Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
05/2010
05/26/2010CN201485521U Continuous electroplating device for lead frame of integrated circuit
05/26/2010CN1788117B Water-permeable drum for the hydrodynamic needling of webs of textile materials, and method for the production of said drum
05/26/2010CN1649676B Minimizing whisker growth in tin electrodeposits
05/26/2010CN101713090A Plating pretreatment apparatus and method for cylinder block
05/26/2010CN101713088A Electroplating method of integrated circuit lead frame
05/26/2010CN101070602B Electrochemical method and equipment used for electrochemical method
05/25/2010US7722747 Method and apparatus for fluid processing a workpiece
05/25/2010US7722724 Methods for substrate processing in cluster tool configurations having meniscus application systems
05/19/2010CN201473617U Conduction lifting frame and aluminum foil electro-plating device employing same
05/19/2010CN101711095A Copper-plating hole-filling process of HDI flexible printed circuit
05/19/2010CN101708535A Continuously-cast crystallizer copper liner
05/19/2010CN101265549B Foam iron-nickel composite metal material and preparation method thereof
05/19/2010CN101260554B Metal foil band electroplating system and application thereof
05/19/2010CN101220498B Multiple-grooved type coil stock continuously plating product line frame
05/14/2010WO2010022824A3 Device and method for the wet processing of different substrates
05/13/2010US20100120191 increase durability by including a carbonate in organic compound layer contains a phenanthroline compound; emit light with high luminance and high efficiency
05/13/2010US20100116671 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
05/13/2010US20100116669 Self-cleaning superhydrophobic surface
05/13/2010US20100116668 Material system and method for producing the same
05/13/2010US20100116528 Printed circuit board with multiple metallic layers and method of manufacturing the same
05/12/2010CN201462223U Compressed natural gas high pressure steel tube for automobile
05/12/2010CN201459271U Clamp for electroplating wafer
05/12/2010CN201459263U Air-holding chromium plating device with carbon brushes
05/12/2010CN201459188U Thermal-treatment equipment of steel wire for rubber hose reinforcement by water quenching on brass plating production line
05/12/2010CN1981565B Flexible printed wiring board terminal part or flexible flat cable terminal part
05/12/2010CN1974871B Double titanium-base anode voltage controlling system for continuous strip steel galvanizing electrobath
05/11/2010US7714598 Contact carriers (tiles) for populating larger substrates with spring contacts
05/06/2010WO2009134732A3 Open pore ceramic matrix foams coated with metal or metal alloys and methods of making same
05/06/2010US20100112372 Component having a ceramic base the surface of which is metalized
05/06/2010US20100110144 Applying a Layer to a Nozzle Outlet
05/06/2010US20100108525 Light-induced plating
05/06/2010DE102008053621A1 Light-induced pulsed electroplating to reinforce front metal contacts of solar cells, varies potential, irradiation and current density periodically
05/05/2010EP2182093A1 Metal material, method for producing the same, and electrical electronic component using the same
05/05/2010CN201447511U Shielding material compound manufacturing device with precise temperature measurement
05/05/2010CN201447510U Improved composite shielding material manufacturing equipment
05/05/2010CN201447509U Improved composite shielding material manufacturing equipment
05/05/2010CN201447508U Double-reel continuous electrodeposition thickening device
05/05/2010CN1946879B Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom
05/05/2010CN1804146B 电镀装置及电镀方法 Plating apparatus and plating method
05/05/2010CN1680631B Electrolysis treating method and apparatus
05/05/2010CN101701348A Coarsening solution for electroplating pretreatment on surface of semiconductor N\P type cooling wafer and related electroplating pretreatment process
05/05/2010CN101701347A Conduction state adjustment method of horizontal electroplating bath conducting roller and band steel
05/05/2010CN101700645A Horizontal type plating tank electric-conducting on-line honing method
04/2010
04/29/2010DE102008043125A1 Bedienelement für ein Haushaltsgerät Control for a home appliance
04/28/2010EP2054227B1 Method for the production of a composite product with selective electroplating
04/28/2010CN201442985U Steel-cord plating and waste-water utilizing device
04/28/2010CN201442984U Plate cylinder with electro-galvanized separation blade
04/28/2010CN1742119B 电镀方法 Electroplating method
04/27/2010US7704368 immersing wafer in plating bath, applying voltage, passing electrical current through bath; improved gap fill and reduced intrinsic defects
04/27/2010US7704367 electroplating; movable electrodes; as anode moves over wafer, electric current is applied through meniscus between anode and wafer
04/22/2010WO2010001054A3 Method of preparing an electrical insulation film and application for the metallization of through-vias
04/22/2010US20100097696 Sheet glass for microscopy and manufacturing method thereof
04/22/2010US20100096272 Processing technique for hard pure gold accessories
04/22/2010US20100096271 Copper Anode or Phosphorous-Containing Copper Anode, Method of Electroplating Copper on Semiconductor Wafer, and Semiconductor Wafer with Low Particle Adhesion
04/21/2010EP2177641A1 Steel plate having a galvanized corrosion protection layer
04/21/2010EP2176447A1 A microporous layer for lowering friction in metal-forming processes
04/21/2010CN201439816U Piston ring with nitration layer and chromium-ceramic composition plating layer
04/21/2010CN1934293B Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display using the surface-treated copper
04/21/2010CN1707759B Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
04/21/2010CN1701137B Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conducti
04/21/2010CN101697666A Circuit board plating device and method
04/21/2010CN101696513A Cathode contact for mandril of pull coating machine
04/21/2010CN101695978A Guide device in vertical type loop
04/20/2010US7700485 Electro- and electroless plating of metal in the manufacture of PCRAM devices
04/15/2010US20100092865 Carbon composite materials and process for production thereof
04/15/2010US20100089758 Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film
04/14/2010EP2175052A1 Process for producing electronic component, and electronic component produced by the process
04/14/2010EP2173928A1 Plant and process for the electrolytic tinning of steel strips, using an insoluble anode
04/14/2010EP2173927A2 Equipment and method for electrolytic tinning of steel strips using a non soluble anode
04/14/2010CN201437480U Wirerope supporting device
04/14/2010CN1969065B Device and method for electrolytically treating flat work pieces
04/14/2010CN101694004A Plating process of extruded sections of cooling fins
04/14/2010CN101280446B Research experiment system for silicon chip electroplating
04/13/2010US7695605 Tin plating method
04/08/2010WO2009141551A3 Electroplating composition and process for coating a semiconductor substrate using said composition
04/08/2010US20100084275 Copper electrolytic solution and two-layer flexible substrate obtained using the same
04/07/2010EP2173012A1 Fretting-resistant connector and process for manufacturing the same
04/07/2010EP2171130A2 Method of providing a metallic coating layer and substrate provided with said coating layer
04/07/2010EP2170647A2 Metal pin for assembly of a headrest with a tin coating
04/07/2010CN201436308U Surface tin plating device for conductor wire and the like
04/01/2010WO2010035570A1 Rolling sliding member and process for producing same
04/01/2010WO2010034511A2 Hydraulic cylinder and method for production thereof
04/01/2010US20100078330 Apparatus and method for manufacturing plated film
04/01/2010US20100078328 Electrochemical co-deposition of sol-gel films
04/01/2010DE102005060235C5 Systemteil und Verchromungsverfahren Part of the system and chrome plating
03/2010
03/31/2010EP2169706A1 Method and apparatus for processing wafer surfaces
03/31/2010EP2169093A1 Metal material for electrical electronic component
03/31/2010EP2167223A2 Unit and method for the electrolytic tinning of steel bands
03/31/2010CN201433247Y Copper foil surface processor
03/31/2010CN101689720A Fretting-resistant connector and process for manufacturing the same
03/31/2010CN101688321A Metal films, methods for production thereof, methods for production of laminated electronic components, and laminated electronic components
03/31/2010CN101688312A Metal material, method for producing the same, and electrical electronic component using the same
03/31/2010CN101687239A Device for treating a band-shaped substrate with a liquid
03/30/2010US7687738 Wire for high-speed electrical discharge machining
03/30/2010US7686927 Methods and apparatus for controlled-angle wafer positioning
03/25/2010WO2010012955A3 Formation of a transparent conductive oxide film for use in a photovoltaic structure
03/25/2010DE102006016305B4 Vorrichtung zum Aufbringen von galvanischen Überzügen auf kleine Werkstücke Apparatus for applying the galvanic coatings on small workpieces
03/24/2010CN201428001Y Novel conducting roller device
03/24/2010CN101682135A Connector and metallic material for connector
03/24/2010CN101681729A Silver-coated material for movable contact component and method for manufacturing such silver-coated material
1 ... 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 ... 122