Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/1985
06/25/1985CA1189543A1 Apparatus for conveying flat goods one side of which bears a liquid layer
06/20/1985WO1985002751A1 Partially aligned multi-layered circuitry
06/20/1985WO1985002750A1 Printed circuit board
06/20/1985WO1985002631A1 Plant for the treatment of objects by means of a liquid
06/20/1985WO1985002630A1 Plant for the treatment of objects by means of a liquid
06/20/1985WO1985002629A1 Plant for the treating of objects by means of a liquid
06/19/1985EP0145648A1 Coating device
06/19/1985EP0145613A1 Platable substrates for printed circuits, and method of making them
06/19/1985EP0145557A2 Wave soldering process and capillary solder means for carrying out the process
06/19/1985EP0145549A2 Printed circuit board with marks
06/19/1985EP0145345A2 Solder masks
06/19/1985EP0145327A2 Electrical interface arrangement
06/19/1985EP0145083A2 Electrical connector using a flexible circuit having an impedance control arrangement thereon
06/19/1985EP0145075A2 Stamp and device for providing drops of a viscous liquid on a substrate
06/19/1985EP0144998A2 Rapid solidified soldering filler metals
06/19/1985EP0144944A2 Process for forming conductive through-holes through a dielectric layer
06/19/1985EP0144943A2 Process using plasma for forming conductive through-holes through a dielectric layer
06/19/1985EP0144822A2 Method and apparatus for the continuous production of layered products comprising metal layers
06/19/1985EP0144742A1 Process and apparatus for regenerating an ammoniacal etching solution
06/19/1985EP0144741A1 Electrically conductive powder for mixing with cyanoacrylates and electrically conductive curable composition containing the same
06/19/1985EP0144685A1 Electroless copper plating process
06/19/1985EP0144684A2 Forming Patterns in metallic or ceramic substrates
06/19/1985EP0144612A2 Method for selective electroless plating copper onto a non-conductive substrate surface
06/19/1985EP0144413A1 Printed board for the surface soldering of integrated miniature circuits and manufacturing method of such printed boards
06/19/1985EP0144374A1 Component leg bending device.
06/18/1985US4524240 Universal circuit prototyping board
06/18/1985US4524239 Multi-layer electric circuit board and blanks therefor
06/18/1985US4524098 Board for additive circuits
06/18/1985US4524089 Three-step plasma treatment of copper foils to enhance their laminate adhesion
06/18/1985US4524038 Method of making a vibration-resistant electrical component and connection lead combination, particularly exhaust gas composition sensor
06/18/1985CA1189196A1 Process for the manufacture of substrates to interconnect electronic components and articles made by said process
06/18/1985CA1189019A1 Radiation stress relieving of sulfone polymer articles
06/18/1985CA1188863A1 Cleaning wiper
06/12/1985EP0144147A1 Articles bonded with adhesive mixtures
06/12/1985EP0144063A2 Single exposure process for preparing printed circuits
06/12/1985EP0144055A2 Process and apparatus for producing a continuous insulated metallic substrate
06/12/1985EP0144046A2 Process for forming a mettallurgical pattern with a densified surface on or in a sintered dielectric substrate
06/12/1985EP0143963A2 Electronic components comprising cured vinyl and/or acetylene terminated copolymers and methods for forming the same
06/12/1985EP0143951A2 Process for electroless plating
06/11/1985US4522903 Sequential automatic registration and imagewise exposure of a sheet substrate
06/11/1985US4522888 Electrical conductors arranged in multiple layers
06/11/1985US4522850 Polymeric substrates for electroless metal deposition
06/11/1985US4522683 Adding to sulfuric acid-hydrogen peroxide solutions
06/11/1985US4522671 Using elastically deformable printing stamp to transfer conductivepaste
06/11/1985US4522667 Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion
06/11/1985US4522449 Matrix board
06/11/1985US4521969 Apparatus for electrical connection of multiconductor cables
06/05/1985EP0143531A1 A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself
06/05/1985EP0143530A1 A method for forming an electrically conductive polymer film containing silver and the electrically conductive silver/polymer composition itself
06/05/1985EP0143493A2 Programmable thick film networks and method for making same
06/05/1985EP0093734B1 Method for making through connections in a printed circuit
06/04/1985US4521828 Component module for piggyback mounting on a circuit package having dual-in-line leads
06/04/1985US4521827 Heat sink mounting
06/04/1985US4521503 Highly photosensitive aqueous solvent-developable printing assembly
06/04/1985US4521488 Polyacetal resin composition excellent in heat stability and surface processability and process for surface treating same
06/04/1985US4521476 Hybrid integrated circuit and preparation thereof
06/04/1985US4521469 Copper plastic laminates
06/04/1985US4521449 Process for forming a high density metallurgy system on a substrate and structure thereof
06/04/1985US4521280 Method of making printed circuits with one conductor plane
06/04/1985US4521262 Method for mass producing printed circuit boards
06/04/1985US4520562 Method for manufacturing an elastic composite body with metal wires embedded therein
06/04/1985US4520561 Method of fabricating an electronic circuit including an aperture through the substrate thereof
06/04/1985US4520551 Machine tool
06/04/1985CA1188093A1 Curing device for cirtrak plates
05/1985
05/29/1985EP0142783A2 Method for producing hybrid integrated circuit
05/29/1985EP0142673A1 Ceramic composite body and production thereof
05/28/1985US4520339 Load cell with adjustable bridge circuit
05/28/1985US4520228 Multi-layer conductor plate and a method of making
05/28/1985US4520046 Metal plating on plastics
05/28/1985US4519877 Formation of narrow conductive paths on a substrate
05/28/1985US4519872 Lithography/ le bubble
05/28/1985US4519865 Lamination
05/28/1985US4519851 Method for providing pinhole free dielectric layers
05/28/1985US4519760 Machine for filling via holes in an integrated circuit package with conductive ink
05/28/1985US4519732 Method for the machining of composite materials
05/28/1985US4519658 Electronic package assembly and accessory component therefor
05/28/1985US4519447 System for temperature maintenance
05/28/1985CA1187678A1 Method of bonding electronic components
05/28/1985CA1187674A1 Cast solder leads for leadless semiconductor circuits
05/22/1985EP0142119A1 Arrangement for adapting the contact grid spacing in a printed circuit testing device
05/22/1985EP0142025A2 Improved method for depositing a metal on a surface
05/22/1985EP0141868A1 High resolution phototransparency image forming with photopolymers
05/21/1985US4518738 Powder for use in dry sensitization for electroless plating
05/21/1985US4518667 Automatic repetitive registration and image wise exposure of sheet substrates
05/21/1985US4518465 Method of manufacturing printed wiring boards
05/21/1985US4518449 Electrjku,jj.olu/cleaning, abrasion, adhesives, coating, curing, dielectrics, heat pressing
05/21/1985US4518211 Device for mounting, interconnecting and terminating printed circuits
05/21/1985US4517739 Method for making circuit boards with die stamped contact pads and conductive ink circuit patterns
05/21/1985CA1187352A1 Polymer coatings and methods of applying same
05/15/1985EP0141748A2 Wiring system employing wire mat
05/15/1985EP0141528A2 Conducting or catalysing a chemical reation on a surface especially electroless metal deposition and catalyst systems used therein
05/15/1985EP0141467A2 Device for applying a fixing medium to electronic components, more particularly to chip-type components
05/15/1985EP0141455A2 Lamp holder
05/15/1985EP0141389A2 Process for the production of image-wise structured resists, and dry resist therefor
05/14/1985US4517448 Infrared furnace with atmosphere control capability
05/14/1985US4517254 Adhesive metallization of polyimide
05/14/1985US4517227 Reduction of metal oxide
05/14/1985US4517051 Multi-layer flexible film module
05/14/1985US4517050 Process for forming conductive through-holes through a dielectric layer
05/14/1985US4517045 Apparatus for formation of packaging material
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