Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
11/2006
11/01/2006CN2832835Y Ultrasonic hydrothermal electrodeposition device for preparing coating or film
11/01/2006CN1856596A Electrochemical deposition chambers for depositing materials onto microfeature workpieces
11/01/2006CN1854349A Method for coating on metal in different material substrates
10/2006
10/31/2006US7129194 Catalyst system with improved corrosion resistance
10/31/2006US7128981 Sliding member
10/31/2006US7128821 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis
10/31/2006US7128820 Process for preparing a non-conductive substrate for electroplating
10/31/2006US7127831 Methods and systems for processing a substrate using a dynamic liquid meniscus
10/31/2006US7127800 Narrow write head pole tip fabricated by sidewall processing
10/26/2006WO2006113816A2 Underlayer for reducing surface oxidation of plated deposits
10/26/2006WO2006112406A1 Metal laminate, method for manufacturing same and use thereof
10/26/2006WO2006111837A2 Method for production of foamed metal
10/26/2006US20060240276 Underlayer for reducing surface oxidation of plated deposits
10/26/2006US20060240274 Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case
10/26/2006US20060240272 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon
10/26/2006US20060237325 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps
10/26/2006US20060237323 Electrolytic process using cation permeable barrier
10/26/2006US20060237322 Printed circuit board for improving impedance of signal transmission lines
10/26/2006US20060237321 Method of forming conductive tracks
10/26/2006US20060237320 Method for forming a metal layer in multiple steps
10/26/2006US20060237319 Planting process and manufacturing process for semiconductor device thereby, and plating apparatus
10/26/2006US20060237097 Immersion method
10/25/2006EP1573095B1 Method for removing at least one surface area of at least two components
10/25/2006EP1404460B1 Masking article for use in vehicle manufacturing
10/25/2006EP1343924B1 Improvements relating to metal finishes
10/25/2006CN1281796C Magnesium alloy surface activating process
10/25/2006CN1281795C Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
10/19/2006US20060234055 For metal-graphite composite material having substrate with surface having a carbon fiber content which is 10% or less of the carbon fiber content of the material, metal-containing intermediate layer (especially a zincate), and a metal coating (aluminum or alloy); hermetically sealed; corrosion resistant
10/19/2006US20060234039 Metal-coated carbon surfaces for use in fuel cells
10/19/2006US20060231407 Method of fabricating TFT array substrate and metal layer thereof
10/19/2006DE19960606B4 Verfahren zur Verbesserung der Korrosionsbeständigkeit von Stahlgegenständen A process for improving the corrosion resistance of steel articles
10/18/2006EP1712659A1 Corrosion resistant article and method of production thereof
10/18/2006EP1711961A2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
10/18/2006CN1849415A Device and method for electrolytically treating electrically insulated structures
10/18/2006CN1847465A Plating method for printing circuit board
10/18/2006CN1847464A Method for improved uniformity of electrochemical plating films produced
10/18/2006CN1847463A Chrome plating component
10/18/2006CN1280448C Forming method of plating chrome on copper layer of printed circuit board
10/17/2006US7124120 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
10/17/2006US7123443 Self-aligned void filling for mushroomed plating
10/17/2006US7122251 Resin composition for plating substrate and resin molding using the same, and metal plated parts
10/17/2006US7122107 Anodizing surface of article in an aqueous sulfuric acid bath to form colorable anodized layer, layer being porous crystalline columns of aluminum oxide; electrolytically depositing metal particles in the pores of anodized layer for coloring; heating; incorporating article into automotive vehicle body
10/17/2006US7122106 Electrosynthesis of nanofibers and nano-composite films
10/17/2006US7122105 Use of siderophores to increase the current efficiency of iron plating solutions
10/12/2006WO2006108140A1 Continuous plating system and method with mask registration
10/12/2006US20060226020 Plating method for aluminum alloy material
10/12/2006US20060226018 Plating apparatus, plating method, and method for manufacturing semiconductor device
10/12/2006US20060226017 Continuous plating system and method with mask registration
10/12/2006US20060226016 designed to penetrate the skin but not hit the nerves; plating an electrically conductive material on seed layer; separating the plated layer from the seed layer and the nonconductive pattern to release a hollow microneedle comprising a tip and an opening laterally offset from the tip
10/12/2006US20060226015 Method of forming electrically isolated structures using thin dielectric coatings
10/12/2006DE102006017995A1 Galvanisierungsverfahren für Aluminiumlegierungsmaterial Plating process for aluminum alloy material
10/11/2006EP1361837B1 Endoprothesis with galvanised silver layer
10/11/2006EP1087844A4 Apparatus and method for coating a multilayer article
10/11/2006CN1846077A Laminated composite material, production and use thereof
10/11/2006CN1846076A Layered composite material for plain bearings, production and use thereof
10/11/2006CN1844480A Method for electroplating aluminium alloy products
10/11/2006CN1844479A Secondary alloying nickel and stannum -plating steel plate and belt and method for preparing same
10/11/2006CN1279294C Brake and its mfg. method
10/10/2006US7118665 halogen ions implanted into micropores on surface prevents the electrode from generating a passive film, and which enhances the release rate of metal ions from the electrode, so as to extend the lifetime of the electrode
10/10/2006US7118664 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent
10/05/2006WO2006102791A1 A multicolor electroplating method for nonmetal material
10/05/2006US20060223223 Method of production of circuit board utilizing electroplating
10/05/2006US20060222882 Alloyed-molten-zinc-plated steel sheet with excellent processability and high strength and process for producing the same
10/05/2006US20060222880 Nickel coating
10/05/2006US20060222871 Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloys
10/05/2006US20060222846 Reflective and resistant coatings and methods for applying to composite structures
10/05/2006US20060219573 Apparatus with conductive pad for electroprocessing
10/05/2006US20060219569 Method of coating a square wire and an insulated wire of a square wire
10/05/2006US20060219567 Fabrication method of conductive bump structures of circuit board
10/05/2006US20060219566 Method for fabricating metal layer
10/05/2006US20060219565 Technique for electrochemically depositing an alloy having a chemical order
10/05/2006US20060219563 System and method of controlling the demarcation line formed on partially electroplated articles
10/05/2006US20060219562 System and method of transporting and providing a cathode contact to articles in an electroplating system
10/05/2006DE102005014748A1 Technique for electrochemical depositing of an alloy e.g., for microstructures, involves generating current between consumer electrode and surface
10/04/2006EP1392889A4 Anode assembly and process for supplying electrolyte to a planar substrate surface
10/04/2006CN1843067A Metal pattern and process for producing the same
10/04/2006CN1842618A Apparatus and method for depositing and planarizing thin films of semiconductor wafers
10/04/2006CN1840718A Cu-Ni-Si-Zn series alloy tinning rod
10/04/2006CN1277960C Method of producing bright anodized finishes for high magnesium, aluminum alloys
10/04/2006CN1277958C Electroplating method
10/04/2006CN1277957C Platable engineered polyolefin alloys
10/04/2006CN1277622C Masking article for use in vehicle structure
10/03/2006US7115510 Method for electrochemically processing a workpiece
10/03/2006US7115197 Plating crushable zinc alloy; alkaline pH
10/03/2006US7115196 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
10/03/2006US7114251 Method of producing of circuit board; for semiconductor device
09/2006
09/28/2006WO2006043994A3 Process for preparing a non-conductive substrate for electroplating
09/28/2006US20060213779 Silicon nanoparticle formation by electrodeposition from silicate
09/28/2006US20060213778 Method for electrochemical plating on semiconductor wafers
09/27/2006EP1705268A2 Plating apparatus for dental products
09/27/2006EP1354078A4 Spouted bed apparatus for contacting objects with a fluid
09/27/2006EP1295312A4 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/27/2006CN1839220A Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
09/27/2006CN1276996C Composite foil and its manufacturing process
09/26/2006US7113367 FeNiRe soft magnetic film and thin film magnetic head using the same for simultaneous adjustment of resistivity and saturated magnetic flux density
09/26/2006US7112349 Hinge holder treated by this process has an attractive, hard surface which is not easily scratched
09/26/2006US7112264 For performing plating on a long conductive substrate
09/21/2006WO2006098338A1 Plating method, light-transmitting conductive film and electromagnetic shielding film
09/21/2006WO2006098336A1 Plating method, light-transmitting conductive film and electromagnetic shielding film
09/21/2006WO2006098101A1 Metal material, and coating film and wiring for semiconductor integrated circuitry utilizing the metal material
1 ... 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 ... 179