Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2012
01/25/2012CN101800184B Packaging base plate with cave structure and manufacture method thereof
01/25/2012CN101796216B Production equipment and method of thin-film laminate
01/25/2012CN101794808B Resistance transit storage device and manufacture process thereof
01/25/2012CN101783332B Circuit board and preparation process thereof
01/25/2012CN101783323B CMOS (complementary metal-oxide-semiconductor) transistor and manufacturing method thereof
01/25/2012CN101783322B CMOS (complementary metal-oxide-semiconductor) transistor and manufacturing method thereof
01/25/2012CN101783318B Method and structure for reducing cross-talk in image sensor devices
01/25/2012CN101783315B Method for forming interlayer contact
01/25/2012CN101777517B Method for manufacturing memory
01/25/2012CN101777486B A hot wind type oven container and an oven having the same
01/25/2012CN101770976B Manufacturing method of connection hole
01/25/2012CN101770952B Metal oxide semiconductor field effect transistor and forming method thereof
01/25/2012CN101765906B Organic transistor, organic transistor array, and display device
01/25/2012CN101762993B Method for removing photoresist and method for manufacturing connecting hole
01/25/2012CN101752465B Packaging method of high-power light-emitting diode
01/25/2012CN101752402B Top emission type organic electro luminescent device and methode of fabricating the same
01/25/2012CN101752235B Method for forming and processing high-K gate dielectric layer and method for forming transistor
01/25/2012CN101740435B Front-opened wafer box for fixing wafer restriction part module in mode of rotating, butting style
01/25/2012CN101740432B Method for manufacturing semiconductor device
01/25/2012CN101740392B LDMOS (Laterally Diffused Metal Oxide Semiconductor) transistor, semiconductor device and manufacture method thereof
01/25/2012CN101740331B Method for nondestructively peeling GaN and sapphire substrate by solid laser
01/25/2012CN101730934B Isolated integrated circuit devices
01/25/2012CN101727098B Cycle time target measuring method and system
01/25/2012CN101726947B Array substrate for liquid crystal display device and manufacturing method thereof, liquid crystal display device having the same
01/25/2012CN101692433B Plasma etching machine and ejector pin thereof
01/25/2012CN101689531B Laser processing of light reflective multilayer target structure
01/25/2012CN101685767B Method for manufacturing wafer level image module and structure thereof
01/25/2012CN101681868B Wafer supporting glass
01/25/2012CN101661875B Equipment for de-encapsulation of BGA encapsulation
01/25/2012CN101657881B Wafer holding robot end processor vertical position determination in ion implanter system
01/25/2012CN101656230B Method of manufacturing thin film transistor array substrate
01/25/2012CN101645481B Method for fabricating a nitride semiconductor light-emitting device
01/25/2012CN101645457B Super-self-aligned trench-dmos structure and manufacture method thereof
01/25/2012CN101645413B Method for manufacturing metal connecting wire
01/25/2012CN101635250B Substrate structuring body removing method
01/25/2012CN101634805B Peripheral shading mask structure used for manufacturing semiconductor wafer and manufacturing method thereof
01/25/2012CN101630656B Methods for forming contact hole and dual damascene structure
01/25/2012CN101630654B Method for determining height of insulating layer in shallow trench
01/25/2012CN101622696B Substrate cleaning apparatus
01/25/2012CN101620980B Back-end process simulated substrate and method for forming same
01/25/2012CN101593706B Replacement module of die bonder
01/25/2012CN101577266B Monitoring and testing structure for plasma damage and evaluation method
01/25/2012CN101566668B Test handler, method for unloading packaged chips, method for transferring test trays
01/25/2012CN101562136B Method for flattening medium surface in heterojunction bipolar transistor (HBT) process
01/25/2012CN101551603B Method for patterning a photosensitive layer
01/25/2012CN101546186B Processing system and processing method of target output of machine tables
01/25/2012CN101542697B Methods of forming the same high-voltage bipolar-CMOS-DMOS integrated circuit devices and its module
01/25/2012CN101533792B Wafer level ic assembly method
01/25/2012CN101529338B Method of neutralizing developer waste liquid containing tetraalkylammonium hydroxide
01/25/2012CN101527174B Schottky type nuclear battery and preparation method thereof
01/25/2012CN101522361B Laser working method
01/25/2012CN101520654B Method for statistical process control of limit truncated production data and computer code
01/25/2012CN101496227B Novel integrated circuit support structures and the fabrication thereof
01/25/2012CN101477986B Fin field effect transistor and method of manufacturing the same
01/25/2012CN101465293B Method for etching dielectric layer of plasma
01/25/2012CN101459146B Semiconductor packages and method for manufacturing same
01/25/2012CN101459039B Terminal monitoring method for plasma body etching
01/25/2012CN101457048B Conductive pattern forming ink, conductive pattern, and wiring substrate
01/25/2012CN101442034B Bonding pad and method for forming the same
01/25/2012CN101441996B Method for forming and etching hard mask layer
01/25/2012CN101414549B Substrate cleaning apparatus
01/25/2012CN101410224B Double side wafer grinder and methods for assessing workpiece nanotopology
01/25/2012CN101407910B Film forming device for processing semiconductor
01/25/2012CN101388401B Diode driving resistor conversion memory cell and manufacturing method thereof
01/25/2012CN101359678B Image display system and preparation thereof
01/25/2012CN101356653B Photo field effect transistor and integrated photo detector using the same
01/25/2012CN101327572B Technique for thinning back side of silicon wafer
01/25/2012CN101315872B Apparatus and method for thermally treating wafer
01/25/2012CN101310373B Method of mounting electronic circuit constituting member
01/25/2012CN101309782B Robotic device
01/25/2012CN101252122B mems package for system of air-tight device and wafer-class detection
01/25/2012CN101241848B Method for manufacturing semiconductor device
01/25/2012CN101211970B Semiconductor device and producing method thereof
01/25/2012CN101211766B Method of ion implantation and method of fabricating a semiconductor device
01/25/2012CN101211763B Apparatus for adsorbing metal and method for the same
01/25/2012CN101188219B Liquid crystal display device drive circuit and manufacture method and display device possessing same
01/25/2012CN101156234B Method for nitriding substrate and method for forming insulating film
01/25/2012CN101154629B Semiconductor device and method of fabricating the same
01/25/2012CN101133181B Method for producing a target
01/25/2012CN101118843B Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
01/25/2012CN101083206B Apparatus and method for processing substrate
01/25/2012CN101079391B Method for semiconductor part with high clearance filling capability
01/25/2012CN101044626B Method for forming gate insulating film, semiconductor device and computer recording medium
01/25/2012CN101030042B Lithographic apparatus and device manufacturing method
01/25/2012CN101009245B Method for fabricating semiconductor device
01/24/2012US8103980 Beam dose computing method and writing method and record carrier body and writing apparatus
01/24/2012US8103976 Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same
01/24/2012US8103140 Interferometric fiber optic gyroscope with silicon optical bench front-end
01/24/2012US8103025 Surface mountable transducer system
01/24/2012US8102502 Lithographic apparatus and device manufacturing method
01/24/2012US8102486 Display panel and display device
01/24/2012US8102456 CCD array with integrated high voltage protection circuit
01/24/2012US8102335 Image display screen and method for controlling said screen
01/24/2012US8102061 Semiconductor device bonding wire and wire bonding method
01/24/2012US8102051 Semiconductor device having an electrode and method for manufacturing the same
01/24/2012US8102044 Bonded wafer structure and method of fabrication
01/24/2012US8102043 Stacked integrated circuit and package system and method for manufacturing thereof
01/24/2012US8102041 Integrated circuit package
01/24/2012US8102040 Integrated circuit package system with die and package combination
01/24/2012US8102032 System and method for compartmental shielding of stacked packages