Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
04/2008
04/22/2008US7361256 Electrolytic reactor
04/22/2008US7361225 Liquid tank
04/17/2008US20080087540 Method and Device for Obtaining a Determined Flow Resistance of a Flow Channel by Means of a Measuring Bridge
04/17/2008DE102006015177B4 Verfahren zur Herstellung oberflächenveredelter Kleinteile Process for the preparation of coated small parts
04/17/2008DE102004049930B4 Verfahren zum Herstellen einer Anode für galvanische Bäder und nach diesem Verfahren hergestellte Anode A method of manufacturing an anode for galvanic baths, and produced by this process anode
04/16/2008EP1910590A2 Device for the treatment, particularly galvanization, of substrates
04/16/2008CN201046999Y Automatic board descending device for electroplating machine
04/16/2008CN201046998Y Plate shelf for electric plating machine
04/16/2008CN201046997Y Vibrating device
04/16/2008CN201046996Y Apparatus for preparing metal surface abrasion self-repairing coating
04/16/2008CN100382235C Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers
04/16/2008CN100381617C Conveyorized horizontal processing line and method of wet-processing a workpiece
04/15/2008US7357850 Electroplating apparatus with segmented anode array
04/10/2008WO2008015158A3 Method for producing a corrosion-resistant, workable sheet metal with full-surface coating of the joined, thermally treated steel sheets
04/10/2008US20080083624 comprising an electrolytic cell having copper and wafer electrodes, and magnetic field generators, used for depositing copper ions on the wafers
04/10/2008DE19717489B4 Anordnung zur elektrogalvanischen Metallbeschichtung eines Bandes Arrangement for electro-galvanic metal coating of a band
04/09/2008EP1907608A1 Use of a coating for making electrical contact
04/09/2008CN201045145Y Hanging tool for electric plating
04/08/2008USRE40218 Configuration and dimensions of the deposition cell and its components are designed to provide uniform current distribution across the semiconductor substrate; flow-through anode and a diaphragm unit that provide a combination of relatively uniform flow of particle-free electrolyte
04/03/2008DE10102145B4 Galvanisiervorbehandlungsvorrichtung und Galvanisierbehandlungsvorrichtung Galvanisiervorbehandlungsvorrichtung and Galvanisierbehandlungsvorrichtung
04/02/2008CN101153410A Cast, special-shaped device two-sided plated differential and integral anode and device used thereof
04/02/2008CN100378253C Electroplating device, electroplating cup and cathode ring
04/02/2008CN100377991C Compositions, devices and methods for stabilizing and increasing the efficacy of halogen dioxide solutions
04/01/2008US7351321 Electroplating metal onto substrate in pattern corresponding to complement of conformable mask; forming multilayer, three-dimensional structure
04/01/2008US7351315 Chambers, systems, and methods for electrochemically processing microfeature workpieces
04/01/2008US7351314 Chambers, systems, and methods for electrochemically processing microfeature workpieces
03/2008
03/27/2008WO2008034739A1 Method for electrochemically coating or stripping the coating from components
03/26/2008EP1903131A2 System for galvanic deposition of a conducting coating on a non-conducting carrier material
03/26/2008EP1902162A1 Method and device for processing at least two workpieces by means of electrochemical treatment
03/26/2008EP1902161A1 Electrode arrangement and method for the electrochemical coating of a workpiece surface
03/26/2008CN201040776Y Electroplating cohoront machine for axial component
03/20/2008US20080067074 controlling the fluid flow at the interface between a substrate and a fluid by utilizing a membrane to create a thin film of fluid on the substrate; segregating the surface liquid flow from other liquid flows
03/20/2008US20080067072 Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys
03/20/2008US20080067062 Magnet arrangement for a planar magnetron background and summary of the invention
03/19/2008CN201037163Y Propulsion system for electroplating machine
03/19/2008CN201037162Y Plate arrangement for electroplating machine
03/19/2008CN201037161Y Plate for electroplating machine
03/19/2008CN201037159Y Electrophoresis guide rail positioning device
03/19/2008CN101146935A A method for coating an object
03/19/2008CN101146934A Alkaline galvanizing bath comprising a filtration membrane
03/19/2008CN101144177A Electrochemical processing apparatus and method of processing a semiconductor device
03/18/2008US7344431 Pad assembly for electrochemical mechanical processing
03/12/2008CN201033807Y Constitution of electroplating roller
03/12/2008CN201033806Y Filter screen positioning constitution of electroplating roller
03/12/2008CN101139732A Surface treatment apparatus for small object
03/11/2008US7341804 Useful in secondary lithium batteries
03/11/2008US7341649 Apparatus for electroprocessing a workpiece surface
03/06/2008WO2008027761A2 Method and apparatus for workpiece surface modification for selective material deposition
03/06/2008US20080058201 Method of Diffusing a Catalyst for Electrochemical Oxygen Reduction
03/06/2008US20080057709 Method and apparatus for workpiece surface modification for selective material deposition
03/06/2008US20080057379 Perovskite oxide dispersed in mixture of carbon black and hydrophobic binder polymer
03/06/2008US20080053837 Electrolysis Device For The Production Of Alkali Metal
03/06/2008US20080053824 Device for galvanic coating of a piston
03/06/2008DE202007017636U1 Galvanisiergestell mit Gestellstab und Gestellkopf Galvanisiergestell with Rack bar and frame head
03/06/2008DE102006042049A1 Vorrichtung zum galvanischen Beschichten eines Kolbens An apparatus for the galvanic coating of a piston
03/05/2008CN201031263Y Clamp for electrolytizing circuit boards
03/05/2008CN101135058A Electrodepositing rollor
03/04/2008US7338586 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus
03/04/2008US7338580 Monolithic printhead with multiple ink feeder channels and relative manufacturing process
03/01/2008WO2008001892A1 Metal wire rod plating insoluble anode and metal wire rod plating method using it
02/2008
02/28/2008WO2008023974A1 Device for treating a plate-shaped substrate in a bath.
02/28/2008WO2006048569A3 Holder for parts to be painted
02/28/2008US20080047829 Plating Apparatus
02/27/2008EP1516076B1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
02/21/2008US20080041726 uniform thickness via aligning lines of electric force uniformly and parallel by disposing pair of conductive perforated plates, which are electrically connected to each other, between plating metals immersed in plating solution
02/21/2008DE202007015936U1 Deckelement für Prozessreaktor Cover element for process reactor
02/20/2008EP1889951A1 Apparatus and method for anodising workpieces
02/20/2008EP1888820A1 Method, clip and device for transporting an article to be treated in an electrolytic system
02/20/2008CN201024221Y Horizontal plating machine
02/20/2008CN100370578C Substrate holder and plating apparatus
02/19/2008US7332066 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
02/19/2008US7332064 Hangar bar
02/19/2008US7332062 Electroplating tool for semiconductor manufacture having electric field control
02/14/2008WO2008018471A1 Partial plating method, laser plating apparatus, and plated member
02/14/2008US20080035492 Oxygen Transport Structure
02/14/2008US20080035486 of platinum and/or palladium; uniform thickness; aluminizing; in first stage a current magnitude is increased continuously or step-wise beginning from an initial value up to a maximum value; in second stage current magnitude is maintained constant at the maximum value; corrosion resistant; turbine blade
02/14/2008US20080035475 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating
02/13/2008EP1887108A1 Gravure cylinder-use copper plating method and device
02/13/2008EP1579037A4 Method and apparatus for electrolyzing water
02/13/2008CN201021461Y A plating hanger
02/12/2008US7329335 Device providing electrical contact to the surface of a semiconductor workpiece during processing
02/07/2008WO2008016541A1 Constituent maintenance of a copper sulfate bath through chemical dissolution of copper metal
02/07/2008WO2008015158A2 Method for producing a corrosion-resistant, workable sheet metal with full-surface coating of the joined, thermally treated steel sheets
02/07/2008WO2008014987A2 Method for deposition of chromium layers as hard- chrome plating, electroplating bath and hard- chrome surfaces
02/07/2008US20080029402 Electrochemical processing apparatus and method of processing a semiconductor device
02/07/2008US20080029398 Electroplating apparatus and electroplating method
02/06/2008CN201017773Y Forming device of electric pole foil and forming groove
02/06/2008CN201016125Y Copper ball automatically adding groove
02/06/2008CN201016124Y Plating bus bar protective cover
02/06/2008CN201016123Y Cathode guard board structure for flexible circuit board plating technology
01/2008
01/31/2008WO2008013535A1 Process and apparatus for plating articles
01/31/2008US20080026681 Conductive polishing article for electrochemical mechanical polishing
01/31/2008US20080023335 Method of fabricating semiconductor device, and plating apparatus
01/31/2008DE10304533B4 Bead-Kristall sowie Verfahren zur Herstellung eines Bead-Kristalls und Verwendung Bead-crystal and methods of making and using a bead crystal
01/31/2008DE102006034382A1 Device for electro-chemical coating of work pieces, comprises a coating reactor, to which an electrolyte is fed and which contains a coating orifice having a orifice carrier and a orifice insert coordinated on the work piece to be coated
01/30/2008CN201014935Y Inner lining with activation
01/30/2008CN101115869A Method for treating surfaces of hollow parts, tank for carrying out a method of this type, installation for continuously treating surfaces comprising such a tank
01/29/2008US7323097 Electroplating method for a semiconductor device
01/29/2008US7323096 Electrochemical treatment on an object to be treated, capable of avoiding contact between the object and the atmosphere, uniformly activating the surface of the object with precision, obtaining a good precipitation of metal ion Oon surface
01/29/2008US7323094 For electroplating metal-containing layers on semiconductor substrates
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