| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/04/1986 | US4568586 Metal layer is firmly bonded to deramic substrate after cooling and solidification of eutectic interlayer |
| 02/04/1986 | US4568571 Treating with metal chloride solution and with noble metal-containing activator solution |
| 02/04/1986 | US4568562 Method of electroless plating employing plasma treatment |
| 02/04/1986 | US4568413 Vapor-vacuum deposition followed by electrodeposition |
| 02/04/1986 | US4568277 Apparatus for heating objects to and maintaining them at a desired temperature |
| 02/04/1986 | CA1200178A1 Device for cleaning objects by scrubbing in the presence of solvent |
| 01/29/1986 | EP0169820A2 Process for producing protective envelopes in which corresponding electric-electronic circuit components are dipped |
| 01/29/1986 | EP0169788A2 Mounting structure of flat-lead package-type electronic component |
| 01/29/1986 | EP0169530A2 Multilayer printed circuit board |
| 01/29/1986 | EP0169456A2 Method of eliminating short circuits in electrical circuitry |
| 01/29/1986 | EP0169312A1 Deposition of metals as interlayers within organic polymeric films |
| 01/29/1986 | EP0169265A2 Process for making printed-circuit boards with plated through-holes |
| 01/29/1986 | EP0169261A1 Electronic component |
| 01/28/1986 | US4567543 Double-sided flexible electronic circuit module |
| 01/28/1986 | US4567542 Alumina ceramic containing borosilicate-lead-glass and one high dielectric ceramic layer |
| 01/28/1986 | US4567490 Conductors, graphite fluoride or graphite-teflon |
| 01/28/1986 | US4567128 Cover sheet in a photosensitive element |
| 01/28/1986 | US4567062 Printed circuits |
| 01/28/1986 | US4566624 Mass wave soldering system |
| 01/28/1986 | US4566186 Multilayer interconnect circuitry using photoimageable dielectric |
| 01/28/1986 | CA1200019A1 Electrical contact materials |
| 01/28/1986 | CA1199754A1 Catalyst solutions for activating non-conductive substrates and electroless plating process |
| 01/22/1986 | EP0169060A2 Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them |
| 01/22/1986 | EP0168900A1 Improved contact element and method of manufacture |
| 01/22/1986 | EP0168849A1 Starting mixture for an insulating composition, silk screen printing ink comprising such a mixture for the manufacture of hybrid microcircuits on a colaminate substrate |
| 01/22/1986 | EP0168609A1 Method for repairing pinholes in dielectric layers |
| 01/22/1986 | EP0168605A2 Non-contact detection of liquefaction in meltable materials |
| 01/22/1986 | EP0168602A1 Method for making interconnection circuit boards |
| 01/22/1986 | EP0168535A1 A method of producing a layered structure |
| 01/22/1986 | EP0168509A1 Manufacture of connection holes in plastic plates and application of the method |
| 01/22/1986 | EP0168443A1 Device comprising a modular electric or electronic circuit and connector |
| 01/21/1986 | US4565966 Method and apparatus for testing of electrical interconnection networks |
| 01/21/1986 | US4565917 Multi-zone thermal process system utilizing nonfocused infrared panel emitters |
| 01/21/1986 | US4565769 Polymeric sensitizers for photopolymer composition |
| 01/21/1986 | US4565610 Bath and process for plating lead and lead/tin alloys |
| 01/21/1986 | US4565609 Bath and process for plating tin, lead and tin-lead alloys |
| 01/21/1986 | US4565606 Metallization of electrically insulating polyimide/aromatic polyamide film substrates |
| 01/21/1986 | US4565478 Materials handling device |
| 01/21/1986 | US4565443 Printing apparatus |
| 01/21/1986 | US4565314 Registration and assembly of integrated circuit packages |
| 01/21/1986 | CA1199697A1 Socket terminal positioning method and construction |
| 01/15/1986 | EP0168287A1 Process for making printed circuits, and printed circuit obtained by this method |
| 01/15/1986 | EP0168228A2 Display device |
| 01/15/1986 | EP0168227A2 Anisotropic electric conductive rubber connector |
| 01/15/1986 | EP0167867A2 Arrangement of layers affixed to each other, and process for making a multilayer circuit board using it |
| 01/14/1986 | US4564582 Bonding integrated circuits |
| 01/14/1986 | US4564578 Novel thioxanthones substituted by alpha-aminoalkyl groups |
| 01/14/1986 | US4564563 Solderable conductor |
| 01/14/1986 | US4564424 Metallization of electrically insulating polymeric film substrates |
| 01/14/1986 | US4564423 Permanent mandrel for making bumped tapes and methods of forming |
| 01/14/1986 | US4564135 Chip carrier soldering tool |
| 01/14/1986 | US4563974 Apparatus for the application of solder to workpieces |
| 01/14/1986 | CA1199422A1 Method and apparatus for mounting multilead components on a circuit board |
| 01/14/1986 | CA1199421A1 Electrical assembly including a conductor pattern bonded to a non-metallic substrate and method of fabricating such assembly |
| 01/08/1986 | EP0167493A2 Edge clip |
| 01/08/1986 | EP0167344A2 Multilayer interconnect circuitry using photoimageable dielectric |
| 01/08/1986 | EP0167326A2 Sensitizing agent for electroless plating and method for sensitizing substrate with the agent |
| 01/08/1986 | EP0167198A1 Starting mixture for an isolating composition containing a lead glass, screen printing ink comprising such a mixture, and use of this ink for protecting hybrid microcircuits on ceramic substrates |
| 01/08/1986 | EP0167051A1 Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation |
| 01/08/1986 | EP0167030A1 Method of forming solder interconnections for semiconductor devices |
| 01/08/1986 | EP0166817A1 Method and device for soldering leads of electric components as well as arrangement of electric components |
| 01/08/1986 | EP0166762A1 Electrical circuitry |
| 01/07/1986 | USH13 Connecting a flat-pack-packaged chip to a printed circuit board |
| 01/07/1986 | US4563725 Electrical assembly |
| 01/07/1986 | US4563543 Stable interface between silver alloy and gold deposits |
| 01/07/1986 | US4563242 Method for plating polyamide resin molded article |
| 01/07/1986 | US4563238 Multistep |
| 01/07/1986 | US4562637 Method of manufacturing solar battery |
| 01/07/1986 | EP0148209A4 Oxidizing accelerator. |
| 01/07/1986 | CA1198958A1 Method of cleaning and reclaiming printing screens |
| 01/03/1986 | WO1986000190A1 Method of forming electrically conductive circuit |
| 01/03/1986 | WO1986000085A1 Composition and process for treating plastics with alkaline permanganate solutions |
| 01/02/1986 | EP0166665A2 Method of making substrates for printed circuits, composition used in this process and substrates so obtained |
| 01/02/1986 | EP0166627A1 Connexion of an electrical circuit on a rigid support with an electrical circuit on at least one flexible support |
| 01/02/1986 | EP0166588A1 Epoxy resin composition |
| 01/02/1986 | EP0166401A2 Circuit module |
| 01/02/1986 | EP0166327A2 Process for manufacturing printed circuit boards |
| 01/02/1986 | EP0166289A2 High density module for semiconductor device chips |
| 01/02/1986 | EP0166110A2 Circuit board arrangement |
| 01/02/1986 | EP0166105A2 Flexible board and process for making it |
| 12/31/1985 | US4562514 Polarized electronic component and its manufacturing process |
| 12/31/1985 | US4562513 Process for forming a high density metallurgy system on a substrate and structure thereof |
| 12/31/1985 | US4562301 Through-hole pin for laminated circuit substrates and method of insertion thereof |
| 12/31/1985 | US4562092 Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits |
| 12/31/1985 | US4561931 Applying polyvinyl alcohol and sensitizer, drying exposing, and developing |
| 12/31/1985 | US4561709 Membrane type circuit having improved tail |
| 12/31/1985 | US4561586 Method of removing a soldered integrated circuit package from a printed circuit board |
| 12/31/1985 | US4561535 Apparatus for placing a board into an upright state |
| 12/31/1985 | US4561173 Method of manufacturing a wiring system |
| 12/31/1985 | CA1198833A1 Tape-automated-bonding of integrated circuits |
| 12/31/1985 | CA1198831A1 Nondestructive dimensional detection system |
| 12/31/1985 | CA1198830A1 Board to board interconnect structure |
| 12/31/1985 | CA1198829A1 High-speed wire wrap board |
| 12/31/1985 | CA1198662A1 Process for preparing high temperature polyimide film laminates |
| 12/27/1985 | EP0165705A1 Integrated circuit chip carrier |
| 12/27/1985 | EP0165692A2 Magnetic bubble memory component |
| 12/27/1985 | EP0165575A2 Method for forming vias in a planar structure |
| 12/27/1985 | EP0165561A2 Device for the treatment of flat plates |
| 12/27/1985 | EP0165427A2 Semiconductor package substrate and manufacturing process |
| 12/27/1985 | EP0165273A1 Plant for the treatment of objects by means of a liquid |