| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/24/1985 | US4561039 Thick film electronic circuit |
| 12/24/1985 | US4561006 Integrated circuit package with integral heating circuit |
| 12/24/1985 | US4560991 Electroformed charge electrode structure for ink jet printers |
| 12/24/1985 | US4560962 Electroconductive layers separated by dielectric epoxy glass substrates |
| 12/24/1985 | US4560643 Use of photosensitive compositions of matter for electroless deposition of metals |
| 12/24/1985 | US4560639 Two-sided supporting body sheet, transparency image, release surface structure |
| 12/24/1985 | US4560593 Deposition of metals on electrically conductive, polymeric carriers |
| 12/24/1985 | US4560584 Method and apparatus for applying solder masking to a circuit board |
| 12/24/1985 | US4560460 Apparatus for the galvanic deposition of metal |
| 12/24/1985 | US4560445 Continuous process for fabricating metallic patterns on a thin film substrate |
| 12/24/1985 | US4560220 Etched multichannel electrical connector |
| 12/24/1985 | US4560100 Automated soldering process and apparatus |
| 12/24/1985 | US4559896 Coating apparatus |
| 12/24/1985 | CA1198524A1 Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same |
| 12/24/1985 | CA1198308A1 Deposition process |
| 12/24/1985 | CA1198307A1 Photosensitive coating compositions and the use thereof for protective purposes |
| 12/19/1985 | WO1985005755A1 Composition and process for conditioning the surface of plastic substrates prior to metal plating |
| 12/19/1985 | WO1985005733A1 High density ic module assembly |
| 12/18/1985 | EP0165148A1 Assembly process for at least two ceramic pieces each having at least one plane surface |
| 12/18/1985 | EP0164921A2 Improvements in and relating to printed circuit boards |
| 12/18/1985 | EP0164906A1 Solder composition |
| 12/18/1985 | EP0164722A1 Automatic test system |
| 12/18/1985 | EP0164675A2 Lift-off process |
| 12/18/1985 | EP0164674A2 Electrically conductive thin epoxy bond |
| 12/18/1985 | EP0164564A1 Arrangement for the production of blind holes in a laminated construction |
| 12/18/1985 | EP0164392A1 Printed circuit board. |
| 12/18/1985 | EP0164378A1 Plant for the treatment of objects by means of a liquid |
| 12/18/1985 | EP0164377A1 Plant for the treating of objects by means of a liquid |
| 12/17/1985 | US4559579 Device for the protection of an electronic component and/or circuit against the disturbances (voltages) generated by an external electromagnetic field |
| 12/17/1985 | US4559514 Chip type fuse having connecting legs |
| 12/17/1985 | US4558812 Method and apparatus for batch solder bumping of chip carriers |
| 12/17/1985 | CA1198082A1 Applying coating to circuit board spaced from hole edges and curing sub-layer |
| 12/11/1985 | EP0164022A2 Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy |
| 12/11/1985 | EP0163978A2 Method for routing electrical connections on integrated products and resulting product |
| 12/11/1985 | EP0163831A2 Catalytic metal of reduced particle size |
| 12/11/1985 | EP0163830A2 Multi-layer integrated circuit substrates and method of manufacture |
| 12/11/1985 | EP0163760A2 Printed circuit with integrated resistance and process for making it |
| 12/11/1985 | EP0163677A1 Plant for tinning printed circuit boards. |
| 12/10/1985 | US4558427 Sheet-like compact electronic equipment |
| 12/10/1985 | US4558397 Interposer connector for surface mounting a ceramic chip carrier to a printed circuit board |
| 12/10/1985 | US4558396 Display device for portable type electrical equipment |
| 12/10/1985 | US4557996 Method for providing a pattern-wise photoresist layer on a substrate plate and a surface-protected substrate plate therefor |
| 12/10/1985 | US4557995 Applying two patterns on opposite side of the substrate |
| 12/10/1985 | US4557860 Solventless, polyimide-modified epoxy composition |
| 12/10/1985 | US4557811 Regeneration of an ammoniacal etching solution with recycling of solution with electrolytically reduced metal content to the regeneration input |
| 12/10/1985 | US4557807 In mold electrodeposition |
| 12/10/1985 | US4557796 Using compound with methyl or methylene group |
| 12/10/1985 | US4557792 Hot press |
| 12/10/1985 | US4557784 Continuous process for producing a metal clad laminate |
| 12/10/1985 | US4557539 Contact insertable in a metallized hole of a printed circuit card and process |
| 12/10/1985 | US4557411 Interconnected solder pads and the method of soldering |
| 12/10/1985 | CA1197912A1 Solder bearing terminal pin |
| 12/10/1985 | CA1197766A1 Flame-retarded copper clad laminates |
| 12/05/1985 | WO1985005529A1 Process and arrangement to increase the reliability of the metallization of borings in the production of multilayer printed circuits |
| 12/05/1985 | WO1985005496A1 Mounting semi-conductor chips |
| 12/05/1985 | WO1985005381A1 High-purity palladium-nickel alloy plating bath, process therefor and alloy-covered articles and gold- or gold alloy-covered articles of alloy-covered articles |
| 12/04/1985 | EP0163581A1 Production method and device for electrical connections between two printed-circuit boards, and electrical connection method using the device |
| 12/04/1985 | EP0163548A2 Method for producing multilayer ceramic circuit board |
| 12/04/1985 | EP0163478A2 Process of manufacturing ceramic circuit board |
| 12/04/1985 | EP0163368A1 Through hole interconnections |
| 12/04/1985 | EP0163315A2 Method for laminating a film by applying pressure and heat, and apparatus for carrying out the method |
| 12/04/1985 | EP0163172A2 Process for forming a top surface metallurgy pattern on a ceramic substrate |
| 12/04/1985 | EP0163155A1 Low temperature fired ceramics |
| 12/04/1985 | EP0163101A1 Method for surface treating copper foil |
| 12/04/1985 | EP0163089A2 Process for activating a substrate for electroless deposition of a conductive metal |
| 12/04/1985 | EP0163074A2 A process for forming via holes having sloping side walls in a polymer film |
| 12/04/1985 | EP0163059A2 Novel nickel/indium alloy and method of using same in the manufacture of printed circuit boards |
| 12/04/1985 | EP0162979A1 Electrically conductive microballoons and compositions incorporating same |
| 12/03/1985 | US4556759 Padless plated vias having soldered wicks for multi-layer printed circuit boards |
| 12/03/1985 | US4556628 Process for producing printed circuit boards with metallic conductor structures embedded in the insulating substrate |
| 12/03/1985 | US4556627 Two superimposed layers of polymers with diverse characteristics for solder mask coatings |
| 12/03/1985 | US4556449 Nickel etching process and solution |
| 12/03/1985 | US4556276 Solder beams leads |
| 12/03/1985 | US4556274 Fuse and mounting arrangement for printed circuit board application |
| 12/03/1985 | US4556266 Jumper wire material |
| 12/03/1985 | US4556181 Fastener for electric wires around a printed circuit board |
| 12/03/1985 | CA1197584A1 Electrical connector for interconnecting printed circuit boards |
| 11/27/1985 | EP0162706A2 Polymer film with conductive pattern and method of manufacturing the same |
| 11/27/1985 | EP0162474A2 A printed circuit board and a circuit assembly for a radio apparatus |
| 11/27/1985 | EP0162290A1 Punching method |
| 11/27/1985 | EP0162230A2 Method of restoring the surface of a thermoplastic substrate |
| 11/27/1985 | EP0162149A1 Electrical capacitor as a chip element |
| 11/27/1985 | EP0162126A2 Contact pin for electrical circuit elements lying one upon the other |
| 11/27/1985 | EP0162124A1 Apparatus and method for connecting flexible printed foils electrically and mechanically |
| 11/26/1985 | US4555745 Dispersion of dielectric filler in a low temperature-cured polymers |
| 11/26/1985 | US4555638 Fuse and distribution arrangement box for motor vehicles |
| 11/26/1985 | US4555630 Automatic system for exposing and handling double-sided printed circuit boards |
| 11/26/1985 | US4555533 Polyesterurethane copolymer blend |
| 11/26/1985 | US4555532 Diaminotriazine-substituted imidazole hardener, dicyandiamide, solder resists |
| 11/26/1985 | US4555414 Cured resin, printed circuits |
| 11/26/1985 | US4555291 Inductive and capacitive |
| 11/26/1985 | US4555285 Forming patterns in metallic or ceramic substrates |
| 11/26/1985 | US4555151 Contact terminal device for connecting hybrid circuit modules to a printed circuit board |
| 11/26/1985 | US4554732 High reliability electrical components |
| 11/26/1985 | CA1197325A1 Masking of holes in circuit patterns on circuit boards prior to flow soldering |
| 11/26/1985 | CA1197324A1 Multi-layer circuitry |
| 11/26/1985 | CA1197150A1 Conductive pigment-coated surfaces |
| 11/21/1985 | WO1985005243A1 Combination switch/latch for controlling circuit module/energization while securing module to support housing |
| 11/21/1985 | WO1985005242A1 Electrically conductive circuit board and a method of producing the same |
| 11/21/1985 | WO1985005074A1 Apparatus for laminating multilayered printed circuit boards |