Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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11/21/1985 | EP0161998A1 Machine for sawing the contours of plates |
11/21/1985 | EP0161870A2 Highly photosensitive aqueous solvent-developable printing assembly |
11/21/1985 | EP0161805A1 Peelable electrically conductive material |
11/21/1985 | EP0161434A2 Electric, in particular an electronic switching apparatus working without making contact |
11/21/1985 | EP0072830B1 Treatment of copper foil |
11/21/1985 | EP0031852B1 Process and apparatus for continuous production of laminates |
11/19/1985 | US4554615 Electrically conducting panel and method of making same |
11/19/1985 | US4554614 Electric circuit assembly comprising a printed wiring board |
11/19/1985 | US4554575 Low stress leadless chip carrier and method of assembly |
11/19/1985 | US4554405 High density encapsulated wire circuit board |
11/19/1985 | US4554229 Multilayer hybrid integrated circuit |
11/19/1985 | US4554184 Method for plating from an electroless plating bath |
11/19/1985 | US4554183 Adhesion |
11/19/1985 | US4554182 Method for conditioning a surface of a dielectric substrate for electroless plating |
11/19/1985 | US4554107 Deodorizing with polyhydric alcohol and monoglyceride |
11/19/1985 | US4554062 Endless belts, cascading, printed circuits, bare wires |
11/19/1985 | US4554033 Method of forming an electrical interconnection means |
11/19/1985 | US4553844 Configuration detecting method and system |
11/13/1985 | EP0160966A2 Process for producing a metallic pattern on an insulating substrate, and insulating substrate with a metallic pattern, particularly a printed circuit |
11/12/1985 | US4553192 High density planar interconnected integrated circuit package |
11/12/1985 | US4553111 Printed circuit board maximizing areas for component utilization |
11/12/1985 | US4552831 Fabrication method for controlled via hole process |
11/12/1985 | US4552787 Deposition of a metal from an electroless plating composition |
11/12/1985 | US4552627 Preparation for improving the adhesion properties of metal foils |
11/12/1985 | US4552626 Metal plating of polyamide thermoplastics |
11/12/1985 | US4552615 Process for forming a high density metallurgy system on a substrate and structure thereof |
11/12/1985 | US4552607 Microspheres |
11/12/1985 | US4552420 Electrical connector using a flexible circuit having an impedance control arrangement thereon |
11/12/1985 | US4552383 Identification card having an IC module |
11/12/1985 | US4551914 Method of making flexible circuit connections |
11/12/1985 | CA1196731A1 Process and device for the manufacture of printed circuit boards |
11/12/1985 | CA1196560A1 Metal stripping composition and process |
11/10/1985 | CN85200323U Figure area integrator with printed board |
11/07/1985 | WO1985005005A1 Method and apparatus for drawing thick-film circuits |
11/07/1985 | WO1985004980A1 Anisotropically conductive adhesive composition |
11/06/1985 | EP0160530A2 Printed circuit boards and terminal devices therefor |
11/06/1985 | EP0160439A2 Improved printed circuit board |
11/06/1985 | EP0160418A2 Printed circuit board |
11/06/1985 | EP0160387A1 A strip for holding and protecting electrical contacts |
11/06/1985 | EP0160345A2 Pre-patterned device substrate device-attach adhesive transfer system |
11/06/1985 | EP0160290A2 contact material |
11/06/1985 | EP0160236A1 Novel nickel/indium alloy for use in the manufacture of electrical contact areas electrical devices |
11/06/1985 | EP0160056A1 Process and apparatus for compressing flexible sheets. |
11/05/1985 | US4551789 Multilayer ceramic substrates with several metallization planes |
11/05/1985 | US4551788 Multi-chip carrier array |
11/05/1985 | US4551747 Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation |
11/05/1985 | US4551746 Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
11/05/1985 | US4551673 Testing arrangement for printed circuit boards |
11/05/1985 | US4551488 Epoxy resin based protective coating composition for printed circuit boards |
11/05/1985 | US4551357 Process of manufacturing ceramic circuit board |
11/05/1985 | US4551210 Dendritic treatment of metallic surfaces for improving adhesive bonding |
11/05/1985 | US4550959 Surface mountable coefficient of expansion matching connector |
11/05/1985 | CA1196426A1 Wave-soldering of printed circuit boards |
11/05/1985 | CA1196234A1 Treatment of coated glass |
10/30/1985 | EP0159873A2 Coating composition and method for partially soldering a substrate |
10/30/1985 | EP0159771A2 Chip resistors and forming method |
10/30/1985 | EP0159690A2 Method of controlling the sintering of metal particles |
10/30/1985 | EP0159593A2 Electrical connector and method for making the same |
10/30/1985 | EP0159443A2 Method of forming conductor path |
10/30/1985 | EP0159331A1 Electronic circuit assembly |
10/29/1985 | US4550357 Interconnected printed circuit boards and method of connecting circuit boards |
10/29/1985 | US4549941 Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
10/29/1985 | US4549940 Method for surface treating copper foil |
10/29/1985 | US4549921 Lamination of fluorocarbon films |
10/29/1985 | US4549484 Thick film screen printing apparatus |
10/29/1985 | CA1196112A1 Self-aligning mask |
10/29/1985 | CA1195880A1 Wave soldering apparatus and method |
10/24/1985 | WO1985004780A1 Multilayer hybrid integrated circuit |
10/24/1985 | WO1985004623A1 Double planarization process for multilayer metallization of int egrated circuit structures |
10/23/1985 | EP0159208A1 Method of manufacturing miniaturized electronic power circuits |
10/23/1985 | EP0159182A2 A strip line cable |
10/23/1985 | EP0158890A2 Activating a substrate for electroless plating |
10/23/1985 | EP0158876A2 Multilayer printed circuit board produced in multilayer- or piling technique |
10/23/1985 | EP0158727A1 Method for measuring the current density in galvanization baths |
10/22/1985 | US4549043 Electronic conductor and a method of manufacturing it |
10/22/1985 | US4549036 Circular integrated circuit package |
10/22/1985 | US4548885 Process for using a flexible laminatable photosensitive layer in the production of a printed circuit |
10/22/1985 | US4548884 Applying photosensitive liquid between substrate and photomask which are hinged together |
10/22/1985 | US4548862 Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer |
10/22/1985 | US4548451 Pinless connector interposer and method for making the same |
10/22/1985 | US4548450 Terminal pin securing arrangement |
10/22/1985 | US4548285 Measurement of surface area for electrodeposition plating processes |
10/22/1985 | US4547961 Method of manufacture of miniaturized transformer |
10/16/1985 | EP0158536A2 Methods of and apparatus for forming conductive patterns on a substrate |
10/16/1985 | EP0158343A2 Process for preparing pressed multilayer composites, and product so obtained |
10/16/1985 | EP0158230A1 Piezoelectric-acoustic transducer for electroacoustic units with constructional features for assembling |
10/16/1985 | EP0158027A2 Method for making copper-clad base material for conductive plates |
10/16/1985 | EP0157991A1 Apparatus for the continuous and selective metallization of parts, especially for electronics |
10/15/1985 | US4547898 Apparatus for determining the two-dimensional connectivity of a prescribed binary variable associated with a surface |
10/15/1985 | US4547840 Lamp holder for mounting a lamp on a circuit board |
10/15/1985 | US4547834 Structure for assembling complex electronic circuits |
10/15/1985 | US4547795 Leadless chip carrier with frangible shorting bars |
10/15/1985 | US4547767 Printed circuit board for activating and deactivating alarm systems |
10/15/1985 | US4547652 Process for the laser soldering of flexible wiring |
10/15/1985 | US4547625 Forming silica and borosilicate glass into mixture and sintering |
10/15/1985 | US4547436 Containing cadmium-antimony alloy |
10/15/1985 | US4547408 Stacking and compressing electroconductive metal foil, skin laminae, core, and second laminae |
10/15/1985 | US4547304 Alkylene oxide adduct; primary amine or ethoxylate therof |
10/15/1985 | CA1195440A1 Housing for an ionization detector array in a tomographic scanner |
10/15/1985 | CA1195393A1 Aperture-coupled microwave apparatus |