Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2012
07/26/2012WO2012098697A1 Substrate inspecting apparatus, substrate inspecting system, and method for displaying image for checking substrate inspection results
07/26/2012WO2012098619A1 Wiring substrate, method for manufacturing wiring substrate, and via paste
07/26/2012WO2012098616A1 Wiring substrate having built-in component
07/26/2012WO2012098595A1 Wiring substrate and semiconductor device using same
07/26/2012WO2012097912A1 Circuit board and method for producing a circuit board
07/26/2012WO2012097618A1 Single-board and manufacturing method therefor
07/26/2012WO2012074345A3 Flexible printed circuit board and a production method therefor
07/26/2012US20120190247 Two-Piece Connector Assembly
07/26/2012US20120189874 Printed circuit board and method for manufacturing the same, and fuel cell
07/26/2012US20120189818 Structure and method for manufacturing the same
07/26/2012US20120189144 Packaged Microphone with Reduced Parasitics
07/26/2012US20120188787 System for illuminating a vehicle interior assembly
07/26/2012US20120188738 Integrated led in system-in-package module
07/26/2012US20120188734 Wiring board and method for manufacturing the same
07/26/2012US20120188729 Printed circuit board and manufacturing method thereof
07/26/2012US20120188728 Compliant insert for electronics assemblies
07/26/2012US20120188025 Structure and method for reducing em radiation, and electric object and manufacturing method thereof
07/26/2012US20120187830 High Intensity Light Source
07/26/2012US20120187821 Electrical conductor and a production method therefor
07/26/2012US20120187078 Manufacturing method of rigid and flexible composite printed circuit board
07/26/2012US20120187077 Micro-electromechanical systems (mems) microphone and method of manufacturing the same
07/26/2012US20120186978 Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
07/26/2012US20120186867 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
07/26/2012US20120186866 Wiring board and method for manufacturing the same
07/26/2012US20120186864 Wiring board and method for manufacturing the same
07/26/2012US20120186861 Wiring board with built-in electronic component and method for manufacturing the same
07/26/2012US20120186859 Wiring board and method of manufacturing the wiring board
07/26/2012US20120186855 Substrate of touch panel in manufacturing and the method for forming the same
07/26/2012US20120186852 Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore
07/26/2012US20120186080 Creating conductivized traces for use in electronic devices
07/26/2012US20120186079 Method of protecting printhead die face
07/26/2012DE112010000032T5 Elektronische Schaltungsvorrichtung An electronic circuit device
07/26/2012DE102011100556A1 Method for applying digitally controlled applied conductive layer regions on elastic and/or deformable surfaces of bodies or components, involves forming chamber, where edge areas of chamber are in fixed connection with substrate
07/26/2012DE102011100555A1 Method for manufacturing bendable and/or resilient substrate, involves adjusting material properties of conductive layer in deformation minimized layer region so as to bend substrate
07/26/2012DE102011009507A1 Leiterplattentrenneinrichtung PCB separator
07/26/2012DE102011003007A1 Leiterplatte mit Überdruckventil, Insufflator Circuit board with pressure relief valve, insufflator
07/25/2012EP2480058A1 Multi-layer substrate and manufacture method thereof
07/25/2012EP2480057A2 Circuit board design
07/25/2012EP2480056A2 Circuit board design
07/25/2012EP2480055A2 Circuit board design
07/25/2012EP2480054A2 Circuit board design
07/25/2012EP2480053A2 Circuit board design
07/25/2012EP2480052A1 Ceramic circuit board and process for producing same
07/25/2012EP2479786A1 Pressing device and pressing method
07/25/2012EP2479690A2 Method and Apparatus for Configurable Circuitry
07/25/2012EP2479611A2 Chemically amplified positive resist composition and patterning process
07/25/2012EP2479310A1 Method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity
07/25/2012EP2479228A1 Adhesive film, multilayer circuit board, electronic component, and semiconductor device
07/25/2012EP2478753A1 Method for producing a ceramic component, ceramic component and component assembly
07/25/2012EP2478752A1 Substrate for electronic circuits
07/25/2012EP2478751A1 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
07/25/2012EP1741650B1 Anisotropic conductive film holding tape and mounting method
07/25/2012EP1713956B1 Stabilised 1, 2-dichloroethylene compositions
07/25/2012CN202353955U Wave-soldering jig
07/25/2012CN202353954U Solder bridge prevention fixture
07/25/2012CN202353953U Solder pallet fixture
07/25/2012CN202353952U Rapid glue sealing screen board
07/25/2012CN202353951U Chip mounter suction nozzle
07/25/2012CN202353950U Adhesive tape sticking device of PCB (Printed Circuit Board)
07/25/2012CN202353949U Continuous automatic board pasting device
07/25/2012CN202353948U Mask plate applied in B2it+FCA (fixed channel allocation)
07/25/2012CN202353947U 喷淋装置 Sprinkler
07/25/2012CN202353946U Multi-layer board laminating-fixing device
07/25/2012CN202353945U Jig for preventing golden finger from being wetted by tin
07/25/2012CN202353944U PCB (Printed Circuit Board) carrier
07/25/2012CN202353943U Cooling device for printed circuit board (PCB) jig
07/25/2012CN202353942U Fool-proof jig
07/25/2012CN202353941U Printed circuit board (PCB) supporting frame
07/25/2012CN202353931U Electrochemical-migration-resistant circuit board structure
07/25/2012CN202353930U Circuit board resisting electrochemical migration
07/25/2012CN202347115U PCB (printed circuit board) vertical plating wire and raffinate collecting device for PCB vertical plating wire
07/25/2012CN202344095U Jig for tin furnace treatment
07/25/2012CN202344094U Tin electrodeposite preventing jig
07/25/2012CN202344090U Adjustable solder pallet fixture
07/25/2012CN202344077U Tin furnace of wave soldering machine
07/25/2012CN1705427B Electronic component mounting apparatus and electronic component mounting method
07/25/2012CN102612867A Solder piece, small solder piece provider, and method for producing solder piece
07/25/2012CN102612866A Contact device for fastening to a circuit board, method for fastening a contact device to a circuit board, and circuit board
07/25/2012CN102612666A Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, and permanent pattern, method for forming same, and printed substrate
07/25/2012CN102612314A Inspection system, simulation method and system, suitability determination method for determination standard value
07/25/2012CN102612278A Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate
07/25/2012CN102612277A Method of silver paste grouting process for high-precision circuit board
07/25/2012CN102612276A Manufacturing process for pores of multilayer HDI (high density interconnector) circuit board
07/25/2012CN102612275A Reworking method of hole breakout board in electroplating process of printed circuit board
07/25/2012CN102612274A Wiring board and method for manufacturing the same
07/25/2012CN102612273A Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component
07/25/2012CN102612272A Fixed device and method for installing output lines on circuit board
07/25/2012CN102612271A Three-dimensional circuit on structure member and manufacturing method thereof
07/25/2012CN102612270A Plane resistance etching method
07/25/2012CN102612269A All-printed circuit board
07/25/2012CN102612268A Production method of printed circuit board with oversized layout size
07/25/2012CN102612267A Processing method of glass fibre board
07/25/2012CN102612266A Manufacturing method of circuit board
07/25/2012CN102612265A Component built-in wiring board and manufacturing method of component built-in wiring board
07/25/2012CN102612264A Component built-in wiring board and manufacturing method of component built-in wiring board
07/25/2012CN102612262A Solder pad structure and manufacture method thereof
07/25/2012CN102612261A High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board
07/25/2012CN102612260A Reinforced FPC (Flexible Printed Circuit) board and manufacturing method
07/25/2012CN102612258A Forming processing hole for printed circuit board
07/25/2012CN102612256A Wiring member and process for producing the same
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