Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2014
03/05/2014CN103619127A Method for realizing high-precision screen printing through direct solidification
03/05/2014CN103619126A Method for manufacturing outer layer circuit of metal-based thick copper plate
03/05/2014CN103619125A PCB electroplating method for improving electroplating uniformity
03/05/2014CN103619124A Method for producing circuit board thin plates
03/05/2014CN103619123A Automatic device for bonding PFC and reinforcement sheet
03/05/2014CN103619122A Chamfering omission-preventable circuit board and circuit board manufacture method
03/05/2014CN103619120A Connecting finger clamping slot milling omission-preventable circuit board and manufacture method thereof
03/05/2014CN102523684B Manufacture method for printed circuit board (PCB) with step groove
03/05/2014CN102424964B Browning conditioning fluid containing sulfydryl compound
03/05/2014CN102413637B Disassembling and assembling device of printed circuit boards
03/05/2014CN102388683B Method of manufacturing circuit carrier layer and use of said method for manufacturing circuit carrier
03/05/2014CN102159026B Flex-rigid wiring board and method for manufacturing same
03/05/2014CN102119588B Method for manufacturing module with built-in component, and module with built-in component
03/04/2014US8664562 Systems and methods for forming apertures in microfeature workpieces
03/04/2014US8664538 Terminal-integrated metal base package module and terminal-integrated metal base packaging method
03/04/2014US8663572 Micro plasma jet generator
03/04/2014US8663485 Method of manufacturing plastic metallized three-dimensional circuit
03/04/2014US8662640 Corrosion protected flexible printed wiring member
03/04/2014US8662377 Method for securing electronic components to a substrate
03/04/2014US8661663 Method for manufacturing a multimodal neural probe
03/04/2014US8661662 Making transparent touch-responsive device with micro-wire electrodes
03/04/2014US8661661 Process for the production of a circuit portion on a substrate
03/04/2014US8661660 Process for manufacturing LED lighting with integrated heat sink
03/04/2014US8661659 Method of producing circuit board
03/04/2014US8661655 Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this
02/2014
02/27/2014WO2014030867A1 Method for forming solder resist of printed circuit board, and printed circuit board manufactured by said method
02/27/2014WO2014030744A1 Anisotropic conductive film and manufacturing method therefor
02/27/2014WO2014030659A1 Insulating substrate、multilayer ceramic insulating substrate, joined structure of power semiconductor device and insulating substrate, and power semiconductor module
02/27/2014WO2014030647A1 Parallel line pattern containing conductive material, parallel line pattern formation method, substrate with transparent conductive film, device and electronic apparatus
02/27/2014WO2014030471A1 Laminated substrate and manufacturing method therefor
02/27/2014WO2014030355A1 Wiring board
02/27/2014WO2014030326A1 Component packaging device and component packaging method
02/27/2014WO2014030109A1 Compound wherein conductive circuits can be made
02/27/2014WO2014029737A1 Electrical circuit trace manufacturing for electro-chemical sensors
02/27/2014WO2014029551A1 Printed circuit board contact-making means
02/27/2014WO2013177089A3 Accessory button controller assembly
02/27/2014US20140057428 Buffer layer for sintering
02/27/2014US20140057080 Ceramic electronic component and manufacturing method thereof
02/27/2014US20140057045 Method of changing the optical properties of high resolution conducting patterns
02/27/2014US20140056560 Methods and systems for blind mating multi-optical fiber connector modules
02/27/2014US20140055991 Printed Circuit Boards with Deformations
02/27/2014US20140055968 Apparatus and Method for Vertically-Structured Passive Components
02/27/2014US20140055967 Wiring board and manufacturing method of wiring board
02/27/2014US20140055961 Printed Circuit Boards with Recesses
02/27/2014US20140055544 Curable ink and a method for printing and curing the curable ink
02/27/2014US20140055405 Touch electrode device and a method of manufacturing the same
02/27/2014US20140055159 Interposer with Edge Probe Points
02/27/2014US20140054259 Manufacturing method of multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method
02/27/2014US20140054080 Wiring board and manufacturing method of wiring board
02/27/2014US20140054079 Multilayer flexible printed circuit board and method for manufacturing same
02/27/2014US20140054076 Conductive component and preparation method thereof
02/27/2014US20140054075 Printed circuit baord and method for manufacturing same
02/27/2014US20140054074 Printed circuit board and method for manufacturing same
02/27/2014US20140054073 Method for forming solder resist and substrate for package
02/27/2014US20140054069 Printed circuit board and method for manufacturing the same
02/27/2014US20140054068 Printed wiring board and method for manufacturing the same
02/27/2014US20140054065 Electrical circuit trace manufacturing for electro-chemical sensors
02/27/2014US20140053400 Method for fabricating package substrate
02/27/2014US20140053399 Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple dmds
02/27/2014US20140053397 Method for manufacturing printed circuit board
02/27/2014DE102013108986A1 Anschlussstruktur sowie Halbleiterelement und Modelsubstrat mit einer solchen Anschlussstruktur Connection structure and semiconductor element and model substrate with such a connection structure
02/27/2014DE102012215021A1 Leiterplattenkontaktierung PCB connections
02/27/2014DE102007033718B4 Platine und Verfahren zu ihrer Herstellung Board and process for its preparation
02/26/2014EP2701474A2 A circuit board system
02/26/2014EP2701473A2 LED panel radiator
02/26/2014EP2701472A1 Wiring substrate
02/26/2014EP2701470A1 Wiring board, multi-pattern wiring board, and method for producing same
02/26/2014EP2701469A1 Ceramic wiring board, multi-pattern ceramic wiring board, and method for producing same
02/26/2014EP2699406A2 System and method for additive manufacturing of an object
02/26/2014CN203457494U Conveying mechanism of automatic insertion machine
02/26/2014CN203457431U A PCB clamp
02/26/2014CN203457430U A jig mechanism used for assembling cables
02/26/2014CN203457429U Cleaning device for circuit board
02/26/2014CN203457428U Circuit board vehicle
02/26/2014CN203457427U Circuit board two-sided character printing structure
02/26/2014CN203457426U Baking molding clamp for flexible circuit board
02/26/2014CN203457425U Printed circuit board production technology device
02/26/2014CN203449195U Positioning tool plate
02/26/2014CN203448833U Reflow soldering heating filament fixing structure
02/26/2014CN203448815U Novel tin dipping device
02/26/2014CN1982774B Flashlight, device comprising flashlight and detachable battery set
02/26/2014CN103609204A Metal alloys from molecular inks
02/26/2014CN103609202A Load control device having an electrically isolated antenna
02/26/2014CN103608921A LED array having embedded LED and method therefor
02/26/2014CN103608915A Circuit module
02/26/2014CN103608908A Bonding method and production method
02/26/2014CN103608180A Silk-screen stencil for printing onto a photovoltaic cell
02/26/2014CN103608140A Bonding material and bonded object produced using same
02/26/2014CN103607859A Manufacturing method of printed circuit board
02/26/2014CN103607858A Anti-welding processing method of PCB via hole with open window formed in single face
02/26/2014CN103607857A Blind hole machining method
02/26/2014CN103607856A Manufacturing method for composite flexible printed circuit board
02/26/2014CN103607855A Method for manufacturing composite flexible printed circuit board
02/26/2014CN103607854A Parallel transplanting machine and automatic cycle line-combined assembly line
02/26/2014CN103607853A Preparation method of printed circuit wires
02/26/2014CN103607852A Printed circuit board core transplanting method
02/26/2014CN103607851A Intermediate heat conduction aluminum substrate manufacturing method
02/26/2014CN103607850A Method for machining inner bevel edge of PCB
02/26/2014CN103607849A Method for manufacturing metal base stepped slot
02/26/2014CN103607848A Method for improving solder resist alignment accuracy of printed-circuit board
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