Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1984
03/26/1984EP0096710A4 A maskless process for applying a patterned coating.
03/21/1984EP0103347A1 Bendable circuit board and load cell using it
03/21/1984EP0103255A2 Digital, electrical, numerical display apparatus, especially for use in fuel filling stations
03/21/1984EP0103149A1 Poly(arylene sulfide) printed circuit boards
03/21/1984EP0102964A1 Method for making electrical connections between the two faces of a printed circuit board and a printing stamp for the same.
03/20/1984US4438190 Protective coatings for printed circuits
03/20/1984US4438153 Method of and apparatus for the vapor deposition of material upon a substrate
03/20/1984US4437943 Method and apparatus for bonding metal wire to a base metal substrate
03/20/1984US4437932 Dissolution of metals utilizing a furan derivative
03/20/1984US4437931 Using 2-butyne-1,4-diol and substituted diol promoters; etching printed circuit boards
03/20/1984US4437930 Dissolution of metals utilizing ε-caprolactam
03/20/1984US4437929 Dissolution of metals utilizing pyrrolidone
03/20/1984US4437928 As catalyst; etching printed circuit boards
03/20/1984US4437927 Dissolution of metals utilizing a lactone
03/20/1984US4437924 Method of making fine-line die
03/20/1984US4437718 Non-hermetically sealed stackable chip carrier package
03/20/1984US4437603 Automatic wiring machine for printed circuit boards
03/20/1984US4437236 Process for producing an electrical terminal
03/20/1984US4437235 Integrated circuit package
03/20/1984US4437229 Methods of marking and electrically identifying an article
03/20/1984CA1163954A1 Electroplating articles with reduced rotary speed outside of plating tank
03/14/1984EP0102728A1 Bonding and bonded products
03/13/1984US4437141 High terminal count integrated circuit device package
03/13/1984US4437140 Printed circuit device
03/13/1984US4436806 Photopolymerization, curing
03/13/1984US4436766 Photoresists, sputtering, etching
03/13/1984US4436583 Selective etching method of polyimide type resin film
03/13/1984CA1163726A1 Gripping arrangement for an apparatus for automatically laminating circuit boards
03/13/1984CA1163540A1 Process for etching chrome and composition as suitable therefore
03/07/1984EP0102281A2 Adhesion bond-breaking of lift-off regions on semiconductor structures
03/07/1984EP0101994A2 Printed circuit board modification process
03/07/1984EP0101791A2 Multi-layer circuitry
03/07/1984EP0101703A1 Printed electric circuit
03/06/1984US4435741 Electrical circuit elements combination
03/06/1984US4435740 Electric circuit packaging member
03/06/1984US4435611 Connectors for printed circuit boards
03/06/1984US4434544 Multilayer circuit and process for manufacturing the same
03/06/1984CA1163376A1 Modular connector assembly having an electrical contact
03/01/1984WO1984000871A1 Improvements in automatic electronic assembly
02/1984
02/29/1984EP0101503A1 Method for high-speed production of metal-clad articles.
02/28/1984US4434134 Pinned ceramic substrate
02/28/1984US4434123 Rubber core rod with stripes of electroconductivity
02/28/1984US4434022 Process for manufacturing copper-clad laminate
02/28/1984US4433892 Terminal strip with auxiliary support
02/28/1984US4433887 Adjustable and readily solderable sheet-like connectors
02/28/1984US4433805 Soldering method for electric and or electronic components
02/28/1984CA1162778A1 Method for dry sensitization of an insulating surface and powder to be used in the method
02/22/1984EP0101409A1 Printed circuit and process for making the circuit
02/22/1984EP0101359A1 Connector box
02/21/1984US4433223 Pressure-sensitive adhesive and application thereof
02/21/1984US4433009 Coating base material with holes with photopolymer layer, exposure, and development
02/21/1984US4432855 Automated system for laser mask definition for laser enhanced and conventional plating and etching
02/21/1984US4432236 Signal processing circuit of ultrasonic diagnostic apparatus
02/21/1984CA1162354A1 Process for electroless metal plating of a polysulfone substrate
02/16/1984WO1984000664A1 Method and apparatus for correcting printed circuit boards
02/16/1984WO1984000643A1 Solder bearing edge clip
02/15/1984EP0100727A2 Semiconductor device comprising a ceramic base
02/15/1984EP0100452A1 Method for conditioning a substrate for plating
02/14/1984US4432037 Multi-layer printed circuit board and method for determining the actual position of internally located terminal areas
02/14/1984US4431891 Arrangement for making contact between the conductor tracks of printed circuit boards with contact pins
02/14/1984US4431710 Laminate product of ultra thin copper film on a flexible aluminum carrier
02/14/1984US4431707 Presensitizing thick coatings using acidic stannous chloride; preactivation using acidic palladium-chloride; printed circuits
02/14/1984US4431685 Decreasing plated metal defects
02/14/1984US4431478 Etching agent for polyimide type resins and process for etching polyimide type resins with the same
02/14/1984CA1162323A1 Method of producing circuit boards using adhesive coating
02/09/1984EP0091942A4 Metallization of support members.
02/09/1984EP0041949A4 Recessed circuit module and method of making.
02/08/1984EP0100175A2 Chip capacitor having a compliant termination
02/08/1984EP0100144A2 Low cost electronic apparatus construction method
02/07/1984US4430690 Low inductance MLC capacitor with metal impregnation and solder bar contact
02/07/1984US4430365 Ceramics, integrated circuits, semiconductors, masking, etching, dielectrics
02/07/1984US4430173 Additive composition, bath and process for acid copper electroplating
02/07/1984US4430165 Laser-activated electrodepositing method and apparatus
02/07/1984US4430154 Method of producing printed circuit boards
02/07/1984US4430009 Arrangement for securing and electrically contacting a battery in a watch
02/07/1984US4429657 Method, materials and apparatus for manufacturing printed circuits
02/07/1984US4429457 Process for manufacturing a printed circuit board
02/07/1984CA1161787A1 Dry etching of copper patterns
02/02/1984WO1984000464A1 Method of mounting electronic part
02/02/1984WO1984000445A1 Solder bearing terminal pin
02/01/1984EP0099570A2 Coated ceramic substrates for mounting integrated circuits and methods of coating such substrates
02/01/1984EP0099544A1 Method for forming conductive lines and via studs on LSI carrier substrates
02/01/1984EP0099426A1 A process for coating a liquid photopolymerizable composition and a process for producing a printed circuit board thereby
01/1984
01/31/1984US4429348 Printed circuit mounting apparatus especially for use in luminaires
01/31/1984US4429027 In situ photomasking
01/31/1984US4428987 Process for improving copper-epoxy adhesion
01/31/1984US4428986 Method of preparing a beryllia substrate for subsequent autocatalytic deposition of a metallized film directly thereon
01/31/1984US4428796 Adhesion bond-breaking of lift-off regions on semiconductor structures
01/31/1984CA1161570A1 Solder-coating method and apparatus
01/25/1984EP0099174A1 Plated-through hole apparatus and method
01/25/1984EP0099086A2 Process for manufacturing copper-clad laminate and copper-clad laminate
01/24/1984US4427851 Ganged electrical switches for integrated circuit applications
01/24/1984US4427716 Method for predetermining peel strength at copper/aluminum interface
01/24/1984US4427478 Applying photochemically curable adhesive to support, positioning wires, and controlled exposure to light
01/24/1984US4427019 Chemical process apparatus
01/24/1984US4426775 Method for the production of conductor tracks applied to a support
01/24/1984US4426774 Process for producing a circuit module
01/24/1984CA1161174A1 Process for the manufacture of printing forms or printed circuits
01/24/1984CA1161132A1 Lamp socket
01/24/1984CA1161091A1 Method of manufacturing an electric discharge device comprising a glass substrate having a pattern of electrodes, and electric discharge device thus manufactured