Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/1985
02/13/1985EP0132740A2 Method of forming a dielectric substrate
02/13/1985EP0132704A2 Contact pin for electronic components, especially printed circuit boards
02/13/1985EP0132677A1 Process for activating substrate surfaces for the direct partial metallization of support materials
02/13/1985EP0132652A2 Method of manufacturing a printed circuit board drill
02/13/1985EP0132585A2 Lift-off process and composition therefor
02/12/1985US4499524 High value surface mounted capacitor
02/12/1985US4499157 Surface pretreatment, electroless, then electrolytic deposition ofmetal
02/12/1985US4499152 Metal oxide layer between coupler coated on substrate and thin metal film; antipeeling agents; printed circuits
02/12/1985US4498727 Phospor-bronze base, gold binder layers
02/12/1985CA1182591A1 Fabrication of semiconductor modules with ceramic substrates and detection of residual glass
02/05/1985US4497890 Process for improving adhesion of resist to gold
02/05/1985US4497889 Release compound in negative acting photopolymerizable element
02/05/1985US4497875 Ceramic substrate with metal plate
02/05/1985US4497692 Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
02/05/1985US4497687 Gaseous nitrogen dioxide and water as catalyst and solvent
02/05/1985US4497686 Fine-line die and method of making same
02/05/1985US4497684 Lift-off process for depositing metal on a substrate
02/05/1985US4497677 Method for manufacturing ceramic substrate
02/05/1985CA1182035A1 Continuous production of electrical laminates
01/1985
01/31/1985WO1985000467A1 Electronic circuit chip connection assembly and method
01/31/1985WO1985000387A1 Oxidizing accelerator
01/29/1985US4496793 Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion
01/29/1985US4496607 Laser process for producing electrically conductive surfaces on insulators
01/29/1985US4496420 Process for plasma desmear etching of printed circuit boards and apparatus used therein
01/29/1985US4496415 Method for impregnating resin powder directly into a laminate lay up
01/29/1985US4496311 Multilamp photoflash array fabrication
01/29/1985US4496094 Paddlecard terminator
01/29/1985CA1181824A1 Stripline cable with reduced crosstalk
01/29/1985CA1181551A1 Powder for use in dry sensitization for electroless plating and a method for its preparation
01/23/1985EP0132006A2 Decoupling capacitor integrated between an H.F. output line and an H.F. cavity
01/23/1985EP0131879A1 Double belt press for the continuous production of laminates
01/23/1985EP0131824A2 Photopolymerizable composition
01/23/1985EP0131737A1 Method of connecting two conductors
01/23/1985EP0131730A1 Process for protecting the surface of a solder bath
01/22/1985US4495546 Hybrid integrated circuit component and printed circuit board mounting said component
01/22/1985US4495480 Multipattern electric component connecting pin base plate mounting assembly
01/22/1985US4495479 Selective wiring for multilayer printed circuit board
01/22/1985US4495399 Micro-arc milling of metallic and non-metallic substrates
01/22/1985US4495378 Heat-removing circuit boards
01/22/1985US4495257 Horizontal battery holder for cylinder cells
01/22/1985US4495255 Laser surface alloying
01/22/1985US4495253 Solderable plated plastic components and process for plating _
01/22/1985US4495232 Stamping foils and methods
01/22/1985US4495216 Powder for use in dry sensitization for electroless plating
01/22/1985US4495014 Laminating and trimming process
01/22/1985US4494818 Mounting member for electrical contacts
01/22/1985US4494308 Connecting a cable to a P.C. board
01/22/1985CA1181534A1 Method of providing raised contact portions on contact areas of an electronic microcircuit
01/22/1985CA1181530A1 Circuit assembly and method of making same
01/16/1985EP0131492A1 Components board comprising connection points, and process for marking these points
01/16/1985EP0131299A2 Controlled roughening of photosensitive composition
01/16/1985EP0131242A2 Multi-layer ceramic substrate and method for the production thereof
01/16/1985EP0131195A2 Process for the activation of substrates for electroless metal plating
01/15/1985US4494172 High-speed wire wrap board
01/15/1985US4494139 Automatic assembly system
01/15/1985US4494083 Impedance matching stripline transition for microwave signals
01/15/1985US4493954 Rotary switch with internal rotor interconnecting circuit paths for surface contacts
01/15/1985US4493857 Method for applying a coating to a thin board
01/15/1985US4493856 Selective coating of metallurgical features of a dielectric substrate with diverse metals
01/15/1985US4493758 Anode structure for a plating cell
01/15/1985US4493757 Device for applying blot-shaped coverings by electro-plating
01/15/1985US4493667 Multilamp photoflash array fabrication
01/15/1985US4493145 Integrated circuit device having easily cleaned region between mother board and chip carriers mounted thereon
01/15/1985US4493137 Method of making a drive element assembly for ink jet printing
01/15/1985CA1181143A1 Flexible solder socket for connecting leadless integrated circuit packages to a printed circuit board
01/09/1985EP0130845A2 Interconnection apparatus for wiring harnesses
01/09/1985EP0130844A2 Interconnection apparatus for wiring harnesses
01/09/1985EP0130719A2 A connector and packaging structure for a semiconductor device employing the connector
01/09/1985EP0130643A1 Device for soldering an element to a print substrate
01/09/1985EP0130615A2 Process for making printed-circuit boards, and photolacquer for carrying out this process
01/09/1985EP0130468A2 Protective coatings for conductors to prevent mechanical and electronic failures particularly during heat-treatment of their supporting structures
01/09/1985EP0130462A2 Printed circuits
01/09/1985EP0130430A2 Method of generating circuit boards using electroeroded sheet layers and circuit boards so produced
01/09/1985EP0130417A2 A method of fabricating an electrical interconnection structure for an integrated circuit module
01/09/1985EP0130410A2 Printed circuit board structure for metal package containing high-frequency component
01/09/1985EP0130312A2 Continuous method of making layered products with metal layers
01/09/1985EP0027134B1 Method for distributing a uniform coating on a surface
01/08/1985US4492747 Flexible laminatable photosensitive layer
01/08/1985US4492739 Eutectic fine wire arrays
01/08/1985US4492738 Diffraction grating wire arrays in series
01/08/1985US4492621 Confining electroyte flow around cathode
01/08/1985US4492460 Method of making representations of, and method of and means for making, printed circuit boards
01/03/1985WO1985000085A1 Printed board for the surface soldering of integrated miniature circuits and manufacturing method of such printed boards
01/02/1985EP0129966A1 High cooling efficiency circuit module
01/02/1985EP0129697A2 Method of making printed circuit boards
01/01/1985US4491622 Composites of glass-ceramic to metal seals and method of making the same
01/01/1985US4491376 For a printed circuit board
01/01/1985US4491295 Gang cutting tool assembly and method of forming same
12/1984
12/27/1984EP0129137A2 Method of forming an aperture in a dielectric substance and securing a conductive pin in said aperture
12/27/1984CA1179837A Method for constructing an electrical interconnection circuit and apparatus for realising the method
12/25/1984US4490775 Universal programmable interface
12/25/1984US4490737 Smooth glass insulating film over interconnects on an integrated circuit
12/25/1984US4490706 Electronic parts
12/25/1984US4490690 Strip line cable
12/25/1984US4490614 Housing for an ionization detector array in a tomographic scanner
12/25/1984US4490496 Moistureproof insulating coating composition for packing circuit boards
12/25/1984US4490457 Cold/dry substrate treatment technique which improves photolithographic limits of resolution and exposure tolerance
12/25/1984US4490429 Process for manufacturing a multilayer circuit board
12/25/1984US4490230 Box plating
12/25/1984US4490218 Process and apparatus for producing surface treated metal foil