Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2014
12/10/2014CN104202915A 一种可传送多尺寸pcb板的贴片机传送机构 More than one kind of size can be transferred Mounter pcb board transport mechanism
12/10/2014CN104202914A 一种设有定位装置的贴片机pcb传送机构 A transport mechanism Mounter pcb positioning device features
12/10/2014CN104202913A 一种贴片机的pcb传送机构 A patch machine pcb transport mechanism
12/10/2014CN104202912A 一种具有定位功能的贴片机pcb传送机构 Mounter pcb transport mechanism having a positioning function
12/10/2014CN104202911A 一种贴片机 A patch machine
12/10/2014CN104202910A 精细线路多层电路板的孔壁清除钻污工艺 Hole wall fine line multilayer circuit board technology Smear Clear
12/10/2014CN104202909A 高导热金属电路板的生产方法 High thermal conductivity metal circuit board production method
12/10/2014CN104202908A 一种fpc补强片贴装头装置 One kind of fpc reinforcement piece placement head unit
12/10/2014CN104202907A 一种uv印刷法制作沉铜电镀导通孔双面线路板的工艺 One kind uv printing production of copper plated vias Shen sided circuit board technology
12/10/2014CN104202906A 一种电路板插接系统 A circuit board plug system
12/10/2014CN104202905A 一种pcb及其布线方法 One kind of pcb and wiring method
12/10/2014CN104202904A 具有侧面凹槽的电路板的压合结构及电路板的制作方法 The method of making a circuit board having a side recess nip structure and circuit board
12/10/2014CN104200316A 一种smt闭环集成优化系统及其优化方法 A closed-loop optimization system integration and optimization methods smt
12/10/2014CN104191064A 回流焊出口简易接驳台 Easy export Reflow connected to Taiwan
12/10/2014CN102876277B 粘接剂组合物和使用该组合物的电路连接膜，以及电路部件的连接方法和电路连接体 The adhesive composition and the circuit-connecting film using the composition, and a circuit member connection method and the circuit-connected body
12/10/2014CN102843873B 一种多功能异型贴片机贴装头装置 A multifunctional device placement head shaped Mounter
12/10/2014CN102843858B 用于固设一半导体芯片的线路基板及其制造方法 Circuit substrate is fixedly arranged and a semiconductor chip manufacturing method for
12/10/2014CN102821550B 一种纳米结构复合led陶瓷基板及其制造方法 A nano-structured composite led ceramic substrate and manufacturing method
12/10/2014CN102802361B 半挠性印刷线路板的制作方法 Semi-flexible printed circuit board production methods
12/10/2014CN102800541B 一种低温共烧陶瓷堆叠保护元件及其制作方法 Low-temperature co-fired ceramic stack protection device and manufacturing method
12/10/2014CN102740603B 一种调整pcb底片尺寸的方法 An adjustment method pcb size negatives
12/10/2014CN102695369B 软性线路基板的制造方法 The method of manufacturing the flexible circuit substrate
12/10/2014CN102686051B Pcb的加工方法以及pcb Pcb processing methods and pcb
12/10/2014CN102686026B 一种柔性电路板、覆晶薄膜及制作方法 A flexible circuit boards, chip on films and production methods
12/10/2014CN102638944B 电路连接用粘接薄膜、连接结构体以及其制造方法 Circuit-connecting adhesive film, the connection structure and a manufacturing method
12/10/2014CN102625596B 焊接插件式元件于电路板的方法及焊接系统 Methods of welding plug-in components on the circuit board and soldering systems
12/10/2014CN102625582B 铝基板自动贴胶机 Aluminum plate automatic machine gum paste
12/10/2014CN102595765B 电路板模组及其制作方法 Circuit board module and production methods
12/10/2014CN102473794B 用于为太阳能电池制造薄膜状电连接器的方法、这样制造的连接元件以及用于把至少两个太阳能电池电连接为太阳能模块的方法 The method of manufacturing a thin film-like electrical connector for a solar cell is used, so that the connecting element and a method for producing the at least two solar cells electrically connected to the solar module
12/10/2014CN102461348B 电极基体 Electrode matrix
12/10/2014CN102450116B 部件组装系统及部件组装方法 Component assembly systems and components assembly method
12/10/2014CN102400116B 用于印刷电路板的镀覆装置 For plating of printed circuit board apparatus
12/10/2014CN102369258B 导电膜去除剂及导电膜去除方法 Conductive film removal agent conductive film removal method
12/10/2014CN102369110B 丝网印刷系统和用于清洁丝网印刷系统的掩模的方法 Screen printing system and method for screen printing mask cleaning system of
12/10/2014CN102333612B 喷流焊料槽 Wave soldering tank
12/09/2014USRE45279 Process for silver plating in printed circuit board manufacture
12/09/2014US8910106 Capacitor arrangement assisting method and capacitor arrangement assisting device
12/09/2014US8908387 Wiring board and method for manufacturing the same
12/09/2014US8908386 Printed circuit board assembly chip package component and soldering component
12/09/2014US8908385 Interface module
12/09/2014US8908378 System including a plurality of encapsulated semiconductor chips
12/09/2014US8908377 Wiring board and method for manufacturing the same
12/09/2014US8907489 Wiring substrate, method of manufacturing the same, and semiconductor device
12/09/2014US8907475 Pb-free solder-connected structure
12/09/2014US8907464 Helix substrate and three-dimensional package with same
12/09/2014US8907376 Stretchable electronic circuit
12/09/2014US8907229 EMI shielding gasket
12/09/2014US8907228 Circuit structure of electronic device and its manufacturing method
12/09/2014US8907226 Conductor for flexible substrate and fabrication method of same, and flexible substrate using same
12/09/2014US8907225 Structures and methods related to detection, sensing, and/or mitigating undesirable structures or intrusion events on structures
12/09/2014US8906838 Microelectronic cleaning and arc remover compositions
12/09/2014US8906787 Thin film compositions and methods
12/09/2014US8906177 Method for controlling glue flow
12/09/2014US8905772 Stretchable and foldable electronic devices
12/09/2014US8905614 Heat radiating printed circuit board and chassis assembly having the same
12/09/2014US8904929 Printing screens, frames therefor and printing screen units
12/09/2014US8904632 Method to make a multilayer circuit board with intermetallic compound and related circuit boards
12/09/2014US8904631 Method of fabricating an interconnect device
12/09/2014US8904630 Method of placing a chip assembly in a socket housing
12/04/2014US20140357147 Core of printed circuit board and method of manufacturing the same
12/04/2014US20140357021 Multi-chip module with stacked face-down connected dies
12/04/2014US20140356635 Substrate comprising inorganic material that lowers the coefficient of thermal expansion (cte) and reduces warpage
12/04/2014US20140355234 Low-profile circuit board assembly
12/04/2014US20140355229 Surface Treated Copper Foil and Laminate Using the Same
12/04/2014US20140355226 Anisotropic conductive film laminate, display device having the same, and method for manufacturing the display device
12/04/2014US20140355225 Formulated resin compositions for flood coating electronic circuit assemblies
12/04/2014US20140355222 Electronic modules having grounded electromagnetic shields
12/04/2014US20140355218 Panel-Molded Electronic Assemblies
12/04/2014US20140355215 Embedded Heat Slug to Enhance Substrate Thermal Conductivity
12/04/2014US20140353895 Carrying apparatus
12/04/2014US20140353362 Laser Ablation Process for Manufacturing Submounts for Laser Diode and Laser Diode Units
12/04/2014US20140353027 Printed wiring board and method for manufacturing printed wiring board
12/04/2014US20140353021 Wiring board and method of manufacturing the same
12/04/2014US20140353018 Interlayer connection substrate and its manufacturing method
12/04/2014US20140353017 Printed wiring board and method for manufacturing the same
12/04/2014US20140353016 Circuit substrate and method of forming circuit pattern
12/04/2014US20140353014 Combined circuit board and method of manufacturing the same
12/04/2014US20140353010 Electronic Component and Method of Manufacturing the Electronic Component
12/04/2014US20140353007 Wired circuit board
12/04/2014US20140353006 Multilayer circuit board and method for manufacturing same
12/04/2014US20140353003 Touch-screen conductive film and manufacturing method thereof
12/04/2014US20140352144 Methods for improving electrical isolation of patterned transparent conductive films
12/04/2014US20140352141 Bonding device
12/02/2014US8904315 Circuit arrangements and associated apparatus and methods
12/02/2014US8903495 Flexible circuit electrode array embedded in a cured body
12/02/2014US8902610 Electronic device
12/02/2014US8902603 Solder and lead free electronic circuit and method of manufacturing same
12/02/2014US8902600 Electrically activatable integrated mechanical anti-rollback device with one or more positions
12/02/2014US8902394 Display device comprising a flexible board including a first wiring portion that is narrower than a second wiring portion and wherein the second wiring portion does not overlap a terminal portion
12/02/2014US8901741 Interconnect structures with engineered dielectrics with nanocolumnar porosity
12/02/2014US8901728 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
12/02/2014US8901725 Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same
12/02/2014US8901724 Semiconductor package with embedded die and its methods of fabrication
12/02/2014US8901716 Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
12/02/2014US8901686 Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board
12/02/2014US8901464 Variable watt density layered heater
12/02/2014US8901434 Board unit and method of fabricating the same
12/02/2014US8901433 Individually addressable band electrode arrays and methods to prepare the same
12/02/2014US8901431 Printed wiring board and method for manufacturing printed wiring board
12/02/2014US8900741 Protective circuit board and battery pack using the same
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