Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2014
02/26/2014CN103607847A Isolation method for radio frequency printed board with combination of ground plane and pressing strips
02/26/2014CN103607846A Manufacturing method for flexible printed circuit board
02/26/2014CN103607845A Manufacturing method of flexible printed circuit board
02/26/2014CN103607841A SMT subtraction high-density packaged multilayer circuit board structure and manufacturing method thereof
02/26/2014CN103607840A Metal dome golden finger, key structure and metal dome assembling technology
02/26/2014CN102300409B Method for bonding between flexible circuit board base material and reinforcing material
02/26/2014CN102144046B 2-benzyl-4-(3,4-dichlorophenyl)-5-methylimidazole compound
02/25/2014US8657987 Manufacturing apparatus for manufacturing electronic monolithic ceramic components
02/25/2014US8656584 Method of fabricating an electromechanical component using graphene
02/25/2014US8656583 Method for assembling components on a circuit board
02/25/2014US8656582 Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer
02/25/2014US8656581 Method of fabricating a circuit apparatus
02/20/2014WO2014028567A1 Solder on trace technology for interconnect attachment
02/20/2014WO2014027891A1 Electro-optic component and method of manufacturing these
02/20/2014WO2014027486A1 Electronic component and method for producing same
02/20/2014WO2014027484A1 Drawing device, exposure drawing device, drawing method, and recording medium whereon program is stored
02/20/2014WO2014027483A1 Drawing device, exposure drawing device, drawing method, and recording medium whereon program is stored
02/20/2014WO2014026910A1 Curable compositions comprising composite particles
02/20/2014WO2014026889A1 Method for the production of a strip-shaped lighting module
02/20/2014WO2014026888A1 Production of a strip-shaped lighting module
02/20/2014WO2014026490A1 Printed circuit pressing structure and pressing method
02/20/2014US20140050841 Laser-engraveable elements and method of use
02/20/2014US20140049933 Detachable components for space-limited applications through micro and nanotechnology (decal-mnt)
02/20/2014US20140048751 Photonic sintering of polymer thick film conductor compositions
02/20/2014US20140048320 Printed circuit board and method for manufacturing the same
02/20/2014US20140047709 Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies
02/20/2014DE102013108913A1 Stapelbare Sicherheitshülle Stackable containment
02/20/2014DE102013009239A1 Photonisches Sintern von Polymerfilmleiterzusammensetzungen Photonic sintering of polymer film conductor compositions
02/20/2014DE102012214721A1 Method for producing three-dimensional printed circuit board assembly, involves bending connecting element such that main surfaces of printed circuit boards are coincided with each other
02/20/2014DE102012018751A1 Elektronische Vorrichtung und deren Isolierungsstruktur Electronic device and its isolation structure
02/19/2014EP2698836A1 Foil, electro-optic component and method of manufacturing these
02/19/2014EP2698400A2 Epoxy resin compound and radiant heat circuit board Using the same
02/19/2014EP2698225A1 Lead-free solder alloy
02/19/2014EP2698045A1 Improvements in and relating to transparent components
02/19/2014EP2698044A1 Conducting track assembly for a motor vehicle equipment part
02/19/2014CN203446175U Three-dimensional adjustable mechanism
02/19/2014CN203446121U Printed circuit board through hole tool
02/19/2014CN203446120U Auxiliary carbon ink filling apparatus
02/19/2014CN203446119U Printing steel mesh and SMT (Surface Mounted Technology) production line
02/19/2014CN203446118U Gold finger protecting device
02/19/2014CN203446117U Loading and unloading system used for SMT
02/19/2014CN203446116U Device used for SMT fixture
02/19/2014CN203446115U Auxiliary supporting device
02/19/2014CN203446114U V-CUT offset detection structure for printed circuit board
02/19/2014CN203446113U Anti-welding back baking auxiliary tool for circuit board
02/19/2014CN203446112U Plate turnover machine with finger plate grabbing function
02/19/2014CN203446111U Circuit board reinforcing attaching fixture
02/19/2014CN203446110U Printed circuit board surface treatment apparatus
02/19/2014CN203446100U Printed circuit board (PCB)
02/19/2014CN203446099U Stacking structure for manufacturing antenna board
02/19/2014CN203437862U Pin fixing tool
02/19/2014CN203437787U Device for removing soldering tin soldering tip and production line
02/19/2014CN203437691U Combined type bakelite plate
02/19/2014CN103597920A Board operation assisting device, and board operation assisting method
02/19/2014CN103597919A Surface mounting gasket and method of manufacturing same
02/19/2014CN103597916A Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
02/19/2014CN103597915A Metal foil patterned-laminate, metal foil laminate, metal foil laminate substrate, solar cell module and manufacturing method for metal foil patterned-laminate
02/19/2014CN103597667A Film-shaped circuit connecting material and circuit connecting structure
02/19/2014CN103596761A 网版印刷装置 A screen printing device
02/19/2014CN103596386A Method of manufacturing hybrid circuit board with built-in stopper
02/19/2014CN103596385A Blind hole making technology of flexible circuit board
02/19/2014CN103596384A A Z-direction interconnected printed circuit board and a manufacturing method thereof
02/19/2014CN103596383A Method for manufacturing printed circuit board provided with alloy posts spaced in staggered mode
02/19/2014CN103596382A Printed circuit board
02/19/2014CN103596381A Method for manufacturing printed circuit board
02/19/2014CN103596380A Method for plating insulating thermal conductive plate with copper
02/19/2014CN103596379A Method for manufacturing double-layer flexible printed circuit board
02/19/2014CN103596378A PCB (Printed Circuit Board) element transmitting system and method
02/19/2014CN103596377A 电路板载具 Circuit-board with
02/19/2014CN103596376A High-speed chip mounter
02/19/2014CN103596375A Method for forming conducting line on circuit board
02/19/2014CN103596374A Method for forming conducting line on flexible circuit board
02/19/2014CN103596373A Integrated circuit plate manufacturing method based on copper nitride film
02/19/2014CN103596372A PCB ultrasonic hole-filling method
02/19/2014CN103596371A Method for manufacturing circuit board
02/19/2014CN103596370A Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
02/19/2014CN103596369A Method for manufacturing rigid-flexible board with blind groove
02/19/2014CN103596368A Improved direct laser drilling processing method
02/19/2014CN103596367A Printed circuit board inner film and processing method of printed circuit board
02/19/2014CN103596366A Manufacturing technology of high density circuit board
02/19/2014CN103596360A 柔性无胶铜电路板基材及其制造方法 No plastic flexible copper circuit board substrate and manufacturing method
02/19/2014CN103596358A SMT addition high-density packaged multi-layer circuit board structure and manufacturing method thereof
02/19/2014CN103596355A Double-layer flexible printed circuit board
02/19/2014CN103596353A Line structure and manufacturing method thereof
02/19/2014CN103594146A Conductive particle and method for producing conductive particle
02/19/2014CN103592825A Development apparatus for circuit board
02/19/2014CN103589384A Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition
02/19/2014CN103587228A Screen printing apparatus, printed matter manufacturing method, and substrate manufacturing method
02/19/2014CN102523704B Production method of multi-stage HDI plate
02/19/2014CN102510668B Super thick copper PCB plate production method and its circuit board
02/19/2014CN102510667B CNC (Computer Numerical Control) board splitting production method without NPTH (Non Plating Through Hole) hole positioning
02/19/2014CN102427660B FPC (Flexible Printed Circuit board) production method and FPC device
02/19/2014CN102413645B Manufacturing method of PCB (printed circuit board) semi-plugged hole
02/19/2014CN102349362B Electronic component mounting method and electronic component mounting structure
02/19/2014CN101999259B Viscous material trial coater
02/19/2014CN101794951B A method of connecting printed circuit boards and corresponding arrangement
02/18/2014US8655197 Electronic paper structure and method for fabricating electronic paper
02/18/2014US8653379 Electronic part, electronic member connection method, and circuit connection member
02/18/2014US8650749 Method for manufacturing graphene electronics
02/18/2014US8650748 Universal chip carrier and method
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