| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) | 
|---|
| 05/14/1985 | US4516824 Lamp socket assembly for mounting on printed circuit board | 
| 05/14/1985 | US4516816 In circuit modification device for dual in line packaged components | 
| 05/14/1985 | US4516495 Method and arrangement for positioning a second pattern originating from a pattern formed on a stencil in relation to a material intended for the pattern | 
| 05/14/1985 | CA1187201A1 Inspection of multilayer ceramic circuit modules by electrical inspection of unfired green sheets | 
| 05/09/1985 | WO1985001963A1 Plant for tinning printed circuit boards | 
| 05/09/1985 | WO1985001913A1 Process and plant for compressing flexible sheets and keyboard fabricated according to this process | 
| 05/08/1985 | EP0140746A2 Method for the heat treatment of electrical conducting coatings on dielectric substrates by microwaves | 
| 05/08/1985 | EP0140619A2 Anisotropic-electroconductive adhesive film and circuit connecting method using the same | 
| 05/08/1985 | EP0140585A1 A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself | 
| 05/08/1985 | EP0140473A1 Solderless circuit board conductor and connector assemblies employing same | 
| 05/08/1985 | EP0140350A2 Liquid crystal panel display device | 
| 05/08/1985 | EP0140304A2 Conductive patterns in polymeric films | 
| 05/08/1985 | EP0140259A2 Transverse gradient field coil | 
| 05/08/1985 | EP0140112A2 Process and device for severing conductive paths | 
| 05/08/1985 | EP0139846A2 Workpiece clamp assembly for plating machine | 
| 05/08/1985 | EP0139662A1 Improved socket terminal positioning method and construction. | 
| 05/07/1985 | US4516188 Logic card | 
| 05/07/1985 | US4516103 Plug-in arrangement and process for tin plating contacts of a plug-in arrangement | 
| 05/07/1985 | US4515878 Film copy of glass master | 
| 05/07/1985 | US4515829 Through-hole plating | 
| 05/07/1985 | US4515671 Electrochemical treatment of copper for improving its bond strength | 
| 05/07/1985 | US4515505 Pressure foot assembly for an end mill delete cutter | 
| 05/07/1985 | US4515304 Mounting of electronic components on printed circuit boards | 
| 05/07/1985 | US4515297 Methods for multipoint dispensing of viscous material | 
| 05/07/1985 | CA1186758A1 Compliant termination for ceramic chip capacitors | 
| 05/07/1985 | CA1186569A1 Conductive coatings for electret devices | 
| 05/02/1985 | EP0139528A2 Lead member and method for fixing thereof | 
| 05/02/1985 | EP0139519A2 Drying apparatus | 
| 05/02/1985 | EP0139431A2 Method of mounting a carrier for a microelectronic silicon chip | 
| 05/02/1985 | EP0139233A1 Method for conditioning a surface of a dielectric substrate for electroless plating | 
| 05/02/1985 | EP0139205A2 Method of producing semiconductor components having a metal substrate | 
| 05/02/1985 | EP0139090A1 Process for the pre-treatment of polyimides | 
| 05/02/1985 | EP0139030A1 Improved printed circuit board | 
| 05/02/1985 | EP0138863A1 Assembling components on a printed circuit board. | 
| 05/02/1985 | EP0138830A1 Marking plate device | 
| 04/30/1985 | US4514786 Integrated-circuit support device employed in a system for selecting high-reliability integrated circuits | 
| 04/30/1985 | US4514321 Thick film conductor compositions | 
| 04/30/1985 | US4514042 Thin structure of display panel | 
| 04/30/1985 | US4513543 Treatment of coated glass | 
| 04/24/1985 | EP0138673A2 Method of making a printed circuit board | 
| 04/24/1985 | EP0138672A2 Method of making a printed circuit board | 
| 04/24/1985 | EP0138671A2 Method of making a printed circuit board | 
| 04/24/1985 | EP0138531A1 Process for cleaning copper base materials and regenerating the cleaning solution | 
| 04/24/1985 | EP0138368A2 Circuit board thickness compensator | 
| 04/24/1985 | EP0138312A1 Jigs for locating electrical components | 
| 04/24/1985 | EP0138293A2 A device for mounting an electrolytic capacitor of like electrical component | 
| 04/24/1985 | EP0138209A2 Epoxy resin composition | 
| 04/24/1985 | EP0137981A2 Through-hole plating | 
| 04/24/1985 | EP0137927A2 Process for the controlled etching of tapered vias in borosilicate glass dielectrics | 
| 04/24/1985 | EP0137923A1 Electroconductive film system for aircraft windows | 
| 04/23/1985 | US4513266 Microwave ground shield structure | 
| 04/23/1985 | US4513064 Military ordinance applications | 
| 04/23/1985 | US4512861 Electrophoretic coating process | 
| 04/23/1985 | US4512855 Deposition of metals as interlayers within organic polymeric films | 
| 04/23/1985 | US4512854 Using masking tape of foil-like carrier adhesive coating, and elecctrical conductor | 
| 04/23/1985 | US4512829 Process for producing printed circuit boards | 
| 04/23/1985 | US4512818 Solution for formation of black oxide | 
| 04/23/1985 | US4512509 Technique for bonding a chip carrier to a metallized substrate | 
| 04/23/1985 | US4512508 Method and apparatus for the machine soldering of workpieces | 
| 04/23/1985 | CA1185824A1 Photoimaging process in which a toned image is transferred to a cover sheet on a photosensitive layer | 
| 04/17/1985 | EP0137694A2 Printed circuit board maximizing areas for component utilization | 
| 04/17/1985 | EP0137569A2 Screen printing device | 
| 04/17/1985 | EP0137449A2 Method for producing thermoplastic resin sheet or filler-containing resin sheet | 
| 04/17/1985 | EP0137349A2 Dual-in-line connector assembly | 
| 04/17/1985 | EP0137279A2 Printed wiring board | 
| 04/16/1985 | US4511757 Circuit board fabrication leading to increased capacity | 
| 04/16/1985 | US4511634 Solderable layer system | 
| 04/16/1985 | US4511597 Quinone reducing agent, non-noble metal salt | 
| 04/16/1985 | US4511595 Laser-activated chemical-depositing method and apparatus | 
| 04/16/1985 | US4511448 Plating apparatus | 
| 04/16/1985 | US4511445 Process of enhancing conductivity of material | 
| 04/16/1985 | US4511076 Method of soldering circuit boards with solder-repellent contacts | 
| 04/16/1985 | US4510685 Method of assembling magnetic pins into printed circuit boards | 
| 04/16/1985 | CA1185687A1 Switching network for megahertz frequency signals | 
| 04/11/1985 | WO1985001634A1 Electronic circuit assembly | 
| 04/11/1985 | EP0120083A4 Apparatus and method for electroless plating. | 
| 04/10/1985 | EP0136575A1 Soldering equipment, especially for the production of supplementary connecting modifications on printing boards | 
| 04/10/1985 | EP0136568A2 Electrical apparatus | 
| 04/10/1985 | EP0136534A2 Method of forming a large surface area integrated circuit | 
| 04/10/1985 | EP0136364A1 Method and apparatus for the selective and self-adjusting deposition of metal layers and application of this method | 
| 04/10/1985 | EP0136332A1 Wire coil assembly for matrix print head and manufacturing method. | 
| 04/09/1985 | US4510446 Test coupons for determining the registration of subsurface layers in a multilayer printed circuit board | 
| 04/09/1985 | US4510347 Formation of narrow conductive paths on a substrate | 
| 04/09/1985 | US4510276 Epoxy resin and curing agent in solvent with flow control agent and thickener | 
| 04/09/1985 | US4510008 Continuous production of copper-clad laminate | 
| 04/09/1985 | US4510000 Method for palladium activating molybdenum metallized features on a ceramic substrate | 
| 04/09/1985 | US4509994 Solder composition for high-density circuits | 
| 04/09/1985 | US4509808 High voltage, gas tight connector | 
| 04/09/1985 | CA1185387A1 Radiation-polymerizable mixture including a compound having terminal unsaturated groups and a compound having two epoxy groups | 
| 04/09/1985 | CA1185151A1 Die and method of making same | 
| 04/03/1985 | EP0136237A1 Integrated circuit package holder | 
| 04/03/1985 | EP0136020A2 Method and apparatus of forming patterns in thick film circuit or the like | 
| 04/03/1985 | EP0135852A2 Drilling arrangement for holes in sheets or piles of sheets | 
| 04/03/1985 | EP0135674A2 Production of metal surface-laminated sheet | 
| 04/03/1985 | EP0135589A1 Method for bonding electrical conductors to an insulating substrate | 
| 04/02/1985 | US4509099 Electronic component with plurality of terminals thereon | 
| 04/02/1985 | US4509096 Chip-carrier substrates | 
| 04/02/1985 | US4509095 Flexible circuit board interconnect having low thermal conductivity | 
| 04/02/1985 | US4508990 Thin-film EL panel mounting unit | 
| 04/02/1985 | US4508802 Multiple registration and imaging process to form a set of registered imaged elements |