Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1985
11/21/1985EP0161998A1 Machine for sawing the contours of plates
11/21/1985EP0161870A2 Highly photosensitive aqueous solvent-developable printing assembly
11/21/1985EP0161805A1 Peelable electrically conductive material
11/21/1985EP0161434A2 Electric, in particular an electronic switching apparatus working without making contact
11/21/1985EP0072830B1 Treatment of copper foil
11/21/1985EP0031852B1 Process and apparatus for continuous production of laminates
11/19/1985US4554615 Electrically conducting panel and method of making same
11/19/1985US4554614 Electric circuit assembly comprising a printed wiring board
11/19/1985US4554575 Low stress leadless chip carrier and method of assembly
11/19/1985US4554405 High density encapsulated wire circuit board
11/19/1985US4554229 Multilayer hybrid integrated circuit
11/19/1985US4554184 Method for plating from an electroless plating bath
11/19/1985US4554183 Adhesion
11/19/1985US4554182 Method for conditioning a surface of a dielectric substrate for electroless plating
11/19/1985US4554107 Deodorizing with polyhydric alcohol and monoglyceride
11/19/1985US4554062 Endless belts, cascading, printed circuits, bare wires
11/19/1985US4554033 Method of forming an electrical interconnection means
11/19/1985US4553844 Configuration detecting method and system
11/13/1985EP0160966A2 Process for producing a metallic pattern on an insulating substrate, and insulating substrate with a metallic pattern, particularly a printed circuit
11/12/1985US4553192 High density planar interconnected integrated circuit package
11/12/1985US4553111 Printed circuit board maximizing areas for component utilization
11/12/1985US4552831 Fabrication method for controlled via hole process
11/12/1985US4552787 Deposition of a metal from an electroless plating composition
11/12/1985US4552627 Preparation for improving the adhesion properties of metal foils
11/12/1985US4552626 Metal plating of polyamide thermoplastics
11/12/1985US4552615 Process for forming a high density metallurgy system on a substrate and structure thereof
11/12/1985US4552607 Microspheres
11/12/1985US4552420 Electrical connector using a flexible circuit having an impedance control arrangement thereon
11/12/1985US4552383 Identification card having an IC module
11/12/1985US4551914 Method of making flexible circuit connections
11/12/1985CA1196731A1 Process and device for the manufacture of printed circuit boards
11/12/1985CA1196560A1 Metal stripping composition and process
11/10/1985CN85200323U Figure area integrator with printed board
11/07/1985WO1985005005A1 Method and apparatus for drawing thick-film circuits
11/07/1985WO1985004980A1 Anisotropically conductive adhesive composition
11/06/1985EP0160530A2 Printed circuit boards and terminal devices therefor
11/06/1985EP0160439A2 Improved printed circuit board
11/06/1985EP0160418A2 Printed circuit board
11/06/1985EP0160387A1 A strip for holding and protecting electrical contacts
11/06/1985EP0160345A2 Pre-patterned device substrate device-attach adhesive transfer system
11/06/1985EP0160290A2 contact material
11/06/1985EP0160236A1 Novel nickel/indium alloy for use in the manufacture of electrical contact areas electrical devices
11/06/1985EP0160056A1 Process and apparatus for compressing flexible sheets.
11/05/1985US4551789 Multilayer ceramic substrates with several metallization planes
11/05/1985US4551788 Multi-chip carrier array
11/05/1985US4551747 Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
11/05/1985US4551746 Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
11/05/1985US4551673 Testing arrangement for printed circuit boards
11/05/1985US4551488 Epoxy resin based protective coating composition for printed circuit boards
11/05/1985US4551357 Process of manufacturing ceramic circuit board
11/05/1985US4551210 Dendritic treatment of metallic surfaces for improving adhesive bonding
11/05/1985US4550959 Surface mountable coefficient of expansion matching connector
11/05/1985CA1196426A1 Wave-soldering of printed circuit boards
11/05/1985CA1196234A1 Treatment of coated glass
10/1985
10/30/1985EP0159873A2 Coating composition and method for partially soldering a substrate
10/30/1985EP0159771A2 Chip resistors and forming method
10/30/1985EP0159690A2 Method of controlling the sintering of metal particles
10/30/1985EP0159593A2 Electrical connector and method for making the same
10/30/1985EP0159443A2 Method of forming conductor path
10/30/1985EP0159331A1 Electronic circuit assembly
10/29/1985US4550357 Interconnected printed circuit boards and method of connecting circuit boards
10/29/1985US4549941 Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
10/29/1985US4549940 Method for surface treating copper foil
10/29/1985US4549921 Lamination of fluorocarbon films
10/29/1985US4549484 Thick film screen printing apparatus
10/29/1985CA1196112A1 Self-aligning mask
10/29/1985CA1195880A1 Wave soldering apparatus and method
10/24/1985WO1985004780A1 Multilayer hybrid integrated circuit
10/24/1985WO1985004623A1 Double planarization process for multilayer metallization of int egrated circuit structures
10/23/1985EP0159208A1 Method of manufacturing miniaturized electronic power circuits
10/23/1985EP0159182A2 A strip line cable
10/23/1985EP0158890A2 Activating a substrate for electroless plating
10/23/1985EP0158876A2 Multilayer printed circuit board produced in multilayer- or piling technique
10/23/1985EP0158727A1 Method for measuring the current density in galvanization baths
10/22/1985US4549043 Electronic conductor and a method of manufacturing it
10/22/1985US4549036 Circular integrated circuit package
10/22/1985US4548885 Process for using a flexible laminatable photosensitive layer in the production of a printed circuit
10/22/1985US4548884 Applying photosensitive liquid between substrate and photomask which are hinged together
10/22/1985US4548862 Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
10/22/1985US4548451 Pinless connector interposer and method for making the same
10/22/1985US4548450 Terminal pin securing arrangement
10/22/1985US4548285 Measurement of surface area for electrodeposition plating processes
10/22/1985US4547961 Method of manufacture of miniaturized transformer
10/16/1985EP0158536A2 Methods of and apparatus for forming conductive patterns on a substrate
10/16/1985EP0158343A2 Process for preparing pressed multilayer composites, and product so obtained
10/16/1985EP0158230A1 Piezoelectric-acoustic transducer for electroacoustic units with constructional features for assembling
10/16/1985EP0158027A2 Method for making copper-clad base material for conductive plates
10/16/1985EP0157991A1 Apparatus for the continuous and selective metallization of parts, especially for electronics
10/15/1985US4547898 Apparatus for determining the two-dimensional connectivity of a prescribed binary variable associated with a surface
10/15/1985US4547840 Lamp holder for mounting a lamp on a circuit board
10/15/1985US4547834 Structure for assembling complex electronic circuits
10/15/1985US4547795 Leadless chip carrier with frangible shorting bars
10/15/1985US4547767 Printed circuit board for activating and deactivating alarm systems
10/15/1985US4547652 Process for the laser soldering of flexible wiring
10/15/1985US4547625 Forming silica and borosilicate glass into mixture and sintering
10/15/1985US4547436 Containing cadmium-antimony alloy
10/15/1985US4547408 Stacking and compressing electroconductive metal foil, skin laminae, core, and second laminae
10/15/1985US4547304 Alkylene oxide adduct; primary amine or ethoxylate therof
10/15/1985CA1195440A1 Housing for an ionization detector array in a tomographic scanner
10/15/1985CA1195393A1 Aperture-coupled microwave apparatus