Patents for H05K 1 - Printed circuits (98,583) |
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11/19/1987 | EP0245770A2 Multilayer ceramic substrate with circuit patterns and his method for making |
11/19/1987 | EP0245747A2 Control device for a plurality of parallel-connected power field effect transistors |
11/19/1987 | EP0245713A1 Solder pads for use on printed circuit boards |
11/19/1987 | EP0245697A2 Multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate |
11/19/1987 | EP0245491A1 Substrate for direct mounting of integrated circuit modules |
11/18/1987 | CN87102667A Connection constitution of flat cable |
11/17/1987 | US4707765 Printed wiring board mounted control instrument |
11/17/1987 | US4707671 Electrical transmission line |
11/17/1987 | US4707565 Epoxy impregnated glass fibers |
11/17/1987 | US4707316 Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer |
11/12/1987 | DE3713833A1 Hybridschaltung Hybrid circuit |
11/11/1987 | EP0245166A1 Ribbon type electrical connector cable with controlled thermal and electric resistances |
11/11/1987 | EP0244699A2 Substrate for a printed circuit board |
11/11/1987 | EP0244696A2 Method of fabricating a multilayered ceramic substrate having solid non-porous metal conductors |
11/10/1987 | US4706167 Printed circuits, high density |
11/10/1987 | US4706165 Multilayer circuit board |
11/10/1987 | US4706164 Printed circuit card with heat exchanger and method for making such a card |
11/10/1987 | US4706162 Multilayer capacitor elements |
11/10/1987 | US4706097 Near-linear spring connect structure for flexible interconnect circuits |
11/10/1987 | US4705720 For printed circuits |
11/10/1987 | US4705647 Copper-type conductive coating composition |
11/10/1987 | US4705606 Thin-film electrical connections for integrated circuits |
11/10/1987 | CA1229179A1 High density multi-layer printed circuit arrangement |
11/10/1987 | CA1229178A1 Low profile stacking connector for printed circuit boards |
11/05/1987 | WO1987006771A1 A contact means |
11/05/1987 | WO1987006767A1 Surface mountable diode |
11/05/1987 | WO1987006766A1 Multiple integrated circuit interconnection arrangement |
11/05/1987 | WO1987006760A1 Flat multi-conductor power cable with two insulating layers |
11/05/1987 | WO1987006091A3 Stacked circuit cards and guided vehicle configurations |
11/05/1987 | DE3614689A1 Arrangement of electrical assemblies of different formats |
11/05/1987 | DE3614602A1 Use of high-temperature-resistant copolycondensates for the production of circuit boards and electrical connections |
11/04/1987 | EP0244259A1 Method of detecting the presence or absence of defect of transparent circuit board having fine transparent electric conductive circuit |
11/04/1987 | EP0244040A2 Method to separate non-crystalline objects, in particular thick-film substrates |
11/04/1987 | EP0243833A2 High-temperature-resistant moulding composition based on a cocondensate |
11/04/1987 | EP0243831A2 High-temperature-resistant moulding composition |
11/04/1987 | EP0243709A1 A Method of forming a substrate for printed circuitry |
11/04/1987 | EP0243626A2 Method of making multilayered ceramic structures having an internal distribution of copper-based conductors |
11/04/1987 | EP0243507A1 Flexible laminate for printed circuit board and process for its production |
11/04/1987 | EP0243486A1 Programmable integrated crosspoint switch |
11/03/1987 | US4704505 Electrical apparatus configured for predetermined encoding |
11/03/1987 | US4704449 Poly(iminomethylene) copolymer from isocyanides |
11/03/1987 | US4704320 Semiconductors, gap between ceramic base and conductor layer relieves stress |
11/03/1987 | US4704318 Print circuit board |
11/03/1987 | US4703984 Flexible access connector with miniature slotted pads |
11/03/1987 | CA1228933A1 High density multi-layer circuit arrangement |
11/03/1987 | CA1228932A1 Injection molded multi-layer circuit board and method of making same |
11/03/1987 | CA1228920A1 Key card apparatus |
10/29/1987 | DE3705828A1 Device for connecting an integrated circuit, whose connection is incompatible, to a printed circuit board |
10/29/1987 | DE3614366A1 Arrangement for avoiding undesired solder links on printed circuits |
10/28/1987 | EP0242369A1 Surface mountable integrated circuit packages having solder bearing leads. |
10/27/1987 | US4703395 Breadboard panel construction for electronic circuitry |
10/27/1987 | US4703393 Mounting structure of flat-lead package-type electronic component |
10/27/1987 | US4703392 Microstrip line and method for fabrication |
10/27/1987 | US4702953 Laminates of polyhydantoins |
10/27/1987 | CA1228475A1 Thick film conductor compositions |
10/27/1987 | CA1228474A1 Resistor compositions |
10/21/1987 | EP0242226A2 Glass-ceramic materials with low firing temperature |
10/21/1987 | EP0242020A2 Electrical circuits |
10/21/1987 | EP0241905A2 Circuit board for on-line insertion in computer system |
10/21/1987 | CN87101985A Bonding of microelectronic circuits |
10/20/1987 | US4701830 Electronic circuit module |
10/20/1987 | US4701723 Connection construction for electronic component |
10/20/1987 | US4701362 Porous ptfe for electronic devices |
10/20/1987 | US4701352 Adhesion promoting with alkali metal compounds |
10/20/1987 | US4700880 Process for manufacturing electrical equipment utilizing printed circuit boards |
10/20/1987 | US4700473 Method of making an ultra high density pad array chip carrier |
10/20/1987 | CA1228443A1 Unsaturated polyester resin composition and laminates |
10/15/1987 | DE3711238A1 Printed circuit board |
10/15/1987 | DE3620781A1 Printed circuit board with a plug device |
10/15/1987 | DE3619530A1 Data carrier, particularly in label or card form |
10/15/1987 | DE3611990A1 Process for the preparation of synthetic resin moulding compositions having a high degree of filling |
10/14/1987 | EP0241133A2 Polymaleimide compound and a composition containing the same |
10/14/1987 | EP0240919A2 Method for coating fibers |
10/14/1987 | EP0240746A2 Metal layers for use in electronic circuit interconnection system |
10/14/1987 | EP0240710A2 Near-linear spring connect structure for flexible interconnect circuits |
10/14/1987 | EP0240654A1 Copper conductor compositions |
10/13/1987 | US4700276 Ultra high density pad array chip carrier |
10/13/1987 | US4700274 Ring-connected circuit module assembly |
10/13/1987 | US4700214 Electrical circuitry |
10/13/1987 | US4700044 Laser soldering apparatus and method |
10/13/1987 | US4700016 Printed circuit board with vias at fixed and selectable locations |
10/13/1987 | US4699841 Printed circuits |
10/13/1987 | US4699827 Electric device provided with a silk-screening dielectric coated conductive laminate |
10/13/1987 | US4699803 Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers |
10/08/1987 | WO1987006091A2 Stacked circuit cards and guided vehicle configurations |
10/08/1987 | WO1987005859A1 Method for correcting curl and improving dimensional stability of flexible metal foil laminated plate |
10/08/1987 | EP0229159A4 Method for producing enhanced bonds between surfaces and articles produced by the method. |
10/08/1987 | DE3709868A1 Glasfasern mit niedriger dielektrizitaetskonstante Glass fibers with a low dielectric constant |
10/08/1987 | DE3610886A1 Fuse having a fuse body which is constructed as a printed circuit board |
10/07/1987 | EP0240453A1 Programmable junction box |
10/07/1987 | EP0239901A2 Conductive copper paste composition |
10/07/1987 | EP0239839A1 Electrophoretic insulation of metal circuit board core |
10/07/1987 | EP0239784A2 Curable compositions containing a polyepoxide and a halogenated bisphenol |
10/06/1987 | US4698267 High density para-aramid papers |
10/06/1987 | US4698192 Applying ceramic slurry to endless belt, drying, printing conductive paste, repeating |
10/06/1987 | US4697923 Method for visual inspection of multilayer printed circuit boards |
10/06/1987 | US4697885 Layers of low and high conductive material and resin; wet or dry transfer mounting |
10/06/1987 | US4697858 Active bus backplane |
10/06/1987 | US4697335 Applying film pattern to backing, dissolving and transferring |
10/06/1987 | EP0227746A4 Process for conditioning the surface of plastic substrates prior to metal plating. |