| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/24/1985 | EP0149016A2 A variable size circular aperture camera |
| 07/24/1985 | EP0148820A1 Electronic circuit chip connection assembly and method. |
| 07/23/1985 | US4531145 Method of fabricating complex micro-circuit boards and substrates and substrate |
| 07/23/1985 | US4531044 Method of laser soldering |
| 07/23/1985 | US4530896 Multilayer composite transfer material |
| 07/23/1985 | US4530601 Quantitative test for residual rosin on cleaned circuit boards |
| 07/23/1985 | US4530569 Optical fibers comprising cores clad with amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole |
| 07/23/1985 | US4530552 Electrical connector for integrated circuit package |
| 07/23/1985 | US4530551 Circuit change pin for printed wiring board |
| 07/23/1985 | US4530457 Wave-soldering of printed circuit boards |
| 07/23/1985 | CA1190888A1 Electroplating apparatus with driven contact wheels providing electrodes |
| 07/17/1985 | EP0148650A1 Apparatus for solder removal |
| 07/17/1985 | EP0148602A2 Transfer lamination of conductive metal layers |
| 07/17/1985 | EP0148601A2 Transfer lamination of electrical circuit patterns |
| 07/17/1985 | EP0148506A2 Circuit board |
| 07/17/1985 | EP0148461A1 Methode of producing a multilayer electric circuit with connecting terminals |
| 07/17/1985 | EP0148379A1 Multilayer circuits made of a thermoplastic composite |
| 07/17/1985 | EP0148209A1 Oxidizing accelerator. |
| 07/16/1985 | US4530002 Connection lead arrangement for a semiconductor device |
| 07/16/1985 | US4529836 Stress absorption matrix |
| 07/16/1985 | US4529835 Ceramic thick film circuit substrate |
| 07/16/1985 | US4529477 Process for the manufacture of printed circuit boards |
| 07/16/1985 | US4529116 Methods of and devices for determining the soldering capability of a solder wave |
| 07/16/1985 | US4528833 Method for removal of curling of circuit printable flexible substrate |
| 07/16/1985 | US4528748 Method for fabricating a printed circuit board of desired shape |
| 07/16/1985 | US4528747 Method and apparatus for mounting multilead components on a circuit board |
| 07/16/1985 | US4528746 Device for dismounting integrated circuit devices |
| 07/16/1985 | CA1190662A1 Cure indicator for dry film solder mask |
| 07/16/1985 | CA1190514A1 High speed plating of flat planar workpieces |
| 07/16/1985 | CA1190355A1 Low temperature reduction process for large photomasks |
| 07/10/1985 | EP0148157A2 Printed circuit boards |
| 07/10/1985 | EP0147901A2 Method for coating with ink the walls of through holes in supports for electric circuits, and machine for implementing said method |
| 07/10/1985 | EP0147856A2 Electrically conductive adhesive sheet |
| 07/10/1985 | EP0147641A2 Recording materials for use in electroerosion printing |
| 07/10/1985 | EP0147576A1 Process for forming elongated solder connections between a semiconductor device and a supporting substrate |
| 07/10/1985 | EP0147566A2 Method of forming contacts for flexible module carriers |
| 07/10/1985 | EP0147519A1 An integrated circuit module to planar board interconnection system |
| 07/10/1985 | EP0147470A1 Apparatus for automatically inserting electronic part |
| 07/09/1985 | US4528262 Process for forming photoresist images |
| 07/09/1985 | US4528261 Prelamination, imagewise exposure of photohardenable layer in process for sensitizing, registering and exposing circuit boards |
| 07/09/1985 | US4528259 Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections |
| 07/09/1985 | US4528256 Electrophotographic recording material with condensation product |
| 07/09/1985 | US4528245 Pretreatment of plastic materials for metal plating |
| 07/09/1985 | US4528212 Coated ceramic substrates for mounting integrated circuits |
| 07/09/1985 | US4528081 Dual curing silicone, method of preparing same and dielectric soft-gel compositions thereof |
| 07/09/1985 | US4528072 Process for manufacturing hollow multilayer printed wiring board |
| 07/09/1985 | US4528064 Method of making multilayer circuit board |
| 07/09/1985 | US4527890 Automatic repetitive registration and imagewise exposure of sheet substrates |
| 07/09/1985 | US4527731 Method and apparatus for applying stripes of solder to articles |
| 07/09/1985 | CA1190297A1 Paddlecard terminator |
| 07/04/1985 | WO1985002969A1 Production of copper-clad dielectric boards |
| 07/04/1985 | WO1985002946A1 Film-shaped connector and method of manufacturing the same |
| 07/04/1985 | WO1985002870A1 Production of a matte surface om a metal layer |
| 07/03/1985 | EP0147353A2 Lamp socket assembly for mounting on printed circuit board |
| 07/03/1985 | EP0147245A2 Arrangement and process for continuity control of printed circuits |
| 07/03/1985 | EP0147045A2 Membrane type circuit having improved tail |
| 07/03/1985 | EP0147014A2 Multilayer printed circuit board structure |
| 07/03/1985 | EP0147001A1 Mass wave soldering system II |
| 07/03/1985 | EP0147000A1 Mass wave soldering system I |
| 07/03/1985 | EP0146782A2 Adaptation device for the establishment of a removable electrical connection between contact elements |
| 07/03/1985 | EP0146767A1 Method for plating polyamide resin molded article |
| 07/03/1985 | EP0146724A1 Process for pre-treating polyamide substrates for electroless plating |
| 07/03/1985 | EP0146723A1 Process for activating the adhesion properties of polyamide substrates for electroless metallization |
| 07/02/1985 | US4527041 Method of forming a wiring pattern on a wiring board |
| 07/02/1985 | US4527030 Keyboard |
| 07/02/1985 | US4526859 Metallization of a ceramic substrate |
| 07/02/1985 | US4526835 Multi-layer printed circuit board and process for production thereof |
| 07/02/1985 | US4526810 Process for improved wall definition of an additive printed circuit |
| 07/02/1985 | US4526807 Method for deposition of elemental metals and metalloids on substrates |
| 07/02/1985 | US4526806 One-step plasma treatment of copper foils to increase their laminate adhesion |
| 07/02/1985 | CA1189924A1 Contact insertable in a metallized hole of a printed circuit card and process of manufacture and process of insertion of that contact |
| 07/02/1985 | CA1189748A1 Maskless coating of metallurgical features of a dielectric substrate |
| 07/01/1985 | EP0088074A4 Plasma reactor and method therefor. |
| 06/26/1985 | EP0146505A2 Image formation process |
| 06/26/1985 | EP0146463A2 Compliant lead frame for surface mount semiconductor packages |
| 06/26/1985 | EP0146458A1 Electric interconnection device for printed circuit boards |
| 06/26/1985 | EP0146241A2 Circuit board |
| 06/26/1985 | EP0146061A2 Liquid chemical process for forming conductive through-holes through a dielectric layer |
| 06/26/1985 | EP0146036A2 Method of forming multilayer ceramic substrates from large area green sheets |
| 06/26/1985 | EP0145975A1 Apparatus and method for heating objects EG chips during soldering, to and maintaining them at a desired temperature |
| 06/26/1985 | EP0145969A2 Vapor tank |
| 06/26/1985 | EP0145925A2 Iterative method for establishing connections between nodes and the resulting product |
| 06/26/1985 | EP0145910A2 Method of assembling asymmetrically preswaged magnetic pins into a pattern of perforations in a printed circuit board |
| 06/26/1985 | EP0145862A2 Metallization of a ceramic substrate |
| 06/26/1985 | EP0145830A1 Contact spring assembly for a computer-controlled printed circuit board testing device |
| 06/26/1985 | EP0145785A1 Solderable plated plastic components. |
| 06/26/1985 | EP0145725A1 Method of and apparatus for real-time high-speed inspection of objects for identifying or recognizing known and unknown portions thereof, including defects and the like. |
| 06/25/1985 | USRE31929 Electronic package and accessory component assembly |
| 06/25/1985 | US4525644 Piezoelectric-enhanced circuit connection means |
| 06/25/1985 | US4525597 Ceramic leadless packages and a process for manufacturing the same |
| 06/25/1985 | US4525422 Copper phosphate protective coatings on copper |
| 06/25/1985 | US4525390 Deposition of copper from electroless plating compositions |
| 06/25/1985 | US4525383 Method for manufacturing multilayer circuit substrate |
| 06/25/1985 | US4525247 Anodizing, electroplating, electroless plating; copper, aluminum, nickel components |
| 06/25/1985 | US4525246 Electrodeposition of a thin non-solderable solder layer as a chemical resist |
| 06/25/1985 | US4525238 Process for manufacturing an electric circuit intended for firing a pyrotechnic device and the circuit thus obtained |
| 06/25/1985 | US4525061 Combination of a plate for exposure and frame plates |
| 06/25/1985 | US4525060 Film exposure apparatus |
| 06/25/1985 | CA1189631A1 Circuit boards with die stamped contact pads and conductive ink circuit patterns |
| 06/25/1985 | CA1189630A1 Circuit board fabrication leading to increased capacity |