Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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10/15/1985 | CA1195386A1 Testing device |
10/09/1985 | EP0157590A2 Packaged electronic device |
10/09/1985 | EP0157374A2 Radiation-polymerisable composition and process for applying markings to a solder resist layer |
10/09/1985 | EP0157261A2 Printed circuit board laminating apparatus |
10/09/1985 | EP0157241A1 Photosensitive recording material and its use in a process for the production of a printing plate or a printed circuit |
10/09/1985 | EP0156987A2 Method for the production of printed circuit boards |
10/09/1985 | EP0156919A1 Electrolytic capacitor |
10/08/1985 | US4546413 Engineering change facility on both major surfaces of chip module |
10/08/1985 | US4546412 Electronic device for automobile |
10/08/1985 | US4546408 Electrically insulated heat sink assemblies and insulators used therein |
10/08/1985 | US4546406 Inorganic semiconductor having selected thermal expansion properties; metal laminate substrates |
10/08/1985 | US4546283 Conductor structure for thick film electrical device |
10/08/1985 | US4546065 Embossing, sintering, deposition of conductive material |
10/08/1985 | US4546037 Embedded in dielectric polymeric matrix |
10/08/1985 | US4545869 Bath and process for high speed electroplating of palladium |
10/08/1985 | US4545865 Method for electrodeposition of materials |
10/08/1985 | US4545647 Resilient interconnection for exchangeable liquid crystal panel |
10/08/1985 | US4545610 Method for forming elongated solder connections between a semiconductor device and a supporting substrate |
10/08/1985 | US4545119 Inserting conductive material into through-holes; ultrasonic weldi |
10/02/1985 | EP0156212A2 Process for plating copper from electroless plating compositions |
10/02/1985 | EP0156167A2 Process for the deposition of a metal from an electroless plating composition |
10/02/1985 | EP0156120A2 Method for pretreatment of polyesters for metal plating |
10/02/1985 | EP0156106A2 Pretreatment of plastic materials for metal plating |
10/01/1985 | US4544942 Heat sinks with staked solderable studs |
10/01/1985 | US4544881 Device for testing the insulation of printed circuits |
10/01/1985 | US4544802 Circuit change pin and circuit board assembly |
10/01/1985 | US4544801 Circuit board including multiple wire photosensitive adhesive |
10/01/1985 | US4544626 Photoprinting process and apparatus for exposing photopolymers |
10/01/1985 | US4544625 Photosensitive resin composition and photosensitive element |
10/01/1985 | US4544623 Photosensitive coating composition and the use thereof for protective purposes |
10/01/1985 | US4544619 Photoresist layer, protective intermediate layer, and support layer |
10/01/1985 | US4544611 Conductive element metallized with a thick film silver composition |
10/01/1985 | US4544577 Process for metallization of dielectric substrate through holes |
10/01/1985 | US4544442 Forming patterns by the radiation vaporization of the cured coating on substrate bonded filaments |
10/01/1985 | US4544439 System for repairing electrical short circuits between parallel printed circuits |
10/01/1985 | US4544238 Substrate having dummy conductors to prevent solder build-up |
10/01/1985 | US4543715 Method of forming vertical traces on printed circuit board |
10/01/1985 | CA1194393A1 Dissolution of metals utilizing epsilon-caprolactam |
10/01/1985 | CA1194392A1 Dissolution of metals utilizing a lactone |
10/01/1985 | CA1194391A1 Dissolution of metals utilizing pyrrolidone |
10/01/1985 | CA1194390A1 Dissolution of metals utilizing a furan derivative |
10/01/1985 | CA1194389A1 Dissolution of metals utilizing a glycol ether |
10/01/1985 | CA1194388A1 Dissolution of metals |
10/01/1985 | CA1194314A1 Method for producing multilayered glass-ceramic structure with copper-based conductors therein |
09/25/1985 | EP0155900A2 Contouring method and machine for printed circuits |
09/25/1985 | EP0155652A2 Photopolymerizable mixture and recording material produced from it |
09/25/1985 | EP0155473A1 Power semiconductor module and method of manufacture |
09/25/1985 | EP0155386A1 Method of making connectors with a plurality of terminals |
09/24/1985 | US4543573 Display panel |
09/24/1985 | US4543544 LCC co-planar lead frame semiconductor IC package |
09/24/1985 | US4543318 Photoresists for circuit boards and printing plates |
09/24/1985 | US4543295 High temperature polyimide film laminates and process for preparation thereof |
09/24/1985 | US4543270 Nucleation |
09/24/1985 | US4543153 Process and apparatus for etching copper masked by a nickel-gold mask |
09/24/1985 | US4543147 Laminating process and apparatus |
09/24/1985 | CA1194239A1 Device for controlling the insulation of printed circuits |
09/24/1985 | CA1194087A1 Wedge base lamp socket |
09/24/1985 | CA1193949A1 Printed circuit board soldering |
09/18/1985 | EP0155231A2 Image-producing process |
09/18/1985 | EP0155080A2 Contact for chip carrier and method of inserting same into a housing |
09/18/1985 | EP0154909A2 Process and sheet material for the manufacture of printed circuits with through-connections |
09/18/1985 | EP0154859A1 Apparatus for vacuum deposition |
09/18/1985 | EP0154765A2 Apparatus for directly powering a multi-chip module from a power distribution bus |
09/18/1985 | EP0103627A4 A method and apparatus for manufacturing multi-layer circuit boards. |
09/17/1985 | US4542441 Card guide |
09/17/1985 | US4542439 Surface mount component |
09/17/1985 | US4542438 Hybrid integrated circuit device |
09/17/1985 | US4542260 Encapsulated assemblies |
09/17/1985 | US4542259 High density packages |
09/17/1985 | US4541894 Metallizable, essentially isotropic polymeric substrates well adopted for printed circuits |
09/17/1985 | US4541889 Dual-belt press for the continuous production of laminates |
09/17/1985 | US4541882 Applying filaments according to pattern, coating to position |
09/17/1985 | US4541714 Method of handling workpieces and masks in a duplication process |
09/17/1985 | US4541677 Continuous strip of jumper cable assemblies |
09/17/1985 | US4541358 Method and apparatus for solder removal |
09/17/1985 | US4541141 Machine for washing electronic circuits |
09/17/1985 | CA1193753A1 Soldering apparatus for printed circuit board |
09/17/1985 | CA1193752A1 Electrical circuits |
09/17/1985 | CA1193685A1 Mask for protecting tab contacts of circuit boards |
09/17/1985 | CA1193523A1 Method of preserving the solderability of copper |
09/17/1985 | CA1193494A1 Method of and apparatus for the vapor deposition of material upon a substrate |
09/11/1985 | EP0154602A1 Electrical connector for a module with an electronic circuit |
09/11/1985 | EP0154572A2 Method of manufacturing thin film elastic circuits, tool for carrying out this method and products obtained |
09/11/1985 | EP0154564A2 Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions |
09/11/1985 | EP0154420A1 Card edge connector with flexible film circuitry |
09/11/1985 | EP0154299A2 Method for fabricating planar terminated capacitors |
09/11/1985 | EP0154237A2 Photopolymer for use as a solder mask |
09/10/1985 | US4541035 Low loss, multilevel silicon circuit board |
09/10/1985 | US4541034 Electrical terminal and method of securing same in circuit substrate thru-hole |
09/10/1985 | US4541032 Modular electrical shunts for integrated circuit applications |
09/10/1985 | US4540631 Treatment of polymer using silver |
09/10/1985 | US4540621 Mixing with binder; casting into sheet, drying and sintering |
09/10/1985 | US4540620 Conductive patterns in polymeric films |
09/10/1985 | US4540478 Uniform distribution of metal; printed circuits |
09/10/1985 | US4540464 Method of renewing defective copper conductors on the external planes of multilayer circuit boards |
09/10/1985 | US4540462 Substrate for semiconductor modules and method of manufacture |
09/10/1985 | US4540229 Electrical interconnection apparatus |
09/10/1985 | US4540114 Apparatus for soldering workpieces |
09/10/1985 | US4540084 Device for automatically transferring printed circuit base plates from the loading to the printing zone |
09/10/1985 | US4539747 Process for making electrical connections between two surfaces of a printed circuit board |