Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2012
06/20/2012CN202282914U 一种印制板转接板装配工装 One kind of PCB assembly tooling adapter plate
06/20/2012CN202282913U 一种薄板固定治具 One kind of sheet fixed jig
06/20/2012CN202282912U 一种全自动曝光菲林检查清洁台 A fully automatic exposure film inspection cleaning station
06/20/2012CN202281902U Novel film aligning platform for circuit board
06/20/2012CN202278792U 一种玻纤布低流动性覆铜板 One kind of fiberglass cloth illiquid CCL
06/20/2012CN1883240B Methods and devices for manufacturing of electrical components and laminated structures
06/20/2012CN102510717A LED inserter
06/20/2012CN102510714A Device for removing paper and cutting pins for vertical component
06/20/2012CN102510683A Method for manufacturing circuit board
06/20/2012CN102510682A Method for producing plug-in gold-plated long-and-short fingers by adopting leap-frog re-etching method
06/20/2012CN102510681A Manufacturing method for golden finger and circuit board with golden finger
06/20/2012CN102510680A Manufacturing process for circuit board with long and short gold fingers
06/20/2012CN102510679A Method for processing rigid-flexible printed circuit board (PCB)
06/20/2012CN102510678A Processing method of flexible folding region of soft and hard combination circuit board and soft and hard combination circuit board
06/20/2012CN102510677A PIN needle dismantling machine and state recognition control method thereof
06/20/2012CN102510676A Method for adding teardrop in printed circuit board (PCB) during computer aided manufacturing (CAM)
06/20/2012CN102510675A Method for electroplating surface of substrate
06/20/2012CN102510674A Pinter, method, system and processor for manufacturing printed circuit board
06/20/2012CN102510673A Transfer printing wiring method
06/20/2012CN102510672A Method for manufacturing radiofrequency transmission substrates
06/20/2012CN102510671A Method for producing anti-corrosion pattern in production of printed circuit board
06/20/2012CN102510670A Method and tool for manufacturing flexible PCB (printed circuit board)
06/20/2012CN102510669A Method for chemically cleaning copper surface of substrate
06/20/2012CN102510668A Super thick copper PCB plate production method and its circuit board
06/20/2012CN102510667A CNC (Computer Numerical Control) board splitting production method without NPTH (Non Plating Through Hole) hole positioning
06/20/2012CN102510666A Process for machining blind-drilled counter bore in high-density interconnection printed circuit board
06/20/2012CN102510665A Method for processing circuit board
06/20/2012CN102510664A Method for solving thin oil of circuit of PCB (printed circuit board)
06/20/2012CN102510663A Printed board component and processing method thereof
06/20/2012CN102510662A Novel LED sinkless copper plated lamp tape circuit board and manufacturing process thereof
06/20/2012CN102510661A Anisotropic electroconductive film and circuit board using same
06/20/2012CN102510660A Single-layer impedance printed circuit board and manufacturing method thereof
06/20/2012CN102506705A Method and device for obtaining coordinates of positioning mark on PCB (Printed Circuit Board) and patch device
06/20/2012CN102505134A Aluminum plate for radiating substrate and treatment method thereof
06/20/2012CN102501575A Screen printing apparatus
06/20/2012CN102500861A Adjustable tin furnace jig
06/20/2012CN101877945B Method for removing via stub and PCB designed by using the method
06/20/2012CN101873767B Sodium-sprayed circuit board
06/20/2012CN101742810B Multilayered wiring board
06/20/2012CN101682983B Wiring substrate, semiconductor package, and electronic device
06/20/2012CN101632156B Printable semiconductor structures and related methods of making and assembling
06/20/2012CN101594749B Manufacture method of a electric conductor for interlayer connection
06/20/2012CN101594729B Circuit board capable of compensating capacitance characteristics of via stump
06/20/2012CN101438210B Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board
06/20/2012CN101401039B Photosensitive composition, photosensitive film, method for permanent pattern formation using said photosensitive composition, and printed board
06/20/2012CN101316485B Electronic component module and method of manufacturing the same
06/20/2012CN101060205B Flat display panel and connection structure
06/20/2012CN101047067B Thin film capacitor and method of manufacturing the thin film capacitor
06/20/2012CN101035412B Method for manufacturing substrate by imprinting
06/20/2012CN101004979B Double layer capacitor and its combination and method for mounting it on print circuit board
06/19/2012US8204138 Symbol-based signaling device for an electromagnetically-coupled bus system
06/19/2012US8202622 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
06/19/2012US8202566 Method of producing an electronic unit having a polydimethylsiloxane substrate and circuit lines
06/19/2012US8201328 Coaxial cable to printed circuit board interface module
06/19/2012US8201327 Multielectrode
06/19/2012US8201326 Method of manufacturing a semiconductor device
06/19/2012US8201325 Method for producing an integrated device
06/19/2012US8201324 Method of manufacturing electronic component embedded circuit board
06/19/2012CA2682600C Non-planar circuit board and a method for fabricating the same
06/14/2012WO2012078892A1 Combination stencil printer and dispenser and related methods
06/14/2012WO2012078889A1 Combination stencil printer and dispenser and related methods
06/14/2012WO2012078881A1 Combination stencil printer and dispenser and related methods
06/14/2012WO2012078493A1 Electrical interconnect ic device socket
06/14/2012WO2012078377A1 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
06/14/2012WO2012078335A2 Hybrid-core through holes and vias
06/14/2012WO2012077548A1 Conductive paste, conductive film-attached base material using the conductive paste, and method for manufacturing conductive film-attached base material
06/14/2012WO2012077461A1 Photoreactive resin composition
06/14/2012WO2012077447A1 Method for mounting semiconductor elements, and mounted body
06/14/2012WO2012077415A1 Pb-FREE SOLDER ALLOY HAVING Zn AS MAIN COMPONENT
06/14/2012WO2012077288A1 Multilayer printed wiring board and method of manufacturing same
06/14/2012WO2012076166A1 Printed circuit board
06/14/2012WO2012031863A3 Encapsulation and production of an encapsulated printed circuit board assembly
06/14/2012US20120150061 Sensor for Detecting Cancerous Tissue and Method of Manufacturing the Same
06/14/2012US20120149136 Fabrication method of semiconductor integrated circuit device
06/14/2012US20120148862 Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board
06/14/2012US20120148799 Aligned nanoarray and method for fabricating the same
06/14/2012US20120147568 Printed circuit board for use in gigabit-capable passive optical network and method for laying out the printed circuit board
06/14/2012US20120147448 Electrochromic device
06/14/2012US20120146971 Display device and method of manufacturing the same
06/14/2012US20120145797 Electronic Storage Devices, Programming Methods, and Device Manufacturing Methods
06/14/2012US20120145666 Method of manufacturing multilayer wiring substrate
06/14/2012US20120145665 Method of manufacturing printed circuit board
06/14/2012US20120145447 Via structure, method for forming the via structure, and circuit board with the via structure and method for manufacturing the circuit board
06/14/2012US20120145445 Resin multilayer substrate and method for manufacturing the resin multilayer substrate
06/14/2012US20120145441 Dielectric layer of printed circuit board, method for preparing the same, and printed circuit board including the same
06/14/2012US20120144667 Multilayer printed wiring boards with holes requiring copper wrap plate
06/14/2012US20120144666 Method for manufacturing wiring board
06/14/2012US20120144665 Impedance tuning for circuit board signal path surface pad structures
06/14/2012US20120144664 Tv tuner and the manufacturing method thereof
06/14/2012DE112010002902T5 Siebdruckvorrichtung und Siebdruckverfahren Screen printer and screen printing method
06/14/2012DE102010062788A1 Method for manufacturing electronic device for e.g. motor controller, in door of vehicle, involves fixing and hotly applying films on carrier by application of vacuum and fixed to electronics component by scrubbing at carrier
06/14/2012DE102010062759A1 Printed circuit board arrangement e.g. high-density interconnect printed circuit board arrangement, for gear box control device of motor car, has two printed circuit boards extending adjacent to each other in common plane
06/14/2012DE102010062758A1 Printed circuit board arrangement for electronic control device used in motor car, has contacting element overmolded with overmold material, which is provided at end face of upper circuit board contacted with lower circuit board
06/14/2012DE102010062654A1 Electrical transmission control device for controlling transmission of vehicle, has electrically conductive connecting device that is executed as electrically conductive stranded wire
06/14/2012DE102010062653A1 Steuermodul und Verfahren zu seiner Herstellung Control module and method for its preparation
06/14/2012DE102010054050A1 Leiterplattenanordnung mit einem zwischen einer Leiterplatte und einem Leiterplattenträger geklemmten Mikroschalter Printed circuit board assembly with a clamped between a circuit board and a board support micro switch
06/14/2012DE102006045750B4 Leitendes Klebemittel, dessen Verwendung und Verfahren zu dessen Herstellung Conductive adhesive, its use and process for its preparation
06/14/2012DE102005002751B4 Leiterplatte mit funktionalem Element und Verfahren zur Positionisierung eines funktionalen Elements auf einer Leiterplatte Circuit board with a functional element and method for Positionisierung a functional element on a printed circuit board
06/13/2012EP2464203A1 Room temperature low contact pressure method
06/13/2012EP2464202A1 Multi-Layer Substrate and Electronic Device Having the Same