Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2012
07/25/2012CN102612252A Printed wiring board
07/25/2012CN102608868A Photosensitive element
07/25/2012CN102605397A Electroplating system and electroplating method
07/25/2012CN102601363A Electrical plating and catalytic uses of metal nanomaterial compositions
07/25/2012CN102137551B Production method of high-frequency four-layer circuit board
07/25/2012CN102036480B Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof
07/25/2012CN102014590B Production method of multi-layer printed circuit board and multi-layer printed circuit board
07/25/2012CN101998770B Method for manufacturing etched film resistance circuit board
07/25/2012CN101998758B Preparation method of amorphous diamond heat dissipation and insulation film layer of LED printed circuit board
07/25/2012CN101965097B Printed circuit board and its manufacture method
07/25/2012CN101946568B Method for manufacturing board with built-in electronic elements
07/25/2012CN101925267B Method for manufacturing printed circuit board
07/25/2012CN101894823B Composite material structure, circuit board structure comprising same and forming method thereof
07/25/2012CN101888738B Embedded substrate provided with side-inclined plane line layer assembly and manufacturing method thereof
07/25/2012CN101873761B Circuit board having optical readable mark code and manufacturing method thereof
07/25/2012CN101835348B CCD (Charge Coupled Device) galvanometer type laser welding device and method
07/25/2012CN101808478B Plug hole BGA screen and plug hole method of printed circuit board
07/25/2012CN101738861B Light-sensitive resin composite and method for manufacturing printed circuit board using same
07/25/2012CN101730388B 电路板及其制作方法 Circuit board and its manufacturing method
07/25/2012CN101688315B A method for etching copper and recovery of the spent etching solution
07/25/2012CN101621888B Method and system for realizing wiring of sensitive signal wire in printed circuit board
07/25/2012CN101577232B Method of manufacturing printed circuit board
07/25/2012CN101528001B Flexible printed circuit board and manufacturing method for the same
07/25/2012CN101436705B Method for manufacturing antenna element and antenna module with the same
07/25/2012CN101378635B Method for producing circuit board with local electric thick gold
07/25/2012CN101365291B Printed circuit board, design method thereof and terminal product main board
07/25/2012CN101358050B Conductive pattern formation ink, conductive pattern and wiring substrate
07/25/2012CN101355852B Printed circuit board manufacturing system and manufacturing method thereof
07/25/2012CN101273445B Atmosphere controlled joint device, method and electronic device
07/25/2012CN101151722B Treatment of items
07/25/2012CN101114732B Electronic device and manufacturing method thereof
07/24/2012US8227331 Method for depositing a solder material on a substrate
07/24/2012US8227175 Method for smoothing printed circuit boards
07/24/2012US8226804 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating
07/24/2012US8225503 Method for manufacturing board with built-in electronic elements
07/24/2012US8225501 Method for making thermoacoustic device
07/24/2012US8225500 Method of making a conductive elastomeric coplanar connector with mechanical pin
07/24/2012US8225499 Method for manufacturing a circuit board structure, and a circuit board structure
07/23/2012DE202012003976U1 Betriebsgerät für Leuchtmittel Operating device for lamps
07/19/2012WO2012096774A1 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
07/19/2012WO2012096765A1 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
07/19/2012WO2012096764A1 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
07/19/2012WO2012096763A1 Method of making an electronic device having a liquid crystal polymer solder mask and related devices
07/19/2012WO2012096537A2 Novel printed circuit board and method of manufacturing same
07/19/2012WO2012096413A1 Board connecting terminal
07/19/2012WO2012096004A1 Solder-attachment inspection method, solder-attachment inspection device, and pcb-inspection system
07/19/2012WO2012096003A1 Solder-attachment inspection method, pcb-inspection system, and solder-attachment inspection device
07/19/2012WO2012054505A3 Water reducible coating compositions including carboxy ester ketals, methods of manufacture, and uses thereof
07/19/2012US20120184231 Wireless communications using multi-bandpass transmission line with slot ring resonators on the ground plane
07/19/2012US20120184071 Surface coating method, semiconductor device, and circuit board package
07/19/2012US20120183775 Process for production of core-shell particles, core-shell particles, and paste composition and sheet composition which contain same
07/19/2012US20120183679 Method for making an electrochemical sensor strip
07/19/2012US20120182746 Led light bar and method for manufacturing the same
07/19/2012US20120182699 Modular surface mount package for a system on a chip
07/19/2012US20120182697 Board module and fabrication method thereof
07/19/2012US20120181560 Led wiring board, light emitting module, method for manufacturing led wiring board and method for manufacturing light emitting module
07/19/2012US20120181341 One and Two-Part Printable EM Tags
07/19/2012US20120181078 Multilayer printed wiring board
07/19/2012US20120181074 Wiring board and method for manufacturing the same
07/19/2012US20120181073 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
07/19/2012US20120181072 Printed wiring board and method for manufacturing same
07/19/2012US20120181068 Circuit substrate and method of manufacturing same
07/19/2012US20120181064 Capacitive touch panel having dual resistive layer
07/19/2012US20120180313 Manufacturing method for printed wiring board
07/19/2012US20120180312 Core via for chip package and interconnect
07/19/2012US20120180311 Electronic device and fabrication method thereof
07/19/2012US20120180310 Ceramic Multi-Layer Component And Method For The Production Thereof
07/19/2012DE102011000138A1 Verfahren zur selektiven Metallisierung eines Substrats sowie ein nach diesem Verfahren hergestellter Schaltungsträger Process for the selective metallization of a substrate and a circuit substrate prepared by this method
07/18/2012EP2477467A1 Flexible Circuit Electrode Array and Method of Manufacturing the Same
07/18/2012EP2477229A2 Composite transparent conductors and method of forming the same
07/18/2012EP2476723A1 Method for selective metallisation of a substrate and switch holder produced according to this method
07/18/2012EP2476298A1 Circuit configuration having a prescribed capacitance, and method and device for the production thereof
07/18/2012CN202340347U 电路板载具 Circuit-board with
07/18/2012CN202340346U 可扩充式的贴片机贴装头 Expandable placement machine placement head
07/18/2012CN202340345U 一种压装机 A cramping installed
07/18/2012CN202340344U 一种具有机械对位的ccd对位功能双头贴片机 Ccd having a mechanical function of the position on the bit headed Mounter
07/18/2012CN202340343U 用于pcb的自动对位装置 Automatic alignment apparatus for the pcb
07/18/2012CN1994839B Static adsorption device
07/18/2012CN102598887A Multilayer board and manufacturing method thereof
07/18/2012CN102598886A Wiring board and method for producing same
07/18/2012CN102598885A Wiring board and method for producing same
07/18/2012CN102598884A Mounting apparatus and manufacturing method of electronic module
07/18/2012CN102598883A Circuit board, and semiconductor device having component mounted on circuit board
07/18/2012CN102598882A Wiring circuit board and method for manufacturing same
07/18/2012CN102598881A Manufacturing method of circuit board
07/18/2012CN102598879A Device mounting structure and device mounting method
07/18/2012CN102598877A Multi-piece substrate and production method for same
07/18/2012CN102598419A Circuit connecting material and connection structure for circuit member using same
07/18/2012CN102598331A Curved ultrasonic hifu transducer with compliant electrical connections
07/18/2012CN102598258A Multiple surface finishes for microelectronic package substrates
07/18/2012CN102598250A Element mounting substrate, method for manufacturing element mounting substrate, semiconductor module, and portable apparatus
07/18/2012CN102598165A Laminated ceramic electronic component
07/18/2012CN102598003A Apparatus for supporting designing of wiring board, wiring board designing method, program, and wiring board
07/18/2012CN102597877A Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing lead frame, printed wiring board, and method for producing printed wiring board
07/18/2012CN102597329A Composition for metal plating comprising suppressing agent for void free submicron feature filling
07/18/2012CN102597320A Gold displacement plating solution, and method for formation of joint part
07/18/2012CN102597319A Catalyst application solution, electroless plating method using same, and direct plating method
07/18/2012CN102597061A Polyimide precursor and photosensitive resin composition containing the polyimide precursor
07/18/2012CN102596582A Mask for screen printing, screen printing device and screen printing method employing same
07/18/2012CN102596455A Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate