Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1986
03/19/1986EP0174555A2 High resolution solder mask photopolymers for screen coating over circuit traces
03/19/1986EP0174494A2 Thermostable polymer system, cross-linkable by irradiation, for microelectronic use
03/18/1986US4577259 Apparatus and method for retaining an electronic device
03/18/1986US4576832 Self-aligning mask
03/18/1986US4576735 Electroconductive molybdenum paste
03/18/1986US4576689 Copper salt, hypophosphite, stabilizer
03/18/1986US4576685 Process and apparatus for plating onto articles
03/18/1986US4576678 Pattern forming method
03/18/1986US4576670 Method for making contact with the electrode on the adhesive-coated side of an electrical component and the article made by such method
03/18/1986US4576659 Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures
03/18/1986US4576426 Flexible printed circuit connector and contact eyelet therefor
03/18/1986CA1202123A1 Method and apparatus for captivating a substrate within a holder
03/18/1986CA1202109A1 Universal programmable interface
03/12/1986EP0174201A1 Chemical deburring system with a soluble mask
03/12/1986EP0174050A2 Method and apparatus for ranging and guiding flexible insulated conductors
03/12/1986EP0079356B1 A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method
03/11/1986US4575785 Visual indicator support on a printed circuit
03/11/1986US4575467 Storage stable compounds
03/11/1986US4575233 Photographic printing
03/11/1986US4575165 Circuit to post interconnection device
03/11/1986US4575038 Spring clip fastener for mounting of printed circuit board components
03/10/1986CN85104934A Method for the manufacture of an electronic device
03/05/1986EP0173188A2 Photo-thick-film-hybrid process
03/05/1986EP0173167A1 Nonfuming solder cleansing and fusing fluids
03/05/1986EP0173003A2 Method for plating from an electroless plating bath
03/05/1986EP0172949A2 Adapter for the double-sided exposition of chips covered by a light sensitive resin
03/04/1986US4574330 Heat sink for dissipating heat generated by electronic displays
03/04/1986US4574297 Semiconductor device
03/04/1986US4574255 MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate
03/04/1986US4574182 Continuous furnace for soldering electronic components
03/04/1986US4574095 Selective deposition of copper
03/04/1986US4574094 Metallization of ceramics
03/04/1986US4574031 Additive processing electroless metal plating using aqueous photoresist
03/04/1986US4573779 Variable size circular aperture camera
03/04/1986US4573406 Screen printing device
03/04/1986CA1201497A1 Bonding post for printed circuit card, and apparatus using said post
03/04/1986CA1201332A1 Life extension of catalyst predip baths
02/1986
02/26/1986EP0172604A2 Method for depositing a micron-size metallic film on a transparent substrate utilizing a visible laser
02/26/1986EP0172518A2 Process for the manufacture of composite fabrics with insulating and intrinsically conducting polymers
02/26/1986EP0172267A1 Tin-lead alloy plating bath
02/26/1986EP0090820B1 Thin layered electronic circuit and manufacturing method thereof
02/25/1986US4573105 Printed circuit board assembly and method for the manufacture thereof
02/25/1986US4572925 Printed circuit boards with solderable plating finishes and method of making the same
02/25/1986US4572888 Photopolymerizable composition with adhesion improving additive
02/25/1986US4572768 Treatment for copper foil
02/25/1986US4572764 Preparation of photoformed plastic multistrate by via formation first
02/25/1986US4572757 Method of making a microcircuit substrate
02/25/1986US4572103 Solder paste dispenser for SMD circuit boards
02/25/1986CA1201210A1 Printed circuit board
02/25/1986CA1200971A1 Low melting temperature glass for use over aluminium interconnects of an integrated circuit structure
02/19/1986EP0171783A2 Module board and module using the same and method of treating them
02/19/1986EP0171748A2 Negative-toning imaging system with re-imaging capability using 4-(2'-nitrophenyl)-1,4-Dihydropyridine compounds
02/19/1986EP0171662A2 Method of fabricating a chip interposer
02/19/1986EP0171630A2 System for producing high resolution circuit lines on a printed circuit board
02/18/1986US4571564 Aperture-coupled microwave apparatus
02/18/1986US4571451 Method for routing electrical connections and resulting product
02/18/1986US4571374 Multilayer dry-film positive-acting laminable photoresist with two photoresist layers wherein one layer includes thermal adhesive
02/18/1986US4571322 Punching oversized holes; filling with polymeric insulation, such as epoxy resin
02/18/1986US4571279 Continuous process for producing reinforced resin laminates
02/18/1986US4571072 System and method for making changes to printed wiring boards
02/18/1986US4571016 Indicator light for printed circuits
02/18/1986US4570338 Methods of forming a screw terminal
02/18/1986US4570337 Method of assembling a chip carrier
02/18/1986CA1200922A1 Method of providing through hole plating between circuit elements
02/18/1986CA1200857A1 Method of constructing an lc network
02/18/1986CA1200856A1 Method of constructing an lc network
02/13/1986WO1986001067A1 Method of and apparatus for forming thick-film circuit
02/13/1986WO1986000842A1 Method and apparatus for multipoint dispensing of viscous material
02/12/1986EP0171239A1 Apparatus and method for surface treatment
02/12/1986EP0171232A2 Area-bonding tape
02/12/1986EP0171157A2 Solventless, polyimide-modified epoxy composition
02/12/1986EP0170971A2 Method for distributing wire load in a multilayer electrical circuit board or Interconnection package
02/12/1986EP0170703A1 Film-shaped connector and method of manufacturing the same
02/11/1986US4570039 Keyswitch structure
02/11/1986US4569902 Inorganic oxide substrate supporting laminate of laternating copper wire and inorsanic oxide insulator
02/11/1986US4569885 Heat treatment to obtain dimensional stability
02/11/1986US4569879 Moisture-resistant hot-tackifying acrylic adhesive tape
02/11/1986US4569877 Heating adhesive and pressing to bond and harden
02/11/1986US4569876 Providing good electrical connection by embedding conductive material in holes in the insulator
02/11/1986US4569743 Accurate dry electrodeposition; semiconductors
02/11/1986US4569720 Copper etching system
02/11/1986US4569127 Apparatus for securing a component to a printed circuit board
02/11/1986CA1200528A1 Apparatus and method of treating tabs of printed circuit boards and the like
02/05/1986EP0170480A2 Flexible electrical connectors
02/05/1986EP0170477A2 Multilayer systems and their method of production
02/05/1986EP0170444A2 Solderable contact materials
02/05/1986EP0170414A2 Process for treating metal surface
02/05/1986EP0170122A2 Low loss, multilevel silicon circuit board
02/05/1986EP0170063A2 Copper-type conductive coating composition
02/05/1986EP0170012A2 Metal-ceramic composite element and process for its production
02/05/1986EP0170002A2 Laminating device
02/05/1986EP0169948A1 Method and apparatus for multipoint dispensing of viscous material
02/05/1986EP0169885A1 Multi-zone thermal process system utilizing nonfocused infrared panel emitters.
02/04/1986US4568999 Multilayer ceramic capacitor on printed circuit
02/04/1986US4568971 Method and apparatus for successively positioning sheets of material with precision for punching aligning holes in the sheets enabling the sheets to be used in the manufacture of composite circuit boards
02/04/1986US4568929 Liquid crystal displays for telephone sets and other telecommunications terminals
02/04/1986US4568896 High frequency circuit device
02/04/1986US4568796 Housing carrier for integrated circuit
02/04/1986US4568602 Sheet material adapted to provide long-lived stable adhesive-bonded electrical connections
02/04/1986US4568592 Anisotropically electroconductive film adhesive