C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces

Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
12/2006
12/13/2006	CN1289712C Anode assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte
12/12/2006	US7148148 Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
12/12/2006	US7147966 Coated carbon nanotube array electrodes
12/12/2006	US7147899 Process of masking cooling holes of a gas turbine component
12/12/2006	US7147896 Surface of zirconia ceramic is cleaned, acid etched, rinsed; activating surface is achieved by first applying a tin sensitizer, rinsing, and then a palladium activator, then applying electroless nickel to surface of material and rinsing; surface can be subsequently plated with gold, nickel, copper, tin
12/12/2006	US7147766 Depositing barrier layer; depositing seed layer of metal on barrier layer; removing seed layer from barrier layer, electroplating metal using portion of seed layer and exposed portions of barrier layer; removing excess plated metal
12/12/2006	US7147729 Method and apparatus for induction heat treating electrical contacts
12/12/2006	US7147201 Method for annealing an electrodeposition structure
12/07/2006	WO2006129886A1 Plating method, electrically conductive film and light-transmitting electromagnetic wave shielding film
12/07/2006	WO2006129602A1 Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material
12/07/2006	WO2006129540A1 Nb-Al TYPE SUPERCONDUCTING WIRE HAVING STABILIZING COPPER DEPOSIT TENACIOUSLY ADHERENT THERETO AND PROCESS FOR PRODUCING THE SAME
12/07/2006	WO2006128664A1 Method for producing electroplated plastic sanitary articles
12/07/2006	WO2005108649A3 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
12/07/2006	WO2004053942A3 Measuring alignment between a wafer chuck and polishing/plating receptacle
12/07/2006	US20060275620 Synthesis of tetragonal phase stabilized nano and submicron sized nanoparticles
12/07/2006	US20060272950 High purity electrolytic sulfonic acid solutions
12/06/2006	EP1729176A1 Positively radiation-sensitive resin composition
12/06/2006	EP1019954A4 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
12/06/2006	CN2844144Y Electric brush coated auxiliary tool
12/06/2006	CN1288946C Method for preparing surface treated copper foil
12/06/2006	CN1288945C Method for preparing surface treated copper foil
12/05/2006	US7144805 Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
12/05/2006	US7144768 Fabrication of titanium and titanium alloy anode for dielectric and insulated films
12/05/2006	US7144490 Forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad
12/05/2006	US7144489 Adding saccharic acid or a salt or lactone as an additive to the electroplating solution; contacting the additive with an iron(III) species to form an iron(III)-additive species; irradiating the electroplating solution
11/2006
11/30/2006	WO2004094702A3 Multi-chemistry plating system
11/30/2006	US20060269777 Diffused silver indium plate for metal seals
11/30/2006	US20060269776 steel sheet including C: 0.05 to 0.40%, Si: 0.2 to 3.0%, and Mn: 0.1 to 2.5%, the balance of Fe and unavoidable impurities, having on its surface a Zn alloy plating layer comprised of Fe; plating layer containing oxides particles of silica, alumina, manganese or complex oxides; high strength; automobile
11/30/2006	US20060269770 Nickel alloy plated structure
11/30/2006	US20060266655 Multiple chemistry electrochemical plating method
11/30/2006	US20060266444 Electrolytically coated cold-rolled strip, preferably to be used for the production of battery shells, and method for coating the same
11/29/2006	CN1871378A Deposition method for nanostructure materials
11/29/2006	CN1871375A Workpieces coated with an aluminum/magnesium alloy
11/29/2006	CN1287398C Sol-gel enclosed treatment process for electronic element method
11/28/2006	US7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
11/28/2006	US7141156 rigorous control of the relative proportions of respective inorganic and organic ingredients in the electrochemical deposition bath is critical to the achievement of satisfactory results in the rate of metal film formation and the quality of the film so formed
11/28/2006	US7140949 Tool and process for chrome plating a vehicle wheel surface
11/28/2006	US7140929 Electronic connector terminal, a method for plating, and a terminal stack
11/28/2006	US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/23/2006	WO2006122895A1 Method for producing coated surfaces and use thereof
11/23/2006	WO2006086407A3 In situ plating and etching of materials covered with a surface film
11/23/2006	US20060263625 Laminated composite material, production and use thereof
11/23/2006	US20060263622 Shot material for mechanical plating, and high corrosion resistant coating using same
11/23/2006	US20060260947 Color Stabilization of Anodized Aluminum Alloys
11/23/2006	US20060260946 Copper electrolytic process using cation permeable barrier
11/23/2006	US20060260945 Method of forming plated pattern and method of manufacturing thin film magnetic head
11/23/2006	US20060260932 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
11/23/2006	DE112004002419T5 Elektromagnetisches Wellenabschirmfilter und Verfahren zur Herstellung desselben Electromagnetic Wellenabschirmfilter and method of manufacturing the same
11/23/2006	DE102005022692A1 Verfahren zur Herstellung beschichteter Oberflächen und Verwendung derselben A process for preparing coated surfaces, and using the same
11/23/2006	DE10120847B4 Verfahren zum galvanischen Abscheiden einer Dispersionsschicht auf einer Oberfläche eines Werkstückes A method for the galvanic deposition of a dispersion layer on a surface of a workpiece
11/22/2006	EP1723269A2 Method of anodizing metallic surfaces and compositions therefore
11/22/2006	CN2840504Y Original side regulating voltage secondary rectifying single-phase electroplating DC power source single-chip machine constant-current apparatus
11/22/2006	CN2839303Y Jet-flow floaing electroplating tank
11/22/2006	CN1867703A Electroplating compositions and methods for electroplating
11/22/2006	CN1864990A Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
11/22/2006	CN1285419C Internal heat spreader plating methods and devices
11/21/2006	US7138043 Coating lining on internal combustion engines; corrosion and wear resistance
11/21/2006	US7138039 Liquid isolation of contact rings
11/16/2006	WO2004101857A3 Methods and apparatus for forming multi-layer structures using adhered masks
11/16/2006	US20060257717 Gas diffusion electrode and method for making same
11/16/2006	US20060257682 Corrosion protection of galvanized steel using a cerium salt-based solution and detection of the amount of corrosion resistance enhancement
11/16/2006	US20060257680 Cu or alloy foil, cobalt/nickel alloy layer that contains 60-80 mass % cobalt, zinc galvanized layer, trivalent chromate treatment layer formed using a solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH of 3.0-4.5
11/16/2006	US20060254924 Process for electroplating for producing an iron platinum magnetic material having an especially strong coercive force and excellent properties by using electroplating solution containing ionic iron, ionic platinum, and a complexing agent
11/16/2006	US20060254922 Method of depositing films on aluminum alloys and films made by the method
11/16/2006	US20060254921 Anodization process and layers produced therefrom
11/15/2006	EP1722013A1 ELECTROPLATING IN PRESENCE OF CO sb 2 /sb
11/15/2006	EP1722010A1 Method of preventing nickel leaching from copper alloy made liquid-contact equipment item, protective film forming agent for nickel leaching prevention and cleaner for nickel leaching prevention
11/15/2006	EP1721030A1 Method of anodizing metallic surfaces and compositions therefor
11/15/2006	EP1157149A4 DOUBLE-DIP Pd/Sn CROSSLINKER
11/15/2006	EP1099012A4 Method and apparatus for copper plating using electroless plating and electroplating
11/15/2006	CN2837312Y Electrolytic cell for electrochemical deposition nanowire array
11/15/2006	CN1861842A Immersion method
11/14/2006	US7135404 Method for applying metal features onto barrier layers using electrochemical deposition
11/14/2006	US7135103 Preparation of soft magnetic thin film
11/14/2006	US7135098 Copper interconnect seed layer treatment methods and apparatuses for treating the same
11/14/2006	US7134196 Electronic device and manufacturing same
11/09/2006	US20060251926 Magnetic alloy substrate of Sm Co Cu Fe-T in which T is Zr, Hf, Ti, Mn, Cr, Nb, Mo, W, V, Ni, and/or Ta covered with a platinum diffustion barrier that is preferably deposited by electroplating
11/09/2006	US20060251916 High temperature component with thermal barrier coating and gas turbine using the same
11/09/2006	US20060249391 High resolution electrolytic lithography, apparatus therefor and resulting products
11/09/2006	US20060249379 Greater tensile strength, substantial improvement of corrosion resistance of the joint welding, and improvement of conductibility which can be improved still further by modifying the straight design of the conducting bar by providing it with the "horn"-type shape
11/08/2006	EP1719827A1 Composite chromium plating film and sliding member having the same and its production method
11/08/2006	EP1719826A1 Electroplating solution composition for organic polymer-zinc alloy composite plating and plated metal material using such composition
11/08/2006	EP1719825A1 Electroplated coating of zinc alloy with excellent corrosion resistance and plated metal material having same
11/08/2006	EP1718785A2 Method for zinc coating aluminum
11/08/2006	EP1718780A1 High-carbon steel wire with nickel sub coating
11/08/2006	EP1214191A4 Treated copper foil and process for making treated copper foil
11/08/2006	CN1860259A A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
11/08/2006	CN1860258A Method of preparing printed or daubed image and printed or daubed image element by it
11/08/2006	CN1283849C Ni-plated steel plate for alkali-manganese dry cell anode can and alkali manganese dry cell anode can
11/08/2006	CN1283848C Method of copper-plating small-diameter holes
11/08/2006	CN1283847C Electro-plating apparatus and method
11/02/2006	WO2006114564A1 A method of forming mirrors on a conducting substrate
11/02/2006	WO2006114431A1 Process for producing metal-plated, extruded plastic objects
11/02/2006	WO2005094409B1 Process for preparing a non-conductive substrate for electroplating
11/02/2006	US20060246690 Electro-chemical deposition system
11/02/2006	US20060243597 Method, apparatus and system for electro-deposition of a plurality of thin layers on a substrate
11/02/2006	EP1717354A2 Ergonomic loading apparatus for electroplating processes
11/02/2006	EP1717020A1 Cable with aluminum central conductor
11/02/2006	EP1716949A1 Immersion method
11/02/2006	EP1716732A2 Tin-based coating of electronic component

1 ... 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 ... 179