Patents for H05K 1 - Printed circuits (98,583)
06/1988
06/01/1988EP0186667B1 Mounting semi-conductor chips
06/01/1988DE3640760A1 Arrangement having electrical conductor tracks, and a method for producing the arrangement
06/01/1988DE3640072A1 Electronic data storage unit with a number of static RAM chips
06/01/1988CN87105669A Strippable common strip
05/1988
05/31/1988US4748537 Decoupling capacitor and method of formation thereof
05/31/1988US4748293 Flexible cable and method of manufacturing thereof
05/31/1988US4748169 Polyarylene sulfide resin composition
05/31/1988US4748136 Ceramic-glass-metal composite
05/31/1988US4748086 Formation of copper electrode on ceramic oxide
05/31/1988US4748085 Multilayer ceramic circuit board fired at a low temperature
05/31/1988US4748068 Synthetic resin unit
05/31/1988US4747897 Dielectric materials
05/31/1988US4747211 Subjecting the bore in substrate to force of vacuum applied through a vacuum diffusion barrier
05/31/1988CA1237535A1 Process for producing multilayer ceramic circuit board with copper
05/31/1988CA1237533A1 Deformable integrated circuit chip carrier
05/26/1988DE3639642A1 Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung Method for the chemical treatment of keramikkoerpern with subsequent metallization
05/26/1988DE3639604A1 Method for producing solder-reinforced conductor tracks
05/26/1988DE3639443A1 Printed circuit board and method for its production
05/25/1988EP0268497A2 Printed circuit board
05/25/1988EP0268412A1 Flexible jumper with anisotropically conductive adhesive
05/25/1988EP0268260A1 Flexible film chip carrier with decoupling capacitors
05/25/1988EP0268024A1 Voltage surge arrester device for telecommunication conductors
05/25/1988CN85107549B Diffusion isolation layer for maskless cladding process
05/24/1988US4746720 Solvent resistance
05/24/1988US4746536 Polyarylene sulfide printed circuits
05/24/1988US4746375 Carbiding
05/24/1988US4746198 Device for an electrically conductive connection between a liquid crystal cell and circuit board
05/24/1988US4745682 Method of connecting coil
05/19/1988WO1988003745A1 Control unit
05/19/1988WO1988003443A1 Process for preparing multilayer printed circuit boards
05/19/1988DE3738249A1 Electrical switching element for drives
05/18/1988EP0267862A1 Compensating element for thermal or mechanical strain, especially for a printed circuit, and process for making such an element for use in a printed circuit
05/18/1988EP0267602A2 Method for producing high density multilayered glass-ceramic structures with metallic based conductors
05/18/1988EP0267392A1 The chemical synthesis of conducting polypyrrole
05/18/1988EP0142518B1 Microporous metal-plated polytetrafluoroethylene articles and method of manufacture
05/18/1988CN87106576A Laser scribing system and method
05/17/1988US4745457 Electronic substrate article and method of preparation
05/17/1988US4745381 Microwave connector assembly capable of being readily connected to microwave circuit components
05/17/1988US4745215 Dielectrics, printed circuits
05/17/1988CA1236926A1 Method and structure for effecting engineering changes in a multiple device module package
05/11/1988EP0266877A2 Metallized substrates and process for their production
05/11/1988EP0266775A2 Laminates
05/11/1988EP0266412A1 Surface mountable diode.
05/11/1988DE3637190A1 Device and method for mounting components on electronic circuit boards
05/10/1988US4743868 High frequency filter for electric instruments
05/10/1988US4743710 Coaxial interconnection boards
05/10/1988US4743645 Composition for making circuit board substrates and electrical connectors
05/10/1988US4743489 For mounting plurality of electronic circuit elements
05/10/1988US4742615 Routing method and apparatus for cutting printed circuit boards
05/10/1988EP0252977A4 Ultra high density pad array chip carrier.
05/05/1988WO1988003356A2 Method and apparatus for producing a stamped substrate
05/05/1988WO1988003087A1 Ceramic-glass-metal composite
05/04/1988EP0266029A1 Glass-ceramics suitable for dielectric substrates
05/04/1988EP0265631A1 Use of tapered head pin design to improve the stress distribution in the braze joint
05/04/1988EP0265629A2 Printed circuit card fabrication process with nickel overplate
05/04/1988EP0265507A1 Flat multi-conductor power cable with two insulating layers
05/03/1988US4742494 Device for reading a two-dimensional charge image
05/03/1988US4742431 Flexible circuit board
05/03/1988US4742385 Multichip package having outer and inner power supply means
05/03/1988US4742325 Thin-film circuit and method of making the same
05/03/1988US4742267 Polyimide film with conductive tracks
05/03/1988US4742183 Methods and techniques for fabricating foldable printed circuit boards
05/03/1988US4742153 Process for preparing polyimides
05/03/1988US4741939 Hydrolysis of amic acid groups
05/03/1988US4741472 Method of soldering an integrated circuit and printed circuit board
05/03/1988US4741101 Contact device
05/03/1988CA1236221A1 Method of manufacturing printed circuit boards
04/1988
04/27/1988EP0265367A1 Variable width ic bond pad arrangement
04/27/1988EP0265348A2 Connector for an IC card
04/27/1988EP0265340A2 Multilayer ceramic copper circuit board
04/27/1988EP0265231A2 A metallizing paste and a process for metallizing ceramic articles by using such a metallizing paste
04/27/1988EP0265212A1 Electroconductive particles and electroconductive adhesive containing said particles
04/27/1988EP0265077A2 An anisotropic adhesive for bonding electrical components
04/27/1988EP0264836A1 Polyimides and method for making
04/27/1988EP0264780A2 Hybrid integrated circuit device capable of being inserted into socket
04/27/1988EP0264569A1 Method for reducing edge curl on green sheets
04/27/1988EP0264454A1 Method for correcting curl and improving dimensional stability of flexible metal foil laminated plate
04/26/1988US4740762 Thin film integrated microcircuit
04/26/1988US4740532 Unsaturated thiolene prepolymer, crosslinking diluent monomer, plasticizer
04/26/1988US4740414 Ceramic/organic multilayer interconnection board
04/26/1988US4740165 Electronic assembly including integrated circuit package and liquid crystal display panel
04/26/1988US4740162 Lamp socket assembly
04/26/1988CA1235835A1 Composition useful for making circuit board substrates and/or electrical connectors
04/26/1988CA1235711A1 Method for producing multilayer ceramic circuit board
04/21/1988WO1988002978A1 Multi-layer printed circuit board and a method of fabricating the same
04/21/1988WO1988002928A1 Via filling of green ceramic tape
04/21/1988WO1988002761A1 Functional film and process for its production
04/21/1988DE3723968A1 Elektrische abschirmung Electrical shielding
04/21/1988DE3635558A1 Substrate with thin-film circuit
04/21/1988DE3634214A1 Drive motor for an apparatus
04/20/1988EP0264134A2 Zirconium as an adhesion material in a multi-layer wiring substrate
04/20/1988EP0264121A2 Aluminum enamel board
04/20/1988EP0264088A2 Controlled atmosphere firing process
04/20/1988EP0263954A1 Method for manufacture of quick acting fuses
04/20/1988EP0263895A1 Surface treatment composition for glass fibers, method of coating glass fibers with said composition, and method of preparing glass fiber reinforced polyepoxide products
04/19/1988US4739453 Shielding apparatus for a printed circuit board
04/19/1988US4739448 Microwave multiport multilayered integrated circuit chip carrier
04/19/1988US4739139 Miniature switch for mounting on printed circuit boards
04/19/1988US4739125 Electric component part having lead terminals
04/19/1988US4738900 Heat resistant dielectric layer of a polymer of an aromatic dimaleimide and an aromatic dicyanamide