Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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07/15/1986 | US4600970 Leadless chip carriers having self-aligning mounting pads |
07/15/1986 | US4600663 Microstrip line |
07/15/1986 | US4600656 Electroless metal plating of plastics |
07/15/1986 | US4600601 Wetting, pivoting |
07/15/1986 | US4600480 Electroless deposition and electrodeposition of metal, stripping |
07/15/1986 | US4600298 Pivotal locking arm for phototool assembly |
07/15/1986 | US4600261 Apparatus and method for protection of electrical contacts |
07/15/1986 | US4600256 Condensed profile electrical connector |
07/15/1986 | US4600137 Method and apparatus for mass soldering with subsequent reflow soldering |
07/15/1986 | US4599966 Solder leveller |
07/09/1986 | EP0186831A2 Method of improving the adhesion between a photosensitive adhesive and a dielectric substrate |
07/09/1986 | EP0186667A1 Mounting semi-conductor chips. |
07/09/1986 | CN85108637A Electronic circuit device and method of producing the same |
07/08/1986 | US4599297 Efficient |
07/08/1986 | US4599277 Control of the sintering of powdered metals |
07/08/1986 | US4599263 Increased tensize strengh |
07/08/1986 | US4599187 Printed circuits |
07/08/1986 | US4599149 Alkylsulfonate salts |
07/08/1986 | US4599134 Cleaning drilled holes in printed circuits |
07/08/1986 | US4599128 Printed circuit boards |
07/08/1986 | US4598858 Oxidation resistance |
07/08/1986 | US4598470 Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate |
07/08/1986 | CA1207464A1 Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
07/03/1986 | WO1986003930A1 Fine line printed conductors fabrication process |
07/02/1986 | EP0186655A2 Process for making a composite circuit board |
07/02/1986 | EP0186550A2 Process for producing multilayer ceramic circuit board with copper |
07/02/1986 | EP0186539A1 Soldering machine |
07/02/1986 | EP0186538A2 Wave-soldering machine |
07/02/1986 | EP0186510A2 Multilayer dry-film positive-acting photoresist |
07/02/1986 | EP0186485A2 High density multilayer printed circuit board |
07/02/1986 | EP0186185A2 Continuous process for fabricating metallic patterns on a thin film substrate |
07/02/1986 | EP0186163A2 Photosensitive ceramic coating composition |
07/02/1986 | EP0186114A2 Photosensitive conductive metal composition |
07/02/1986 | EP0185998A1 Interconnection circuits made from transfer electroforming |
07/02/1986 | EP0185967A2 Process for avoiding blister formation in electroless metallization of ceramic substrates |
07/02/1986 | EP0185893A2 Lacquer and process for making anticorrosive coatings |
07/02/1986 | CA1207051A Electrical connection apparatus and procedure for flat conductor cables and similar articles |
07/02/1986 | CA1206818A Method of producing gold-alloy layers and patterns on substrates, products thus produced and the solutions to be used therefore |
07/02/1986 | CA1206746A Terminal alignment tool |
07/01/1986 | US4598337 Electronic circuit board for a timepiece |
07/01/1986 | US4598167 Multilayered ceramic circuit board |
07/01/1986 | US4598166 High density multi-layer circuit arrangement |
07/01/1986 | US4598037 Fireable coating of smooth metal and glass particles in an acrylicphotoresist system;electrical thick films;resolutiuon |
07/01/1986 | US4598022 Printed circuits |
07/01/1986 | US4597988 Process for preparing printed circuit board thru-holes |
07/01/1986 | US4597890 Cleaning circuit boards |
07/01/1986 | US4597836 Electroplating interior of injection molding, adding platic metal layer is transferred to plastic |
07/01/1986 | US4597828 Method of manufacturing printed circuit boards |
07/01/1986 | US4597628 Solder bearing clip |
07/01/1986 | US4597617 Pressure interconnect package for integrated circuits |
07/01/1986 | US4597420 Techniques for multipoint dispensing of viscous material |
07/01/1986 | US4597177 Fabricating contacts for flexible module carriers |
06/25/1986 | EP0185470A1 Polymeric films |
06/25/1986 | EP0185303A2 Electrically conducting copper layers and process for their production |
06/24/1986 | US4596907 Combination switch/latch for controlling circuit module/energization while securing module to support housing |
06/24/1986 | US4596762 Electronic thin-film circuit and method for producing it |
06/24/1986 | US4596759 Dry film resist containing two or more photosensitive strata |
06/24/1986 | US4596719 Juxtaposing first electrode of first metal with second electrode of second metal, disposing substrate in vapor reversing relationship with electrodes, evacuating chamber, striking arc, applying polarity to electrodes |
06/24/1986 | US4596624 At least two parallel spaced shelves, ring assembly between shelves having hollow cylinder and sealing plates, compressing means |
06/24/1986 | US4596500 Drilling method and relevant drilling machine for stacked boards, particularly for printed circuits |
06/24/1986 | US4596429 Electrical commoning arrangement for pin arrays |
06/24/1986 | US4596067 Drilling machine for boards, particularly of printed circuits |
06/24/1986 | CA1206549A1 Module mounting assembly |
06/24/1986 | CA1206548A1 Contact element |
06/19/1986 | WO1986003625A1 Electrical terminal having a compliant retention section |
06/18/1986 | EP0184943A2 Soldering arrangement |
06/18/1986 | EP0184820A2 Device for the alignment of raw and unexposed printed circuit boards and foto-masks the ones to the others, as well as foto-masks for the application there |
06/18/1986 | EP0184627A1 Method for the production of printed circuit boards with more than four conductive layers |
06/17/1986 | US4595816 Automated soldering process and apparatus |
06/17/1986 | US4595794 Component mounting apparatus |
06/17/1986 | US4595606 Solderable conductive compositions having high adhesive strength |
06/17/1986 | US4595478 Turbulent cell electroplating method and apparatus |
06/17/1986 | US4595471 Composition contains organic titanium or tin compounds |
06/17/1986 | US4594961 Stamp and device for providing drops of a viscous liquid on a substrate |
06/17/1986 | CA1206272A1 Leadless chip carrier for logic components |
06/11/1986 | EP0184439A2 Surface mountable electrical device and method of making the device |
06/11/1986 | EP0184245A1 Framework for components |
06/11/1986 | EP0184205A2 Procedure for obtaining electronic circuits and device for putting into practice |
06/11/1986 | EP0184044A2 Light-sensitive composition, registration material prepared thereof, and process for obtaining heat-resistant relief images |
06/11/1986 | EP0183936A1 Multilayer circuit and method of making the electrical connections |
06/11/1986 | EP0183925A2 Process for etching the walls of through-holes in synthetic-resin boards to be used in the manufacture of printed circuits |
06/11/1986 | EP0183852A1 High-purity palladium-nickel alloy plating bath, process therefor and alloy-covered articles and gold- or gold alloy-covered articles of alloy-covered articles |
06/11/1986 | EP0183722A1 High density ic module assembly. |
06/10/1986 | US4594490 For use with equipment mounting backplane terminal pins |
06/10/1986 | US4594473 Substrate having at least one fine-wired conductive layer |
06/10/1986 | US4594311 Imaging; pattern being catalyst for electroless metal plating |
06/10/1986 | US4594181 Printable thick film conductive composition |
06/10/1986 | US4593958 Socket for baseless lamp |
06/10/1986 | US4593582 Continuously variable transmission means for use in vehicles |
06/10/1986 | US4593450 Precision lock tooling |
06/10/1986 | CN85108628A Process for desmearing and etching of plastics layers in holes drilled in basic material of printed circuit boards |
06/10/1986 | CN85108626A Electronic device manufacturing methods |
06/10/1986 | CN85107932A Electrical interconnection means |
06/10/1986 | CN85107931A Adhesive electrical interconnecting means |
06/10/1986 | CA1205604A1 Electroless direct deposition of gold on metallized ceramics |
06/05/1986 | WO1986003369A1 Apparatus for automatically inserting leads on electrical and/or electronic components into corresponding holes in a substrate |
06/05/1986 | WO1986003367A1 Device for surface mounting of components |
06/05/1986 | WO1986003366A1 Improvements relating to protectively coating electrical equipment |
06/05/1986 | WO1986003365A1 Wiring structure of a terminal circuit |
06/05/1986 | WO1986003364A1 Multi-layer substrate for printed circuit |