Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/02/2012CN102437164A Wide band gap complementary metal oxide semiconductor (CMOS) structure on insulator and preparation method thereof
05/02/2012CN102437163A CMOS (Complementary Metal Oxide Semiconductor) structure of wide forbidden band material on insulator and preparation method thereof
05/02/2012CN102437161A Splitting grid memory cell and operation method thereof
05/02/2012CN102437159A Three-terminal self-feedback linear galvanostat and manufacturing method thereof
05/02/2012CN102437158A Complementary metal oxide semiconductor (CMOS) device and manufacturing method thereof
05/02/2012CN102437157A CMOS (complementary metal oxide semiconductor) device capable of implementing multistage working voltage by single-thickness gate oxide layer and preparation method thereof
05/02/2012CN102437156A Ultralow capacitance transient voltage suppression device and manufacturing method thereof
05/02/2012CN102437155A High working voltage light emitting diode (LED) protection diode and structure thereof and corresponding manufacturing method
05/02/2012CN102437147A Dense-pitch small-pad copper-line bonded intelligent card (IC) chip stacking packing piece and preparation method thereof
05/02/2012CN102437145A Self-formed gradient Zr/ZrN double layer diffusion barrier layer and preparation method thereof
05/02/2012CN102437144A Ruthenium (Ru)-ruthenium oxide(RuO)/ ruthenium(Ru)-germanium(Ge)-copper(Cu) self-formed double-layer amorphous diffusion barrier layer and preparation method thereof
05/02/2012CN102437143A Low dielectric constant material
05/02/2012CN102437142A Metal interconnecting structure for reducing resistance of through hole and forming method thereof
05/02/2012CN102437141A Dense-pitch small-pad copper-wire bonded single intelligent card (IC) chip packing piece and preparation method thereof
05/02/2012CN102437140A Power semiconductor module having sintered metal connections and production method
05/02/2012CN102437139A Semiconductor package and method for manufacturing the same
05/02/2012CN102437138A Semiconductor device
05/02/2012CN102437136A Bonding alloy wire and production technology thereof
05/02/2012CN102437134A Ultra-small packing body and production method thereof
05/02/2012CN102437132A Heat radiating device and manufacturing method thereof
05/02/2012CN102437130A Semiconductor device and producing method thereof
05/02/2012CN102437129A Localized SOI (Silicon-On-Insulator) and GOI (Germanium On Insulator) device structure and process integrating method thereof
05/02/2012CN102437128A Method for programming low-voltage quick non-volatile memory
05/02/2012CN102437127A One-transistor dynamic random access memory (DRAM) unit based on silicon-germanium silicon heterojunction, and method for preparing one-transistor DRAM unit
05/02/2012CN102437126A Single-transistor DRAM (dynamic random access memory) unit based on source heterojunction and preparation method thereof
05/02/2012CN102437125A Method for improving writing speed of floating body effect storage unit, and floating body effect storage unit
05/02/2012CN102437124A Method for increasing writing speed of floating body effect storage unit and semiconductor device
05/02/2012CN102437123A Implantation method and structure capable of enhancing writing speed of floating body dynamic random access memory unit
05/02/2012CN102437122A Method for increasing hole mobility and semiconductor device manufacturing method
05/02/2012CN102437121A Method for effectively reducing influence of through hole etching stopping layer strain process to PMOS (P-channel Metal Oxide Semiconductor)
05/02/2012CN102437120A Method for improving source/drain (SD) ultrashallow junction
05/02/2012CN102437119A Method for improving effect of stress memory technology
05/02/2012CN102437118A Making method of transistor with metal grid
05/02/2012CN102437117A Novel process for integrating silicide and metal foredielectric and forming structure thereof
05/02/2012CN102437116A Technique integrating method capable of effectively reducing area of electrostatic discharge (ESD) protective circuit
05/02/2012CN102437115A Graded metal oxide resistance based semiconductor memory device
05/02/2012CN102437114A Manufacturing method of thin film transistor substrate
05/02/2012CN102437113A Repairing method of signal disconnection of active matrix organic light-emitting display array substrate
05/02/2012CN102437112A Method for repairing pixel circuit of active matrix organic light emitting display substrate
05/02/2012CN102437111A Method and device for quickly forming arc for leading wire by using wire clamp to manufacture salient points
05/02/2012CN102437110A Method for producing graphene vertical interconnection structure
05/02/2012CN102437109A Semiconductor structure and manufacturing method thereof
05/02/2012CN102437108A Manufacturing method of copper interconnection structure capable of reducing block resistance
05/02/2012CN102437107A Method for manufacturing integrated circuit with super-thick top-layer metal and integrated circuit
05/02/2012CN102437106A Method for improving repeatability of multi-time photoetching on contact hole/through hole
05/02/2012CN102437105A Method for producing integrated circuit having partial redundant through holes and integrated circuit
05/02/2012CN102437104A Manufacturing method of integrated circuit having a portion of redundant through holes and integrated circuit
05/02/2012CN102437103A Method for manufacturing integrated circuit with partially-redundant through holes and integrated circuit
05/02/2012CN102437102A Method of and apparatus for active energy assist baking
05/02/2012CN102437101A Improved method for integrating hard mask and porous material with low dielectric constant value
05/02/2012CN102437100A Method for simultaneously forming copper contact hole and first metal layer by dual damascene technique
05/02/2012CN102437099A Forming method of contact hole structure for reducing resistance of contact hole
05/02/2012CN102437098A Forming method of contact hole for reducing contact resistance
05/02/2012CN102437097A Novel manufacturing method of contact hole
05/02/2012CN102437096A Manufacture method for reducing contact resistance of contact hole
05/02/2012CN102437095A Technique integrating method for double etching barrier layer technology
05/02/2012CN102437094A Method for improving etching of through holes in double-through-hole etching stop layer crossover region
05/02/2012CN102437093A Novel method for silicon carbide film preparation capable of avoiding light resistance poisoning
05/02/2012CN102437092A Semiconductor through hole forming method
05/02/2012CN102437091A Copper subsequent interconnection technique using metallic copper alloy as etching barrier layer
05/02/2012CN102437090A Copper back channel interconnecting process without metal blocking layer
05/02/2012CN102437089A Copper subsequent interconnection technique
05/02/2012CN102437088A Semiconductor structure and manufacture method thereof
05/02/2012CN102437087A SOI structure with reinforced anti-irradiation performance and manufacturing method thereof
05/02/2012CN102437086A Manufacturing method of mechanical uniaxial strain GeOI (germanium-on-insulator) wafer based on SiN buried insulating layer
05/02/2012CN102437085A Manufacturing method of mechanical uniaxial strain SOI (silicon-on-insulator) wafer
05/02/2012CN102437084A Method for adjusting thickness of oxide film on shallow trench isolation (STI) underlayer
05/02/2012CN102437083A Method for reducing critical dimension loss of high aspect ratio process filling shallow isolation trench
05/02/2012CN102437082A Method for improving filling performance in ultra-high depth-to-width ratio shallow trench isolation (STI) process
05/02/2012CN102437081A Method for forming dual-depth isolation channels through N type ion injection
05/02/2012CN102437080A Hand-held suction pen free of charging
05/02/2012CN102437079A Disk clamping device
05/02/2012CN102437078A Method and device for reducing deviation rate of cell when conveying solar cell through mesh belt
05/02/2012CN102437077A Equipment for linearly transmitting organic light-emitting diode (OLED) substrate
05/02/2012CN102437076A Substrate delivery device
05/02/2012CN102437075A Base plate treatment device
05/02/2012CN102437074A Pellicle container kit
05/02/2012CN102437073A Apparatus for manufacturing semiconductor devices
05/02/2012CN102437072A Method and system for scanning and scheduling wafer defects
05/02/2012CN102437071A Vertical heat treatment apparatus
05/02/2012CN102437070A Vertical-type heat treatment apparatus
05/02/2012CN102437069A Method and device for monitoring pretreatment in low-dielectric-constant barrier layer process
05/02/2012CN102437068A Hole measurement pattern and hole measurement method
05/02/2012CN102437067A Line width measuring method
05/02/2012CN102437066A High-reliability wafer-level columnar bump packaging method
05/02/2012CN102437065A High-reliability chip scale packaging method
05/02/2012CN102437064A Manufacturing method of silicon Nano-wire (SiNW)
05/02/2012CN102437063A Manufacturing method of flip chip with liquid salient points
05/02/2012CN102437062A Parameter optimization method and system in sparking ball formation technique
05/02/2012CN102437061A Electronic component and packaging method thereof
05/02/2012CN102437060A Method for producing tunneling field effect transistor of U-shaped channel
05/02/2012CN102437059A Preparation method for top-gate self-aligned zinc oxide thin film transistor
05/02/2012CN102437058A Manufacturing method of PMOS (P-channel Metal Oxide Semiconductor) device
05/02/2012CN102437057A Method for reducing semiconductor device hot carrier injection damage
05/02/2012CN102437056A Method for parasitizing vertical plug and play (PNP) tube in complementary metal oxide semiconductor process
05/02/2012CN102437055A Production method for squashed patch plastic package diode based on axial diode production line
05/02/2012CN102437054A Manufacturing method of wafer-level uniaxial strain silicon germanium on insulater (SGOI)
05/02/2012CN102437053A Method to increase the compressive stress of PECVD silicon nitride films
05/02/2012CN102437052A Method for forming silicides
05/02/2012CN102437051A Silicide stop layer etching method and through-hole etching stop layer forming method
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