| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/10/1985 | CA1193370A1 Interconnected printed circuit boards and method of connecting circuit boards |
| 09/04/1985 | EP0153904A2 Process for the preparation of a protection layer or a relief pattern |
| 09/04/1985 | EP0153683A2 Process for making circuit boards |
| 09/04/1985 | EP0153650A2 Thin film hybrid circuit |
| 09/04/1985 | EP0153618A2 Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same |
| 09/03/1985 | US4539479 Automatic apparatus and method for exposing, registering, and handling double-sided printed circuit boards |
| 09/03/1985 | US4539434 Film-type electrical substrate circuit device and method of forming the device |
| 09/03/1985 | US4539090 Continuous electroplating device |
| 09/03/1985 | US4539070 Exposure of photo resist |
| 09/03/1985 | US4539069 Printed circuit board component conveyor apparatus and process |
| 09/03/1985 | US4539058 Forming multilayer ceramic substrates from large area green sheets |
| 09/03/1985 | US4538878 Solderless circuit board connector |
| 09/03/1985 | US4538865 Device for connecting printed wiring boards or sheets |
| 09/03/1985 | US4538346 Method for manufacture of selectively coated carrier plate |
| 09/03/1985 | CA1193029A1 Electrical header assembly |
| 08/29/1985 | WO1985003672A1 Rotary screen printing apparatus |
| 08/29/1985 | WO1985003669A1 Method and apparatus for laminating flexible printed circuits |
| 08/28/1985 | EP0153202A2 Microwave detection system |
| 08/28/1985 | EP0153098A2 Copper foil laminate for use as a base plate or substrate for electronic devices |
| 08/28/1985 | EP0152794A2 Multi-layered electrical interconnection structure |
| 08/28/1985 | EP0152634A2 Method for manufacture of printed wiring board |
| 08/28/1985 | EP0152600A2 Method and apparatus for the treatment of printed circuit boards |
| 08/28/1985 | EP0152508A2 Coreless-brushless motor |
| 08/28/1985 | EP0152428A1 Process for beveling a metal layer in an integrated circuit |
| 08/27/1985 | US4538210 Mounting and contacting assembly for plate-shaped electrical device |
| 08/27/1985 | US4538205 Means and method for fabricating planar terminated capacitors |
| 08/27/1985 | US4538143 Light-emitting diode displayer |
| 08/27/1985 | US4537799 Selective metallization process |
| 08/27/1985 | US4537794 Method of coating ceramics |
| 08/27/1985 | US4537663 Method of and apparatus for plating using controlled progressive immersion |
| 08/27/1985 | US4537461 Lead having a solder-preform and preform-carrying finger engageable directly with a contact pad |
| 08/27/1985 | US4536955 Devices for and methods of mounting integrated circuit packages on a printed circuit board |
| 08/27/1985 | CA1192672A1 Method of producing positive slope step changes on vacuum deposited layers |
| 08/27/1985 | CA1192480A1 Adhesion bond-breaking of lift-off regions on semiconductor structures |
| 08/27/1985 | CA1192449A1 Metal ceramics composites and a method for producing said composites |
| 08/21/1985 | EP0152179A2 UV curable silicone rubber compositions |
| 08/21/1985 | EP0151873A2 Mold release sheet and method of manufacture |
| 08/20/1985 | US4536825 Leadframe having severable fingers for aligning one or more electronic circuit device components |
| 08/20/1985 | US4536470 Method and apparatus for making a mask conforming to a ceramic substrate metallization pattern |
| 08/20/1985 | US4536468 Method of forming resist pattern |
| 08/20/1985 | US4536452 Free of mica phase |
| 08/20/1985 | US4536435 Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material |
| 08/20/1985 | US4536250 Method of making liquid jet recording head |
| 08/20/1985 | US4536239 Multi-layer circuit board inspection system |
| 08/20/1985 | US4535722 Apparatus for applying molten wax onto printed circuit board |
| 08/20/1985 | US4535534 Method of mounting a switch body on a printing wiring board or panel |
| 08/20/1985 | CA1192040A1 Silk screen printing paste with lead glass which is to be fired in a non-oxidising atmosphere |
| 08/14/1985 | EP0151413A2 Auto-selective metal deposition on dielectric surfaces |
| 08/14/1985 | EP0151408A2 A method of forming a patterned resist mask for etching via holes in an insulating layer |
| 08/14/1985 | EP0151372A2 Image production |
| 08/14/1985 | EP0151251A2 Drill having a plurality of cutting edges |
| 08/14/1985 | EP0151236A1 Apparatus for and method of monitoring the operations of a plating process |
| 08/13/1985 | USRE31967 Gang bonding interconnect tape for semiconductive devices and method of making same |
| 08/13/1985 | US4535388 High density wired module |
| 08/13/1985 | US4535385 Circuit module with enhanced heat transfer and distribution |
| 08/13/1985 | US4535012 Dissolving a carboxylated uinyl with metallic silver and epoxy resin;heating to gform electroconductive film |
| 08/13/1985 | US4534832 Arrangement and method for current density control in electroplating |
| 08/13/1985 | US4534797 Method for providing an electroless copper plating bath in the take mode |
| 08/13/1985 | US4534649 Surface profile interferometer |
| 08/13/1985 | US4534604 Vertical mounting device for electrical circuit board components |
| 08/13/1985 | US4534536 Apparatus for mounting samples for polishing |
| 08/13/1985 | CA1191770A1 Method of inducing flow or densification of phosphosilicate glass for integrated circuits |
| 08/13/1985 | CA1191745A1 Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate |
| 08/13/1985 | CA1191728A1 Imaging system utilizing a fresnel lens |
| 08/07/1985 | EP0150928A2 A compliant interconnection device and assembly method of manufacture, and of micro interconnection casting |
| 08/07/1985 | EP0150882A1 Conductive die attach tape |
| 08/07/1985 | EP0150733A2 Process for printed circuit board maufacture |
| 08/07/1985 | EP0150570A2 Resin impregnation method |
| 08/07/1985 | EP0150512A2 Dissolution of metals utilizing tungsten-diol combinations |
| 08/07/1985 | EP0150413A1 Method for providing an electroless copper plating bath in the take mode |
| 08/07/1985 | EP0150402A1 Method of depositing a metal from an electroless plating solution |
| 08/07/1985 | EP0150358A2 Laser induced dry chemical etching of metals |
| 08/06/1985 | US4533976 Electronic unit |
| 08/06/1985 | US4533889 Relays and method for mounting relays on printed circuit boards |
| 08/06/1985 | US4533787 Printed circuit assembly |
| 08/06/1985 | US4533624 Applying pghotoresist to substrates; masking, plasma etching accur |
| 08/06/1985 | US4533445 U.V. Curable composition |
| 08/06/1985 | US4533431 Process for producing conductors for integrated circuits using planar technology |
| 08/06/1985 | US4533240 Film to panel registration device |
| 08/06/1985 | US4533188 Header and housing assembly for electronic circuit modules |
| 08/06/1985 | US4532884 Device for applying a fixing medium to components such as chip-type components |
| 08/06/1985 | US4532839 Method for simultaneously cutting a plurality of circuit boards |
| 08/06/1985 | CA1191565A1 Means and a method for converting finished electrical components with terminal leads to elements having planar terminations |
| 08/01/1985 | WO1985003405A1 Pick-up head for handling electrical components |
| 08/01/1985 | WO1985003404A1 Head for handling electrical components |
| 08/01/1985 | WO1985003387A1 Electric connector for an electronic circuit module |
| 08/01/1985 | WO1985003378A1 Method of manufacturing transparent electrode substrate |
| 08/01/1985 | WO1985003248A1 Multi-zone thermal process system utilizing nonfocused infrared panel emitters |
| 07/31/1985 | EP0149932A1 Support for a fast acting component, especially a hyperfrequency component, incorporating decoupling elements |
| 07/31/1985 | EP0149923A2 Microcircuit substrate and method of making same |
| 07/31/1985 | EP0149779A2 Laser induced chemical etching of metals with excimer lasers |
| 07/30/1985 | US4532186 Circuit substrate with resistance layer and process for producing the same |
| 07/30/1985 | US4532152 Fabrication of a printed circuit board with metal-filled channels |
| 07/30/1985 | US4532015 Depositing conductive metal onto polyarylene sulfide substrate by electroless plating, aging to improve adhesion |
| 07/30/1985 | US4531793 Multipole edge strip connector |
| 07/30/1985 | US4531474 Rotary board treating apparatus |
| 07/30/1985 | US4531285 Method for interconnecting close lead center integrated circuit packages to boards |
| 07/30/1985 | EP0123692A4 Leadless chip carrier for logic components. |
| 07/30/1985 | CA1191279A1 Method of producing printed circuits |
| 07/24/1985 | EP0149394A2 Process for making a panel made of polypropylene as basic component, which has several metallic layers, and panel made according to this process |