Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
09/2010
09/15/2010CN1938456B Copper foil and its manufacturing method
09/15/2010CN101835991A Abrasion resistance reinforcing method and sliding structure
09/15/2010CN101829401A Implanted bioelectrode based on photoetching and other micro-nano manufacturing technologies and preparation method thereof
09/14/2010US7794578 Uniform thickness; reacting a nickel compound and sulfamic acid in presence of phosphoric acid
09/14/2010US7794573 Systems and methods for electrochemically processing microfeature workpieces
09/09/2010US20100224501 Plating methods for low aspect ratio cavities
09/09/2010DE102007051399B4 Bedienelement Control element
09/08/2010CN201574209U Rack for microelectronic frame plating
09/08/2010CN201574204U Titanium bar moving and positioning mechanism of electroplating device
09/08/2010CN201574203U Punching tubesheet used for copper-coated titanium fence
09/08/2010CN1898415B Silver-coated stainless strip for movable contact and method for production thereof
09/08/2010CN101827958A Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit substrate
09/08/2010CN101827957A Metal covered polyimide composite, process for producing the composite, and apparatus for producing the composite
09/08/2010CN101826675A Material for shell of connector and preparation method thereof
09/08/2010CN101824639A Anode of electrodeposition device for recovery of lead-acid battery and manufacturing method thereof
09/08/2010CN101824638A Method for electrochemically depositing copper-zinc-tin-selenium semiconductor thin film material
09/08/2010CN101824634A Process for manufacturing circuit board
09/08/2010CN101824558A Methods for preparing strip-like foamed resin substrate and porous metallic material
09/08/2010CN101203627B Capsule element with tin as main constituent, capsule forming method and solder processing method
09/07/2010US7790359 when the sealing rubber is pressed the thin negative resist layer bends because it is made from a flexible resin and capillary phenomenon occurs ao sealing rubber is elastically deformed when entering the plating pattern; thus plating solution does not leak; electrode on semiconductor wafer
09/07/2010US7790269 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
09/07/2010US7790009 electrochemical pattern replication; master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating; for micro or nanostructure; sensors, flat panel display and printed circuit boards
09/02/2010WO2010080946A3 Non-stick articles
09/02/2010US20100221432 Substrate processing method and apparatus
09/02/2010US20100219738 Process for Improving the Oxidation Resistance of Carbon Nanotubes
09/01/2010EP2224034A1 Method for manufacturing a body featuring very high mechanical properties, forming by drawing from a rolled steel sheet, in particular hot rolled and coated sheet
09/01/2010EP2222896A2 Prevention of substrate edge plating in a fountain plating process
09/01/2010CN201567380U Automatic electroplating producing system of printing roller
09/01/2010CN1737207B Electroplating head and method for operating the same
09/01/2010CN101821431A Process for producing electronic component, and electronic component produced by the process
09/01/2010CN101817967A Electroplating ABS composite and preparation method thereof
09/01/2010CN101817128A Aluminum-based brazing filler metal with low melting point and preparation method thereof
09/01/2010CN101024890B Wire material electroplating or pretreating heating technology
08/2010
08/26/2010WO2010095658A1 Microcrystalline-to-amorphous gold alloy and plated film, and plating solution for those, and plated film formation method
08/26/2010WO2010094998A1 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
08/26/2010US20100216302 Lead-free tin alloy electroplating compositions and methods
08/26/2010DE112008002725T5 Verfahren und Vorrichtung zum Versorgen mit elektrischem Strom Method and device for supplying electric current
08/25/2010CN201559376U Automatic imposing stone
08/25/2010CN101812711A Plating apparatus
08/25/2010CN101812710A Diamond wire saw production method of surface modified diamond
08/25/2010CN101812709A Anti-hydrogen embrittlement electroplating process of piston rod of vehicle shock absorber
08/25/2010CN101812708A Method for plating chromium on molybdenum core rod
08/25/2010CN101343768B Functional end face chromium plating method for piston ring and special jig
08/19/2010WO2010093009A1 Metal foil, method for producing same, insulating substrate, and wiring board
08/19/2010WO2010092579A1 A process for electroplating of copper
08/19/2010US20100206737 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
08/19/2010DE102009008931A1 Verfahren zur Herstellung eines Beschlages, eines Seitengitters oder eines Gargutträgers für Hochtemperaturanwendungen und metallisches Bauteil Process for the preparation of a fitting, a side lattice of a food support or for high temperature applications and metallic component
08/18/2010CN201553801U Surface drying device of air knife for electroplating pipes and wires
08/18/2010CN201552258U Bar shearing and electric plating machine
08/18/2010CN1638604B Method and device for contactless treatment of flat objects in through type treatment equipment
08/18/2010CN1638603B Method and device for treating flat objects in through type treating apparatus
08/18/2010CN101809695A Silver-clad composite material for movable contacts and process for production thereof
08/18/2010CN101809206A Copper foil for printed circuit and copper clad laminate
08/18/2010CN101195208B Production method of plating diamond tool with glass hard high-wearing feature
08/18/2010CN101128623B Method for making ceramic electronic part, and plating bath
08/18/2010CN101023204B Plating apparatus
08/12/2010US20100200408 Method and apparatus for the solution deposition of high quality oxide material
08/11/2010EP2216427A1 Copper foil for printed circuit and copper clad laminate
08/11/2010EP2216426A1 Tin-plated material for electronic part
08/11/2010EP2214735A1 Calcium phosphate coated stents comprising cobalt chromium alloy
08/11/2010CN201545926U Steel band supporting construction for electroplating system
08/11/2010CN201545925U Conducting roller device for resistance reflow melting
08/11/2010CN201544558U Automatic lockup shelf
08/11/2010CN1865519B Electroplating apparatus
08/11/2010CN1842618B Apparatus and method for depositing and planarizing thin films of semiconductor wafers
08/11/2010CN1831209B Electroplating apparatus
08/11/2010CN101801558A Press mold for sheet metal forming, method of treating press mold surface, and process for manufacturing automobile body
08/11/2010CN101798700A Electric plating production line for tungsten alloy pumping rod
08/11/2010CN101798699A Electric plating production line for tungsten alloy oil pipe
08/11/2010CN101798698A Base plate, contact ring, lipseal, electroplating device and electroplating method
08/11/2010CN101798695A Plating bath for producing diamond fretsaw
08/11/2010CN101798692A Quick alkaline galvanizing technology for plate-bending steel strip
08/11/2010CN101300443B Threaded joint for steel pipes and its pin and shell
08/11/2010CN101003907B Method for preparing metal and dielectric composite grains of silicon dioxide coated by Nano silver
08/05/2010WO2010087076A1 Spark plug and process for producing same
08/05/2010WO2010086111A2 Method for generating metal crystalline surface structures in the course of galvanic metal deposition
08/05/2010US20100193671 Reflection plate for optical encoder and manufacturing method thereof, and optical encoder
08/05/2010US20100193366 Method For Electrochemical Fabrication
08/04/2010EP2213772A1 Copper anode or phosphorus-containing copper anode, method for electroplating copper on semiconductor wafer, and semiconductor wafer with particle not significantly deposited thereon
08/04/2010EP2212452A1 Device and method for the electric contacting of products in electrolytic flow-through systems
08/04/2010CN101796223A Web treatment method, treatment bath, continuous electrolytic plating apparatus and method for manufacturing plastic film having plated film
08/04/2010CN101796222A Apparatus and method for providing electrical contact for planar material in straight-through installations
08/04/2010CN101792918A Preparation method of surface Co-based micro-nano needle crystal array structure
08/03/2010US7767065 Device and method for electrolytically treating an at least superficially electrically conducting work piece
07/2010
07/29/2010WO2010084532A1 Conductive member and method for producing the same
07/29/2010US20100187116 Paste form heat-blowing injection composition and method for injecting and soundproofing closed section of automobile body member
07/29/2010US20100187068 Apparatus and method for providing electrical contact for planar material in straight through installations
07/29/2010US20100186810 Method for the formation of a non-rectifying back-contact a cdte/cds thin film solar cell
07/29/2010DE102009006282A1 Verfahren zur Erzeugung metallisch kristalliner Oberflächenstrukturen im Wege einer galvanischen Metallabscheidung A process for the production of crystalline metallic surface structures by means of a galvanic metal deposition
07/28/2010EP2211061A1 Abrasion resistance reinforcing method and sliding structure
07/28/2010EP2210967A1 Surface-treated steel sheet, process for producing the same, and resin-coated steel sheet
07/28/2010CN101787556A Electrolytic cell
07/27/2010US7763158 Electrodeposition of metal and/or metal ions from a solid solution upon application of a suitable electric field; relates to programmable surface control devices whose physical features, controlled by the presence or absence of a metallic electrodeposit upon application of a bias
07/22/2010WO2010034511A3 Hydraulic cylinder and method for production thereof
07/22/2010US20100184932 Polymerizable Diazonium Salts, Process For The Preparation Thereof And Uses Thereof
07/22/2010US20100183894 Method for coating a construction material with a functional metal and the product manufactured by the method
07/22/2010US20100181201 Electrolytic passivated tin plated steel
07/21/2010CN101783285A Methods for processing wafer surfaces using thin, high velocity fluid layer
07/21/2010CN101782342A Heat pipe and method for manufacturing capillary structure thereof
07/21/2010CN101781787A Production technology for extra-width printing nickel screen and electrical nickel-plating bath
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