Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/02/2012CN102437050A Substrate processing apparatus and substrate processing method
05/02/2012CN102437049A Method for simplifying double pattern exposure process of side wall definition
05/02/2012CN102437048A Method and device for improving etching of through holes in double-through-hole etching stop layer crossover region
05/02/2012CN102437047A Shallow trench isolation (STI) structure chemical mechanical polishing (CMP) method and STI structure manufacture method
05/02/2012CN102437046A Common manufacturing process of metal silicide barrier layer and stress memory layer
05/02/2012CN102437045A Wet etching method and wet etching equipment
05/02/2012CN102437044A Polysilicon alkaline wool making method
05/02/2012CN102437043A Method for removing polished section crystal round edge used for IGBT (insulated gate bipolar transistor) in a row grinding manner
05/02/2012CN102437042A Method for producing crystalline-state high-K gate dielectric material
05/02/2012CN102437041A Method for forming high-order electric constant K and T-shaped metal grid
05/02/2012CN102437040A Method for preparing hafnium lanthanum oxide (HfLaO) high-dielectric gate dielectric film
05/02/2012CN102437039A Method for forming side wall by uniformly depositing silicon nitride
05/02/2012CN102437038A Method for producing ohmic contact on surface of semiconductor
05/02/2012CN102437037A Method for effectively reducing water mark defects
05/02/2012CN102437036A Gate etching method capable of enhancing performance of floating body dynamic random access memory unit
05/02/2012CN102437035A Method for removing excess nickel after forming nickel silicide
05/02/2012CN102437034A Method for forming nickel silicide blocking layer
05/02/2012CN102437033A Method for avoiding damaging shallow trench isolation in high-dielectric-constant metal gate technique
05/02/2012CN102437032A Manufacture method of metal gates in gate-post process
05/02/2012CN102437031A Preparation method of intermediate band material based on ultrafast laser doping
05/02/2012CN102437030A Method for forming dual-depth isolation channels through P type ion injection
05/02/2012CN102437029A Method for improving source/drain dopant ion implantation mode
05/02/2012CN102437028A PMOS (p-channel metal-oxide-semiconductor field-effect transistor) source/drain region ion implantation method and corresponding device manufacturing method
05/02/2012CN102437027A Application of amorphous carbon layer to serving as sacrificial layer during ion implantation
05/02/2012CN102437026A Groove etching method and semiconductor device manufacturing method
05/02/2012CN102437025A Method for eliminating negative bias temperature instability (NBTI) influence on PMOS (p-channel metal-oxide-semiconductor field-effect transistor)
05/02/2012CN102437024A Method for manufacturing multilayer metal-silicon oxide-metal (MOM) capacitor
05/02/2012CN102437023A Method for manufacturing multilayer metal-oxide-metal capacitor
05/02/2012CN102437022A Method for manufacturing multilayer metal-oxide-metal (MOM) capacitor
05/02/2012CN102437021A Cleaning method in chemical mechanical polishing
05/02/2012CN102437020A Control wafer and forming method thereof
05/02/2012CN102437019A Manufacturing method of uniaxial strain SGOI (SiGe-on-Insulator) wafer on SiN buried insulating layer based on mechanical bending table
05/02/2012CN102437018A Baking method and equipment for improving critical dimension uniformity in etched wafer
05/02/2012CN102437017A Method for preparing nano structure on surface of (111) silicon wafer
05/02/2012CN102437016A Integration method for realizing capacitors with two different insulating layer thicknesses
05/02/2012CN102437015A Method for increasing metal-insulating layer-metal (MIM) capacitor density in semiconductor device and structure thereof
05/02/2012CN102437014A Wet etching cleaning device
05/02/2012CN102437013A Built-in wafer cleaning device for chemical mechanical polishing (CMP) machine table
05/02/2012CN102437012A Improved dry-process etching cavity
05/02/2012CN102436136A Synthetic quartz glass substrate and making method
05/02/2012CN102436104A Pixel structure and method for manufacturing pixel structure
05/02/2012CN102436095A Manufacturing method of transmission-type silicon-based liquid crystal display
05/02/2012CN102435307A Detection method of UV (Ultraviolet) illumination of multi-layer UV hot oven in TFT-LCD (Thin Film Transistor-Liquid Crystal Display) manufacturing process and combined disk extraction device for implementing detection method
05/02/2012CN102433546A Film formation method and film formation apparatus
05/02/2012CN102432806A Viscoelastic body and method for manufacturing the same
05/02/2012CN102082080B Electron radiation processing method for chips of semiconductor element
05/02/2012CN101978480B Multilayer wiring, semiconductor device, substrate for display and display
05/02/2012CN101969023B Method for making step growth MgxZn1-xO thin film on silicon substrate
05/02/2012CN101939842B Semiconductor device manufacturing method
05/02/2012CN101930989B Phase-change memory and method of making same
05/02/2012CN101919034B Apparatus for forming semiconductor wafer protection film
05/02/2012CN101877333B Multilayer packaging substrate, manufacture method thereof, and packaging structure of light-emitting semiconductor
05/02/2012CN101872778B Integrated circuit 3d phase change memory array and manufacturing method
05/02/2012CN101866371B Verification method of stereoscopic integrated circuit
05/02/2012CN101859740B Advanced quad flat non-leaded package and manufacturing method thereof
05/02/2012CN101859713B Advanced quad flat non-leaded package and manufacturing method thereof
05/02/2012CN101859704B Preparation method of high-temperature and high-power field effect transistor
05/02/2012CN101849282B Semiconductor structures having improved contact resistance
05/02/2012CN101847571B Protective tape separating method and protective tape separating apparatus using the same
05/02/2012CN101834150B High-heat-dispersion spherical array encapsulation method
05/02/2012CN101834120B Shower head and plasma processing apparatus
05/02/2012CN101800230B Charge detection device and charge detection method, solid-state imaging device and driving method thereof, and imaging device
05/02/2012CN101800176B Film deposition method and manufacturing method of semiconductor device
05/02/2012CN101790777B Preparation method of electroconductive copper patterning layer by laser irradiation
05/02/2012CN101790774B Recrystallization of semiconductor wafers in a thin film capsule and related processes
05/02/2012CN101764050B Processing device of semiconductor substrate
05/02/2012CN101743634B Storage element and memory
05/02/2012CN101704452B Roller device driving mechanism
05/02/2012CN101685810B Clip for semiconductor components package, semiconductor packaging structure and method
05/02/2012CN101673715B Method for manufacturing shallow junction complementary bipolar transistor
05/02/2012CN101652715B Photosensitive resin composition and layered product
05/02/2012CN101630664B Silver based bonding wire and preparation method thereof
05/02/2012CN101615566B Substrate processing apparatus
05/02/2012CN101611479B Gallium nitride epitaxial crystal, method for production thereof, and field effect transistor
05/02/2012CN101610644B Surface plating technology of circuit base plate
05/02/2012CN101548378B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/02/2012CN101546718B Semiconductor device package and method of making a semiconductor device package
05/02/2012CN101523574B Plasma oxidizing method and plasma processing apparatus
05/02/2012CN101465323B Method for manufacturing a semiconductor device capable of preventing the decrease of the width of an active region
05/02/2012CN101454889B Formation of improved soi substrates using bulk semiconductor wafers
05/02/2012CN101454880B Plasma cvd method, method for forming silicon nitride film, method for manufacturing semiconductor device and plasma cvd device
05/02/2012CN101447426B Plasma etching method
05/02/2012CN101447407B Method for cutting protective tape of semiconductor wafer and protective tape cutting device
05/02/2012CN101401198B Electrostatic attraction apparatus for glass substrate and method for attracting and releasing such glass substrate
05/02/2012CN101393916B Method of forming a high capacitance diode and structure therefor
05/02/2012CN101385128B Substrate processing apparatus, substrate processing method
05/02/2012CN101373782B Semiconductor device and manufacturing method thereof
05/02/2012CN101367190B Interconnected-multi-element-lattice polishing pad
05/02/2012CN101364546B FET device with stabilized threshold modifying material and method thereof
05/02/2012CN101330109B Semiconductor component with buffer layer
05/02/2012CN101278387B Amine-free deposition of metal-nitride films
05/02/2012CN101261966B Semiconductor device and method of manufacturing same
05/02/2012CN101218664B Method for cutting workpiece
05/02/2012CN101202151B Integrated passive devices with high Q inductors
05/02/2012CN101180738B Asymmetric high voltage devices and method of fabrication
05/02/2012CN101116179B Producing SiC packs on a wafer plane
05/02/2012CN101055433B Heating treatment device
05/02/2012CN101055422B Integrated measuring room for transparent base material
05/01/2012US8171434 Method for dimension conversion difference prediction, method for manufacturing photomask, method for manufacturing electronic component, and program for dimension conversion difference prediction
05/01/2012US8171433 Method of calculating pattern-failure-occurrence-region, computer program product, pattern-layout evaluating method, and semiconductor-device manufacturing method
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