrication method for flexible transparent 1T1R (one transistor/one resistor) based on fully low-temperature process |
| 01/25/2012 | CN102332429A Method for manufacturing damascene structure |
| 01/25/2012 | CN102332428A Method for manufacturing damascene structure |
| 01/25/2012 | CN102332427A Method for manufacturing first copper interconnection layer |
| 01/25/2012 | CN102332426A Manufacturing method of copper diffusion impervious layers for nanometer ICs (integrated circuits) |
| 01/25/2012 | CN102332425A Method for enhancing electromigration resistance property in copper interconnection technology |
| 01/25/2012 | CN102332424A Method for overcoming residue defect in shallow trench isolation (STI) process |
| 01/25/2012 | CN102332423A Process for reducing chemical-mechanical polishing crack on buried layer cavity silicon-on-insulator (SOI) wafer |
| 01/25/2012 | CN102332422A Device for grabbing and placing product formed after plastic package of integrated circuit |
| 01/25/2012 | CN102332421A Multipurpose series suction pen of solar battery |
| 01/25/2012 | CN102332420A Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc |
| 01/25/2012 | CN102332419A Method for stabilizing working clearance of non-contact sucking disc |
| 01/25/2012 | CN102332418A Conveying system of semiconductor wafers |
| 01/25/2012 | CN102332417A Rib cutting unloading structure |
| 01/25/2012 | CN102332416A Die for scraping off residual resin |
| 01/25/2012 | CN102332415A Fluid system, holding mechanism and intermediate support body |
| 01/25/2012 | CN102332414A Method and technology for miniaturizing film amplitude limiting LNA (low noise amplifier) |
| 01/25/2012 | CN102332413A Surface mounted technology (SMT) tin paste connecting process |
| 01/25/2012 | CN102332412A IC (integrated circuit) lead frame thrust unit before preheating |
| 01/25/2012 | CN102332411A Resin lift device |
| 01/25/2012 | CN102332410A Packaging method and structure of chip |
| 01/25/2012 | CN102332409A Integrated manufacturing equipment for semiconductor component and manufacturing method thereof |
| 01/25/2012 | CN102332408A Chip scale package and production method thereof |
| 01/25/2012 | CN102332407A Technology for manufacturing ceramic cofiring four-side lead flat package |
| 01/25/2012 | CN102332406A Manufacturing method for integrated circuit conductive adhesive pattern |
| 01/25/2012 | CN102332405A Intrinsic device fabrication process |
| 01/25/2012 | CN102332404A Method for manufacturing thin film transistor based on anodic oxidation insulating layer |
| 01/25/2012 | CN102332403A Semiconductor structure and manufacturing method thereof |
| 01/25/2012 | CN102332402A Methods of forming silicide regions and resulting mos devices |
| 01/25/2012 | CN102332401A Forming method of MOS (Metal Oxide Semiconductor) device |
| 01/25/2012 | CN102332400A Forming method of semiconductor device |
| 01/25/2012 | CN102332399A Chemically mechanical polishing method of ultra-low dielectric material |
| 01/25/2012 | CN102332398A Method for manufacturing two high-K gate dielectric/metal gate structures |
| 01/25/2012 | CN102332397A Method for manufacturing two high-K gate dielectric/metal gate structures |
| 01/25/2012 | CN102332396A Method for designing power vertical double-diffused metal-oxide-semiconductor field effect transistor (VDMOSFET) structure |
| 01/25/2012 | CN102332395A Method for selectively depositing gate oxides and gate electrodes |
| 01/25/2012 | CN102332394A Semiconductor device as well as MOS (metal oxide semiconductor) transistor and formation method thereof |
| 01/25/2012 | CN102332393A Diffusion method for prolonging minority carrier lifetime of battery plate in process of manufacturing solar battery |
| 01/25/2012 | CN102332392A Method for manufacturing silicon nanotubes |
| 01/25/2012 | CN102332391A Vacuum processing apparatus |
| 01/25/2012 | CN102332383A End point monitoring method for plasma etching process |
| 01/25/2012 | CN102331996A Statistical analysis method and substrate process system |
| 01/25/2012 | CN102331648A Electrophoretic display device and method for manufacturing the same |
| 01/25/2012 | CN102331428A Detection apparatus |
| 01/25/2012 | CN102329403A Polymer for forming resist protection film, composition for forming resist protection film, and method of forming patterns of semiconductor devices using the composition |
| 01/25/2012 | CN102328679A Rod unloading car |
| 01/25/2012 | CN102024726B Detection method and manufacturing method of MOS device |
| 01/25/2012 | CN102024691B Grid structure forming method |
| 01/25/2012 | CN101989551B Method for forming asymmetrical transistor |
| 01/25/2012 | CN101982870B Method for protecting chip in chip thinning process |
| 01/25/2012 | CN101958380B Solid crystal machine head bonding mechanism |
| 01/25/2012 | CN101958327B Monopolar CMOS (Complementary Metal Oxide Semiconductor) device and manufacture method thereof |
| 01/25/2012 | CN101937865B Method for forming groove |
| 01/25/2012 | CN101937863B Method for making metal wiring |
| 01/25/2012 | CN101930930B Method for forming Cr-Al-Cr metal routing on indium tin oxid glass substrate |
| 01/25/2012 | CN101930920B MOS (Metal Oxide Semiconductor) transistor and manufacture method thereof |
| 01/25/2012 | CN101928927B Device and method for implanting ions |
| 01/25/2012 | CN101924087B Inversed-chip lug structure and manufacturing process thereof |
| 01/25/2012 | CN101924011B Etching device and method |
| 01/25/2012 | CN101887874B Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
| 01/25/2012 | CN101882593B Method for improving breakdown voltage from N-well to another N-well |
| 01/25/2012 | CN101882569B Method for removing flash on lead wire and frame of diode or triode |
| 01/25/2012 | CN101866917B Active element array substrate and repair method thereof |
| 01/25/2012 | CN101853829B Semiconductor structure and manufacturing method thereof |
| 01/25/2012 | CN101853822B Novel heat sink and production method thereof |
| 01/25/2012 | CN101847675B Light-emitting diode chip with vertical structure and manufacturing method thereof |
| 01/25/2012 | CN101847622B Power chip with multi-stack package preformed vertical structure and manufacturing method thereof |
| 01/25/2012 | CN101847576B Method for preparing ultra-narrow groove |
| 01/25/2012 | CN101840887B Semi-conductor device and formation method thereof |
| 01/25/2012 | CN101840883B Forming method of copper film |
| 01/25/2012 | CN101834200B Organic RL display and fabricating method thereof |
| 01/25/2012 | CN101834133B Method for nitriding oxide film and plasma processing device |
| 01/25/2012 | CN101826467B Preparation method of thermal interface material |
| 01/25/2012 | CN101826458B Etching method and double-depth groove formation method |
| 01/25/2012 | CN101826123B Method for promoting chip finished product rate through increasing standard cell through hole |
| 01/25/2012 | CN101819951B Base plate, semiconductor packaging piece applying same and manufacture method of base plate |
| 01/25/2012 | CN101814481B No-pad lead frame structure and production method thereof |
| 01/25/2012 | CN101814444B Low-stress bottom filling method of laminating device |
| 01/25/2012 | CN101814424B Substrate disposing device and method thereof |
| 01/25/2012 | CN101800196B Adjustment method of bimetal gate work function |