| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/03/2013 | CN103188875A Super-thick copper diagram manufacturing method and printed circuit board (PCB) provided with super-thick copper diagram |
| 07/03/2013 | CN103188874A Controlled depth milling location method and printed circuit board |
| 07/03/2013 | CN103188873A Forming machining method of PCB and PCB |
| 07/03/2013 | CN103188867A Multilayer electronic structure having novel transmission line |
| 07/03/2013 | CN103188866A Printed wiring board and method for manufacturing printed wiring board |
| 07/03/2013 | CN103188865A Wiring substrate and method of manufacturing the same |
| 07/03/2013 | CN103188864A A printed circuit board and a manufacturing method thereof |
| 07/03/2013 | CN103188863A Printed circuit board plate and manufacturing method thereof and printed circuit board and packaging method thereof |
| 07/03/2013 | CN103188862A Printed circuit board (PCB) and manufacturing method thereof and electronic component |
| 07/03/2013 | CN103187389A Multilayer electronic structure with stair-stepping holes |
| 07/03/2013 | CN103187313A Spherical array packaging chip reballing method |
| 07/03/2013 | CN103187311A Fabrication method of package substrate |
| 07/03/2013 | CN103184489A Copper electroplating solution and method of copper electroplating |
| 07/03/2013 | CN102356702B Screen printing machine and screen printing method |
| 07/03/2013 | CN102282294B Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface |
| 07/03/2013 | CN102113423B Substrate module and method for manufacturing same |
| 07/03/2013 | CN102056425B Method for manufacturing multilayer printed circuit board (PCB) |
| 07/03/2013 | CN102047774B Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 07/03/2013 | CN101982515B Film-like circuit connecting material and connection structure for circuit member |
| 07/03/2013 | CN101969747B Hinge clamp positioning method for printed board processing |
| 07/03/2013 | CN101960933B Mounted structure and motor |
| 07/03/2013 | CN101925861B Layered product of photosensitive resin |
| 07/03/2013 | CN101631424B Rigid and flexible circuit board and manufacture method thereof |
| 07/02/2013 | US8476090 Method forming a semiconductor light emitting device with perforations formed within |
| 07/02/2013 | US8474134 Functional element-mounted module and a method for producing the same |
| 07/02/2013 | US8474133 Method of fabricating a base layer circuit structure |
| 06/27/2013 | WO2013096880A1 Capacitive blind-mate module interconnection |
| 06/27/2013 | WO2013096846A1 Method of fabricating electrical feedthroughs using extruded metal vias |
| 06/27/2013 | WO2013095971A1 Laser patterning of silver nanowire - based transparent electrically conducting coatings |
| 06/27/2013 | WO2013095922A1 Printed circuit boards and methods of manufacturing printed circuit boards |
| 06/27/2013 | WO2013095075A1 Method for manufacturing a metal printed circuit board |
| 06/27/2013 | WO2013094766A1 Plated article and manufacturing method therefor |
| 06/27/2013 | WO2013094606A1 Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate |
| 06/27/2013 | WO2013094543A1 Conductive adhesive |
| 06/27/2013 | WO2013094025A1 Laser processing method |
| 06/27/2013 | WO2013092435A1 Connection board, optoelectronic component arrangement, and illumination device |
| 06/27/2013 | WO2013092131A1 Method for combined through-hole plating and via filling |
| 06/27/2013 | WO2013091962A1 Transmission control module |
| 06/27/2013 | WO2013091784A1 Method for producing an electrical radiofrequency connection between two plate-shaped conductor track sections and an associated electrical radiofrequency connection |
| 06/27/2013 | US20130164556 Circuit board with thermally conductive layers and manufacturing method therefor |
| 06/27/2013 | US20130164487 Encapsulation and production of an encapsulated printed circuit board assembly |
| 06/27/2013 | US20130164440 Printed wiring board and method for manufacturing the same |
| 06/27/2013 | US20130163210 Integrated flex tail circuit packaging |
| 06/27/2013 | US20130163209 Electronics assembly divider plate |
| 06/27/2013 | US20130162543 Piezoelectric Actuator Interface and Method |
| 06/27/2013 | US20130161805 Integrated circuit (ic) leadframe design |
| 06/27/2013 | US20130161390 Multi-chip card |
| 06/27/2013 | US20130161085 Printed circuit board and method for manufacturing the same |
| 06/27/2013 | US20130161083 Printed circuit boards and methods of manufacturing printed circuit boards |
| 06/27/2013 | US20130161079 Multi-layer wiring substrate and manufacturing method thereof |
| 06/27/2013 | US20130161077 Differential signal transmission circuit and method for manufacturing same |
| 06/27/2013 | US20130161075 Connerting structure of touch panel and method for manufacturing the same |
| 06/27/2013 | US20130161073 Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method |
| 06/27/2013 | US20130161072 Methods and Apparatuses for Detecting Registration Offsets |
| 06/27/2013 | US20130161071 Connection structure, connection method and differential signal transmission cable |
| 06/27/2013 | US20130160290 Method of manufacturing multi-layer wiring board |
| 06/27/2013 | US20130160289 One-pack type epoxy resin composition and use thereof |
| 06/27/2013 | US20130160288 Apparatus and method for manufacturing double-sided mounting substrate |
| 06/27/2013 | US20130160183 Textile arrangement and method for manufacturing |
| 06/27/2013 | DE112010000752T5 Bleifreie Lotlegierung, ermüdungsbeständige Lötmaterialien, die die Lotlegierung enthalten, und kombinierte Produkte, die die Lötmaterialien verwenden Lead-free solder alloy, fatigue resistant solder materials containing the solder alloy and combined products that use the soldering materials |
| 06/27/2013 | DE102012203318A1 Method for exposing objective layer within multilayer circuit board, involves forming recess from surface of multilayer printed circuit board upto sacrificial layer or into sacrificial layer by erosion process |
| 06/27/2013 | DE102012110382A1 Substrate i.e. printed circuit board, for electrical circuits and/or modules, has stop structure extending up to level of adjacent exposed outer surface of metallization regions or surface of end layer projects above level |
| 06/27/2013 | DE102012101057A1 Verfahren zur Herstellung von DCB-Substraten Process for the preparation of DCB substrates |
| 06/27/2013 | DE102011122037A1 Verfahren zur Herstellung einer elektrischen Hochfrequenz-Verbindung zwischen zwei Plattenabschnitten sowie eine zugehörige elektrische Hochfrequenz-Verbindung A process for producing a high-frequency electric connection between two plate sections and an associated high-frequency electrical-connection |
| 06/27/2013 | DE102011089927A1 Kontaktsystem mit einem Verbindungsmittel und Verfahren Contact system with a connecting means and methods |
| 06/27/2013 | DE102011089891A1 Circuit carrier of circuit device has supporting layer having surface on which cooling structure is formed for cooling circuit carrier by directly plating on surface of supporting layer |
| 06/27/2013 | DE102011089639A1 Schaltungsträger mit einer separaten HF-Schaltung und Verfahren zum Bestücken eines solchen Schaltungsträgers Circuit board with a separate RF circuit and method for assembling such a circuit carrier |
| 06/27/2013 | DE102011089465A1 Steuergerät für ein Kraftfahrzeug Control unit for a motor vehicle |
| 06/27/2013 | DE102010019407B4 Verfahren zum Einbringen elektrischer Isolierungen in Leiterplatten A method for introducing electrical insulation in printed circuit boards |
| 06/26/2013 | EP2608643A1 Cable |
| 06/26/2013 | EP2608642A1 Anisotropic conductive material |
| 06/26/2013 | EP2607054A1 Stacking apparatus |
| 06/26/2013 | EP2607008A1 Soldering device for fixing an electrically conductive strip to a bus bar of a solar cell by means of inductive soldering |
| 06/26/2013 | EP2607007A1 Soldering device for fixing an electrically conductive strip to a solar cell |
| 06/26/2013 | EP2288244B1 Wiring circuit substrate |
| 06/26/2013 | CN203027640U Electronic component substrate and fixation element for installing electronic components onto printed circuit board |
| 06/26/2013 | CN203027613U Laminating structure for prepreg resin plug hole |
| 06/26/2013 | CN203027612U Circuit welding die assembly |
| 06/26/2013 | CN203027611U Universal stove-passing tool for boards |
| 06/26/2013 | CN203027610U Improved patch head |
| 06/26/2013 | CN203027609U Patch head |
| 06/26/2013 | CN203027608U Tool for coating three-resisting paint on circuit board |
| 06/26/2013 | CN203027607U Semiautomatic vacuum suction attachment machine |
| 06/26/2013 | CN203027606U Distressing equipment of circuit board |
| 06/26/2013 | CN203021663U Electroplating edge strip for PCB (Printed Circuit Board) electroplating |
| 06/26/2013 | CN203018883U Cooling system and reflow oven |
| 06/26/2013 | CN203018882U Reflow soldering machine and cooling system thereof |
| 06/26/2013 | CN203018881U Dissipated heat guiding out tray |
| 06/26/2013 | CN203018875U Vacuum reflow oven and cooling system thereof |
| 06/26/2013 | CN103181249A Metal core board and electric connection box having the same |
| 06/26/2013 | CN103181248A Method for manufacturing reusable paste, reusable paste, and method for manufacturing wiring substrate using reusable paste |
| 06/26/2013 | CN103181247A 高频电路基板 High frequency circuit board |
| 06/26/2013 | CN103181246A Composite substrate, module, and method of producing composite substrate |
| 06/26/2013 | CN103181244A Printed circuit board for population with luminous bodies |
| 06/26/2013 | CN103180924A 电开关 Electric switch |
| 06/26/2013 | CN103180913A Low-temperature sintering conductive paste, conductive film using same, and method for forming conductive film |
| 06/26/2013 | CN103180387A Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor |
| 06/26/2013 | CN103180079A Production method for solder transfer base material, solder precoating method, and solder transfer base material |
| 06/26/2013 | CN103179812A Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| 06/26/2013 | CN103179811A Method of manufacturing multi-layer wiring board |