Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1985
05/14/1985US4516824 Lamp socket assembly for mounting on printed circuit board
05/14/1985US4516816 In circuit modification device for dual in line packaged components
05/14/1985US4516495 Method and arrangement for positioning a second pattern originating from a pattern formed on a stencil in relation to a material intended for the pattern
05/14/1985CA1187201A1 Inspection of multilayer ceramic circuit modules by electrical inspection of unfired green sheets
05/09/1985WO1985001963A1 Plant for tinning printed circuit boards
05/09/1985WO1985001913A1 Process and plant for compressing flexible sheets and keyboard fabricated according to this process
05/08/1985EP0140746A2 Method for the heat treatment of electrical conducting coatings on dielectric substrates by microwaves
05/08/1985EP0140619A2 Anisotropic-electroconductive adhesive film and circuit connecting method using the same
05/08/1985EP0140585A1 A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself
05/08/1985EP0140473A1 Solderless circuit board conductor and connector assemblies employing same
05/08/1985EP0140350A2 Liquid crystal panel display device
05/08/1985EP0140304A2 Conductive patterns in polymeric films
05/08/1985EP0140259A2 Transverse gradient field coil
05/08/1985EP0140112A2 Process and device for severing conductive paths
05/08/1985EP0139846A2 Workpiece clamp assembly for plating machine
05/08/1985EP0139662A1 Improved socket terminal positioning method and construction.
05/07/1985US4516188 Logic card
05/07/1985US4516103 Plug-in arrangement and process for tin plating contacts of a plug-in arrangement
05/07/1985US4515878 Film copy of glass master
05/07/1985US4515829 Through-hole plating
05/07/1985US4515671 Electrochemical treatment of copper for improving its bond strength
05/07/1985US4515505 Pressure foot assembly for an end mill delete cutter
05/07/1985US4515304 Mounting of electronic components on printed circuit boards
05/07/1985US4515297 Methods for multipoint dispensing of viscous material
05/07/1985CA1186758A1 Compliant termination for ceramic chip capacitors
05/07/1985CA1186569A1 Conductive coatings for electret devices
05/02/1985EP0139528A2 Lead member and method for fixing thereof
05/02/1985EP0139519A2 Drying apparatus
05/02/1985EP0139431A2 Method of mounting a carrier for a microelectronic silicon chip
05/02/1985EP0139233A1 Method for conditioning a surface of a dielectric substrate for electroless plating
05/02/1985EP0139205A2 Method of producing semiconductor components having a metal substrate
05/02/1985EP0139090A1 Process for the pre-treatment of polyimides
05/02/1985EP0139030A1 Improved printed circuit board
05/02/1985EP0138863A1 Assembling components on a printed circuit board.
05/02/1985EP0138830A1 Marking plate device
04/1985
04/30/1985US4514786 Integrated-circuit support device employed in a system for selecting high-reliability integrated circuits
04/30/1985US4514321 Thick film conductor compositions
04/30/1985US4514042 Thin structure of display panel
04/30/1985US4513543 Treatment of coated glass
04/24/1985EP0138673A2 Method of making a printed circuit board
04/24/1985EP0138672A2 Method of making a printed circuit board
04/24/1985EP0138671A2 Method of making a printed circuit board
04/24/1985EP0138531A1 Process for cleaning copper base materials and regenerating the cleaning solution
04/24/1985EP0138368A2 Circuit board thickness compensator
04/24/1985EP0138312A1 Jigs for locating electrical components
04/24/1985EP0138293A2 A device for mounting an electrolytic capacitor of like electrical component
04/24/1985EP0138209A2 Epoxy resin composition
04/24/1985EP0137981A2 Through-hole plating
04/24/1985EP0137927A2 Process for the controlled etching of tapered vias in borosilicate glass dielectrics
04/24/1985EP0137923A1 Electroconductive film system for aircraft windows
04/23/1985US4513266 Microwave ground shield structure
04/23/1985US4513064 Military ordinance applications
04/23/1985US4512861 Electrophoretic coating process
04/23/1985US4512855 Deposition of metals as interlayers within organic polymeric films
04/23/1985US4512854 Using masking tape of foil-like carrier adhesive coating, and elecctrical conductor
04/23/1985US4512829 Process for producing printed circuit boards
04/23/1985US4512818 Solution for formation of black oxide
04/23/1985US4512509 Technique for bonding a chip carrier to a metallized substrate
04/23/1985US4512508 Method and apparatus for the machine soldering of workpieces
04/23/1985CA1185824A1 Photoimaging process in which a toned image is transferred to a cover sheet on a photosensitive layer
04/17/1985EP0137694A2 Printed circuit board maximizing areas for component utilization
04/17/1985EP0137569A2 Screen printing device
04/17/1985EP0137449A2 Method for producing thermoplastic resin sheet or filler-containing resin sheet
04/17/1985EP0137349A2 Dual-in-line connector assembly
04/17/1985EP0137279A2 Printed wiring board
04/16/1985US4511757 Circuit board fabrication leading to increased capacity
04/16/1985US4511634 Solderable layer system
04/16/1985US4511597 Quinone reducing agent, non-noble metal salt
04/16/1985US4511595 Laser-activated chemical-depositing method and apparatus
04/16/1985US4511448 Plating apparatus
04/16/1985US4511445 Process of enhancing conductivity of material
04/16/1985US4511076 Method of soldering circuit boards with solder-repellent contacts
04/16/1985US4510685 Method of assembling magnetic pins into printed circuit boards
04/16/1985CA1185687A1 Switching network for megahertz frequency signals
04/11/1985WO1985001634A1 Electronic circuit assembly
04/11/1985EP0120083A4 Apparatus and method for electroless plating.
04/10/1985EP0136575A1 Soldering equipment, especially for the production of supplementary connecting modifications on printing boards
04/10/1985EP0136568A2 Electrical apparatus
04/10/1985EP0136534A2 Method of forming a large surface area integrated circuit
04/10/1985EP0136364A1 Method and apparatus for the selective and self-adjusting deposition of metal layers and application of this method
04/10/1985EP0136332A1 Wire coil assembly for matrix print head and manufacturing method.
04/09/1985US4510446 Test coupons for determining the registration of subsurface layers in a multilayer printed circuit board
04/09/1985US4510347 Formation of narrow conductive paths on a substrate
04/09/1985US4510276 Epoxy resin and curing agent in solvent with flow control agent and thickener
04/09/1985US4510008 Continuous production of copper-clad laminate
04/09/1985US4510000 Method for palladium activating molybdenum metallized features on a ceramic substrate
04/09/1985US4509994 Solder composition for high-density circuits
04/09/1985US4509808 High voltage, gas tight connector
04/09/1985CA1185387A1 Radiation-polymerizable mixture including a compound having terminal unsaturated groups and a compound having two epoxy groups
04/09/1985CA1185151A1 Die and method of making same
04/03/1985EP0136237A1 Integrated circuit package holder
04/03/1985EP0136020A2 Method and apparatus of forming patterns in thick film circuit or the like
04/03/1985EP0135852A2 Drilling arrangement for holes in sheets or piles of sheets
04/03/1985EP0135674A2 Production of metal surface-laminated sheet
04/03/1985EP0135589A1 Method for bonding electrical conductors to an insulating substrate
04/02/1985US4509099 Electronic component with plurality of terminals thereon
04/02/1985US4509096 Chip-carrier substrates
04/02/1985US4509095 Flexible circuit board interconnect having low thermal conductivity
04/02/1985US4508990 Thin-film EL panel mounting unit
04/02/1985US4508802 Multiple registration and imaging process to form a set of registered imaged elements