Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2014
04/23/2014CN103747943A System and method for additive manufacturing of an object
04/23/2014CN103747885A Droplet discharge device and method
04/23/2014CN103747665A Multi-station plug-in mounting production line and automatic mouse PCB (printed circuit board) production line
04/23/2014CN103747639A Manufacturing method for high-rise board
04/23/2014CN103747638A Riveting machine upper and lower mold butt joint correcting method and correcting circuit
04/23/2014CN103747637A PCB (printed circuit board) machining method and PCB
04/23/2014CN103747636A Gold-plated circuit-board lead etch-back method
04/23/2014CN103747635A Method for selective deposition of metals through interfacial adsorption and application thereof
04/23/2014CN103747634A PCB thermal insulation stroke-limiting hot-pressing clamping jig
04/23/2014CN103747633A PCB locating stroke-limiting hot-pressing table clamping jig
04/23/2014CN103747632A Multi-rotating shaft PCB welding blowing clamping jig
04/23/2014CN103747631A PCB locating hot-pressing jig
04/23/2014CN103747630A Material belt charging device of chip mounter
04/23/2014CN103747629A Material film peeling device
04/23/2014CN103747628A A tool dedicated to a chip mounter
04/23/2014CN103747627A Method for manufacturing inductance device by using printed circuit board
04/23/2014CN103747626A Method for selectively removing conductive layer on baseplate material
04/23/2014CN103747625A GND (ground) hole distributing method and system of HDI (High Density Interconnection) circuit board
04/23/2014CN103747624A Manufacturing method of circuit board by manufacturing insulation channel to realize selective local electroplating
04/23/2014CN103747623A Printed circuit board with small-spacing bonding pads and preparation method thereof
04/23/2014CN103747622A Pressing mechanism for filling up placing holes in rigid material
04/23/2014CN103747621A Laminating mechanism for continuously filling through hole on flexible carrier
04/23/2014CN103747620A Preparation method of local binderless reinforce panel
04/23/2014CN103747619A PCB position-limiting fixing cooling jig
04/23/2014CN103747618A PCB hot-pressing jig with fixing buffering function
04/23/2014CN103747617A PCB expansion compensation method
04/23/2014CN103747616A Method for manufacturing module with built-in component, and module with built-in component
04/23/2014CN103747614A Multi-sample-based spliced board and production process for same
04/23/2014CN103747613A Applicable electromagnetic wave protection film and manufacturing method thereof
04/23/2014CN103747612A Champagne metal reinforcement sheet and preparation method thereof
04/23/2014CN103747609A Polyimide nano fiber composite film, and preparation method and application thereof
04/23/2014CN102472968B Photocurable resin composition
04/23/2014CN102427684B Manufacturing method of HDI (High Density Interconnection) printed circuit board
04/23/2014CN102355798B Manufacturing method of cylindrical module circuit board and sintering bracket
04/23/2014CN102349361B Method and system for connecting a plurality of printed circuit boards to at least one frame or carrier element and printed circuit board and frame or carrier element
04/23/2014CN102293071B Wiring board and method for manufacturing same
04/23/2014CN102223757B Wiring board and method for manufacturing wiring board
04/22/2014US8703861 Streak-free tire dressing
04/22/2014US8702273 Mounting arrangement and method for light emitting diodes
04/22/2014US8701283 Integrated capacitor having reversed plates
04/22/2014US8701282 Method for manufacturing a biosensor
04/22/2014US8701281 Substrate metallization and ball attach metallurgy with a novel dopant element
04/22/2014US8701279 Method for assembling an electronic device
04/17/2014WO2014058577A1 Eye-of-the needle pin contact
04/17/2014WO2014058267A1 Method for forming precision printed circuit board in which circuit pattern and communication line inside through-hole are formed
04/17/2014WO2014058265A1 Method for forming two-sided printed circuit board formed by printing circuit pattern and communication line inside through-hole
04/17/2014WO2014058264A1 Printed circuit board printing apparatus for forming conduction line on circuit pattern and inside through-hole
04/17/2014WO2014058131A1 Method for manufacturing printed circuit film attachment-type led module
04/17/2014WO2014057761A1 High-frequency signal line
04/17/2014WO2014057759A1 High frequency signal transmission line and electronic equipment
04/17/2014WO2014056977A1 Printed circuit board for populating with illumination bodies, comprising a variable working window
04/17/2014WO2014056834A1 Method for producing a light generation unit
04/17/2014WO2014033115A3 Electrical fluid heating device for a motor vehicle
04/17/2014WO2013083600A3 Novel adhesion promoting agents for metallization of substrate surfaces
04/17/2014WO2012164233A3 Screen printing machine and method
04/17/2014US20140107527 Universal measuring module for medical application and method for assembling the measuring module
04/17/2014US20140106620 Connector assembly
04/17/2014US20140106593 Electrical connector assembly and method of assembling the same
04/17/2014US20140106119 Pattern forming method, method for manufacturing electronic device by using the same, and electronic device
04/17/2014US20140104803 Circuit board incorporating electronic component and manufacturing method thereof
04/17/2014US20140104792 Devices Having Flexible Printed Circuits With Bent Stiffeners
04/17/2014US20140104786 Electronic module with heat spreading enclosure
04/17/2014US20140104746 In-molded capacitive switch
04/17/2014US20140104543 Method for integrating camera on liquid crsytal panel, liquid crystal panel and liquid-crystal display device
04/17/2014US20140104509 Touch panel and manufacturing method thereof
04/17/2014US20140103957 Reactive material for integrated circuit tamper detection and response
04/17/2014US20140103538 Enhanced electrochemical deposition filling
04/17/2014US20140103097 Circuit board, semiconductor device, and method of manufacturing semiconductor device
04/17/2014US20140102777 Package substrate and method of fabricating the same
04/17/2014US20140102775 Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
04/17/2014US20140102774 Radiofrequency absorptive filter
04/17/2014US20140102772 Packaging carrier and manufacturing method thereof and chip package structure
04/17/2014US20140102771 Flexible circuit board and method for production thereof
04/17/2014US20140102770 Core substrate, manufacturing method thereof, and structure for metal via
04/17/2014US20140102769 System for depositing microwire
04/17/2014US20140102768 Wiring board and method for manufacturing the same
04/17/2014US20140102767 Multi-layer type printed circuit board and method of manufacturing the same
04/17/2014US20140102766 Multi-layer type coreless substrate and method of manufacturing the same
04/17/2014US20140102765 Multilayer Electronic Structures with Improved Control of Dielectric Thickness
04/17/2014US20140102764 Conductive laminate, transparent conductive laminate with patterned wiring, and optical device
04/17/2014US20140102626 Method for making an electrical circuit
04/17/2014US20140102623 Resin composition for insulating layer for multi-layered printed board
04/17/2014US20140102487 Device for automatically cleaning printed circuit board and the method using the same
04/17/2014US20140101935 Method for manufacturing printed circuit board
04/17/2014US20140101934 Method of manufacturing a printed circuit board assembly sheet
04/17/2014DE112012003145T5 Stromschienenschneideeinheit, Stromschienenschneideverfahren und Innenbeleuchtungsvorrichtung für ein Fahrzeug Busbar cutting unit busbar cutting method and interior lighting device for a vehicle
04/17/2014DE102013218423A1 Verfahren zum Herstellen einer Lötverbindung und Schaltungsbauteil A method for forming a solder connection and circuit component
04/16/2014EP2720525A1 Surface mounting gasket and method of manufacturing same
04/16/2014EP2720519A1 Metal foil patterned-laminate, metal foil laminate, metal foil laminate substrate, solar cell module and manufacturing method for metal foil patterned-laminate
04/16/2014EP2720315A1 Method of manufacturing internal antenna by laser
04/16/2014EP2719799A1 Liquid crystal polymer-copper clad laminate and copper foil used for liquid crystal polymer-copper clad laminate
04/16/2014EP2719791A1 Method for applying an image of an electrically conductive material onto a recording medium and device for ejecting droplets of an electrically conductive fluid
04/16/2014EP2719497A1 Solder paste
04/16/2014EP2719486A1 Bonding material and bonded object produced using same
04/16/2014EP2719264A2 Method for producing circuit boards and complete circuit board panels
04/16/2014EP2719263A1 Printed circuit board and control device for a vehicle transmission comprising the printed circuit board
04/16/2014CN203554806U Flexible plate grinding tool
04/16/2014CN203554805U Hand-operated solder paste screen printing platform for surface mounted technology
04/16/2014CN203554804U Chip mounter clamping plate mechanism
04/16/2014CN203554803U Chip mounter
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