Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
12/1988
12/28/1988CA1247750A Electrical terminator device
12/28/1988CA1247749A Thermal connector for printed circuit card equipped with electronic components
12/28/1988CA1247466A Process for avoiding blister formation in electroless metallization
12/27/1988US4794489 Portable radio transceiver housing structurally supported by a battery
12/27/1988US4794446 Electrode device and a method for making the same
12/27/1988US4794243 Integrated circuit card with increased number of connecting terminals
12/27/1988US4794048 Ceramic coated metal substrates for electronic applications
12/27/1988US4793946 Gold in binder for high density circuits, good conductivity and wire bonding
12/27/1988US4793543 Solder joint
12/21/1988EP0296112A2 Storage-stable curable compositions
12/21/1988EP0296019A1 Support for a printed circuit forming a heat sink with a controlled dilatation, and manufacturing process
12/21/1988EP0295926A2 Process for producing thermosetting resins
12/21/1988EP0295914A2 An interconnect structure for PC boards and integrated circuits
12/21/1988EP0295848A2 Fabrication of a multilayer conductive pattern on a dielectric substrate
12/21/1988EP0295816A2 Resin-impregnated fabrics laminated to metal foil
12/21/1988EP0295609A2 Printed circuit windings for screened inductance sensors, especially sensors for level measurement
12/21/1988EP0295310A1 Terminals for connecting electronic components
12/21/1988CN88103416A Metal foil covered laminate
12/21/1988CN88100740A Processor apparatus with improved control of electromagnetic radiation
12/20/1988US4792879 Mounting structure for electric and electronic circuit elements
12/20/1988US4792790 Identification device in the form of a tag-like strip affixable to an article and method for its manufacture
12/20/1988US4792779 Trimming passive components buried in multilayer structures
12/20/1988US4792646 Ceramic wiring board and its production
12/20/1988US4792479 With unsaturated fatty acid, phenolic resin and catalyst
12/20/1988US4792476 Aromatic polyimides
12/20/1988US4792310 Connector having filtering function
12/20/1988US4791722 Method of designing and manufacturing circuits using universal circuit board
12/20/1988CA1247223A1 Mounting system for devices used in electrical communication engineering
12/14/1988EP0295007A2 Film carrier, method for manufacturing a semiconductor device utilizing the same and an associated tester
12/14/1988EP0294943A2 Electrical connector for circuit boards
12/14/1988EP0294833A2 Contact photoelectric conversion device
12/14/1988EP0294773A2 Polyarylene ether sulfone blends
12/14/1988EP0294478A1 Improved grinding guide and method.
12/14/1988CN88200598U Connector plug fixed on low and small type mini-computer
12/14/1988CN87215241U Computer connector
12/13/1988US4791527 Portable radio transceiver housing structurally supported by battery
12/13/1988US4791524 Electrostatic discharge protection for electronic packages
12/13/1988US4791362 Modularized solid state register
12/13/1988US4791248 Conductive cores; apertures with dielectric collars of cured, filled void-free resin; heat resistant
12/13/1988US4791239 Multilayer printed wiring board and method for producing the same
12/13/1988US4791238 High-density wired circuit board using insulated wires
12/13/1988US4791006 High accuracy variable thickness laydown method for electronic components
12/13/1988US4790968 Process for producing pressure-sensitive electroconductive sheet
12/13/1988US4790894 Semicircular solder filled apertures at walls for electrical connections
12/13/1988US4790760 Power distribution adapter
12/13/1988US4790438 Electrical component sequential testing apparatus
12/13/1988CA1246767A1 Solderable conductive compositions having high adhesive strength
12/13/1988CA1246755A1 Semiconductor device
12/13/1988CA1246705A1 Contact terminal device
12/08/1988DE3817600A1 Semiconductor device
12/08/1988DE3718267A1 Electrical composite material
12/08/1988DE3716593A1 Display unit
12/07/1988EP0294232A2 An epoxy resin multi-layer laminate
12/07/1988EP0293838A2 IC package for high-speed semiconductor integrated circuit device
12/07/1988EP0293544A1 Epoxy resin formulation having an extremely short curing time
12/07/1988EP0176555B1 Multilayer hybrid integrated circuit
12/07/1988EP0164392B1 Printed circuit board
12/07/1988CN88101836A Flocced 2:1 layered silicates and water-resistant articles made therefrom
12/06/1988US4789770 Controlled depth laser drilling system
12/06/1988US4789438 Random polishing of plating surface; printed circuit
12/06/1988US4789411 Conductive copper paste composition
12/06/1988US4788846 Process for the correction of curls of flexible metal clad laminate and for the improvement of its dimensional stability
12/06/1988US4788767 Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
12/06/1988CA1246294A1 Thermosetting epoxy resin composition and thermosets therefrom
12/06/1988CA1246170A1 Integrated circuit device having strip line structure therein
12/01/1988WO1988009598A1 Application of the ink jet process for manufacturing hybrid and printed electronic circuits
12/01/1988WO1988009575A1 Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
12/01/1988WO1988009573A1 Improvements in or relating to microcomputers
12/01/1988DE3716122A1 Method of incorporating whiskers in a metallic matrix
11/1988
11/30/1988EP0293112A2 Resin composition and electrical laminate obtained therefrom
11/30/1988EP0293108A2 Biaxially-stretched film made of poly(arylene sulfide)-based resin composition and production process thereof
11/30/1988EP0292827A1 Method of making tags with respectively a circuit forming a resonant circuit
11/29/1988US4788404 Self-soldering flexible circuit connector
11/29/1988US4788165 Copper-exuding, boroaluminosilicate glasses
11/29/1988US4788163 Devitrifying glass frits
11/29/1988US4788046 Method for producing materials for co-sintering
11/29/1988US4787853 Printed circuit board with through-hole connection
11/24/1988EP0277118A4 Removable commoning bar.
11/24/1988DE3816443A1 Formbare duroplast-zusammensetzung A moldable thermoset-composition
11/24/1988DE3714783A1 Printing ink and use thereof
11/23/1988EP0291620A2 Solderless, pushdown connectors for rf and dc
11/22/1988US4786700 Prepared from styrene terminated tetrakisphenols, circuit boards
11/22/1988US4786674 Diffusion isolation layer for maskless cladding process
11/22/1988US4786569 Adhesively bonded photostructurable polyimide film
11/22/1988US4786528 Humidity, dimensional stability
11/22/1988US4786523 Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
11/17/1988WO1988009068A1 Solder connector device
11/17/1988WO1988009058A1 Electrical switching and control apparatus
11/17/1988EP0291400A1 Power module for motor vehicle fittings
11/17/1988EP0291218A2 Stable solutions of prepolymers of thiodi(phenylcyanate)
11/17/1988EP0291064A2 Conductive paste composition
11/17/1988EP0290617A1 Control unit
11/17/1988EP0290598A1 Ceramic/organic multilayer interconnection board.
11/17/1988EP0290579A1 Alumina materials for low temperature co-sintering with refractory metallization ii
11/17/1988EP0290578A1 Tungsten paste for co-sintering with pure alumina and method for producing same.
11/17/1988EP0290577A1 An improved photo-selective plating method
11/17/1988EP0290539A1 Process for the chemical treatment of ceramic parts and subsequent metallization.
11/16/1988EP0276291A4 A method of treating glass surfaces with coupling agents and resins to provide an improved surface for bonding a final resin.
11/15/1988US4785141 In a printed circuit board
11/15/1988US4785135 De-coupled printed circuits
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