| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) | 
|---|
| 07/10/1984 | CA1170557A1 Continuous process for producing reinforced resin laminates | 
| 07/10/1984 | CA1170438A1 Method of manufacturing an electrical interconnection assembly | 
| 07/04/1984 | EP0112798A1 Light-sensitive and possibly cross-linkable mixture of compounds apt to condensation and addition reactions, reaction products obtained thereby and use thereof | 
| 07/04/1984 | EP0112760A1 Electronic component encapsulating micro-housing having a plurality of bent connections | 
| 07/04/1984 | EP0112635A2 Treatment of copper foil | 
| 07/04/1984 | EP0112468A1 Desoldering apparatus and method | 
| 07/04/1984 | EP0037421B1 Thin film structure for ceramic substrates | 
| 07/03/1984 | US4458294 Compliant termination for ceramic chip capacitors | 
| 07/03/1984 | US4458123 Connector for attaching an electrical component to a membrane keyboard | 
| 07/03/1984 | US4458008 Photolithography | 
| 07/03/1984 | US4457972 Enhanced adhesion by high energy bombardment | 
| 07/03/1984 | US4457952 Process for producing printed circuit boards | 
| 07/03/1984 | US4457951 Printed circuits | 
| 07/03/1984 | US4457950 Radiant scanning of dielectric layer | 
| 07/03/1984 | US4457861 Copper particles and curing agent in phenolic resin | 
| 07/03/1984 | US4457796 Permanently connecting a set of conductive tracks on a substrate with a co-operating set on a printed circuit | 
| 07/03/1984 | US4457515 Brush seal and method | 
| 07/03/1984 | US4457467 Method for positioning and fixing optical components relative to one another | 
| 07/03/1984 | US4457466 Mask for protecting tab contacts of circuit boards | 
| 06/29/1984 | EP0101503A4 Method for high-speed production of metal-clad articles. | 
| 06/27/1984 | EP0112245A2 Process for producing an electric circuit adapted for igniting a pyrotechnical device, and circuit thus produced | 
| 06/27/1984 | EP0112005A2 Conformal coating and potting system | 
| 06/27/1984 | EP0111890A2 Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a Perovskite structure | 
| 06/27/1984 | EP0111734A2 Method of manufacturing a liquid crystal display device | 
| 06/27/1984 | EP0111708A2 In-line mask cleaning system | 
| 06/27/1984 | EP0111644A2 Method of manufacturing semiconductor chip film carriers | 
| 06/27/1984 | EP0111599A1 Method of processing through-holes | 
| 06/26/1984 | US4456946 Subminiature array with flexible reflector | 
| 06/26/1984 | US4456680 Process for preparing a mask for sandblasting | 
| 06/26/1984 | US4456657 Metal-clad laminate adapted for printed circuits | 
| 06/26/1984 | US4456652 Electrically conductive adhesive tape | 
| 06/26/1984 | US4456549 Indium oxide, tin oxide | 
| 06/26/1984 | US4456508 Electrodeposition of zinc layer | 
| 06/26/1984 | US4456163 For removing/replacing multi-pinned components on printed circuit boards | 
| 06/26/1984 | US4455749 Matrix board | 
| 06/26/1984 | CA1169692A1 Flexible laminatable photosensitive layer including an organic photoconductor and a copolymeric binder containing alkyl methacrylate and acid units | 
| 06/20/1984 | EP0111152A2 Method of producing electronic devices and/or circuits on a substrate by the multilayer thick film technique, and devices and/or circuits made by this method | 
| 06/20/1984 | EP0111128A2 UV patterning of resist materials | 
| 06/19/1984 | US4455591 Means and a method for converting finished electrical components with terminal leads to elements having planar terminations | 
| 06/19/1984 | US4455325 Method of inducing flow or densification of phosphosilicate glass for integrated circuits | 
| 06/19/1984 | US4455181 Method of transfer lamination of copper thin sheets and films | 
| 06/19/1984 | US4454810 Apparatus for lithography or intaglio printing | 
| 06/19/1984 | CA1169582A1 Pinned substrate apparatus | 
| 06/19/1984 | CA1169510A1 Flat conductor electrical cable assembly with electrically conductive member and shield | 
| 06/19/1984 | CA1169347A1 Integrated laminating process | 
| 06/13/1984 | EP0110833A1 Use of light-sensitive product mixtures for electroless metal deposition | 
| 06/13/1984 | EP0110831A1 Thioxanthones substituted by alpha-aminoalkyl groups | 
| 06/13/1984 | EP0110641A1 Process for electrical terminal contact metallisation | 
| 06/13/1984 | EP0110632A1 Auxiliary memory module for an electronic typewriter | 
| 06/13/1984 | EP0110540A1 Conformal coating systems | 
| 06/13/1984 | EP0110382A2 Display device and process for its production and decal for forming a display panel terminal | 
| 06/13/1984 | EP0110332A2 Method of producing low dielectric constant laminates | 
| 06/13/1984 | EP0110181A2 Method for inhibiting metal migration during heat cycling of multilayer metal thin film structures | 
| 06/13/1984 | EP0110172A1 Process for the manufacture of composite materials | 
| 06/13/1984 | EP0110114A1 Masking strip for galvanic processes | 
| 06/12/1984 | US4454168 Printed circuits prepared from metallized photoadhesive layers | 
| 06/12/1984 | US4454167 Process for generating conductive patterns | 
| 06/12/1984 | US4454014 Etched article | 
| 06/12/1984 | US4454003 Printed circuit board component conveyor apparatus and process | 
| 06/12/1984 | US4453984 N-cyclohexyl-2-pyrrolidone, n-isopropyl-2-pyrrolidone, ethylhexyl acetate or dibutyl carbitol solvent | 
| 06/12/1984 | US4453916 Device for fusion of electrodeposited coating of printed-circuit boards | 
| 06/12/1984 | US4453795 Cable-to-cable/component electrical pressure wafer connector assembly | 
| 06/12/1984 | US4453669 Electrically heated glass pane | 
| 06/12/1984 | US4453662 Solder handling | 
| 06/12/1984 | US4453633 Electronic component series | 
| 06/12/1984 | CA1169163A1 Pin arrangement for a backplane | 
| 06/12/1984 | CA1168915A1 Self-trimming photosensitive layer including a discontinuous minor phase of dispersed nonfibrous solid particles | 
| 06/07/1984 | WO1984002249A1 Method and apparatus for mounting multilead components on a circuit board | 
| 06/07/1984 | WO1984002248A1 Method of connecting double-sided circuits | 
| 06/05/1984 | US4453176 LSI Chip carrier with buried repairable capacitor with low inductance leads | 
| 06/05/1984 | US4452847 Sheet material impregnated with a highly cross linked thermally stable epoxy composition | 
| 06/05/1984 | US4452664 Vapor deposition of copper onto aluminum carrier sheet | 
| 06/05/1984 | US4452650 Copper and copper alloy coating | 
| 06/05/1984 | US4452264 Rinsing of articles to remove an adhering substance | 
| 06/05/1984 | CA1168792A1 Mixture which is polymerizable by radiation, and radiation-sensitive copying material prepared therewith | 
| 05/30/1984 | EP0109920A2 Process for cleaning holes in printed circuit boards with permanganate and basic solutions | 
| 05/30/1984 | EP0109892A1 Hard-soldering continuous furnace for electronic components | 
| 05/30/1984 | EP0109805A2 Pin punch and insertion machine | 
| 05/30/1984 | EP0109402A1 Catalyst solutions for activating non-conductive substrates and electroless plating process. | 
| 05/29/1984 | US4451554 Method of forming thin-film pattern | 
| 05/29/1984 | US4451552 Impervious thin film covering the image surface; antisticking agents | 
| 05/29/1984 | US4451523 Conformal coating systems | 
| 05/29/1984 | US4451505 Method of producing printed circuit boards | 
| 05/29/1984 | US4451327 With gaseous or liquid oxidant in the presence of a catalyst | 
| 05/29/1984 | US4451317 Continuous process for producing reinforced resin laminates | 
| 05/29/1984 | US4451121 Electronic appliance | 
| 05/29/1984 | US4451000 Soldering apparatus exhaust system | 
| 05/29/1984 | US4450623 Process for the manufacture of circuit boards | 
| 05/29/1984 | US4450619 For applying to circuit boards a succession of components | 
| 05/29/1984 | CA1168141A1 Lamination of photosensitive layer using a liquid interface | 
| 05/29/1984 | CA1168140A1 Lamination of photosensitive layer using a liquid interface | 
| 05/29/1984 | CA1168139A1 Precleaning substrate and lamination of photosensitive layer using a liquid interface | 
| 05/29/1984 | CA1168115A1 Process for forming refractory metal layers on ceramic substrate | 
| 05/24/1984 | WO1984002051A1 Electronic circuit chip connection assembly and method | 
| 05/23/1984 | EP0109127A2 Electrolytic capacitor | 
| 05/23/1984 | EP0109084A1 A method of making a double-sided thick-film integrated circuit | 
| 05/23/1984 | EP0108897A1 Method for removing extraneous metal from ceramic substrates | 
| 05/23/1984 | EP0032153B1 Plating resist with improved resistance to extraneous plating | 
| 05/22/1984 | US4450029 Backplane fabrication method | 
| 05/22/1984 | US4449769 Substrate for mounting electric parts |