Patents for H05K 1 - Printed circuits (98,583)
11/1987
11/19/1987EP0245770A2 Multilayer ceramic substrate with circuit patterns and his method for making
11/19/1987EP0245747A2 Control device for a plurality of parallel-connected power field effect transistors
11/19/1987EP0245713A1 Solder pads for use on printed circuit boards
11/19/1987EP0245697A2 Multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate
11/19/1987EP0245491A1 Substrate for direct mounting of integrated circuit modules
11/18/1987CN87102667A Connection constitution of flat cable
11/17/1987US4707765 Printed wiring board mounted control instrument
11/17/1987US4707671 Electrical transmission line
11/17/1987US4707565 Epoxy impregnated glass fibers
11/17/1987US4707316 Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer
11/12/1987DE3713833A1 Hybridschaltung Hybrid circuit
11/11/1987EP0245166A1 Ribbon type electrical connector cable with controlled thermal and electric resistances
11/11/1987EP0244699A2 Substrate for a printed circuit board
11/11/1987EP0244696A2 Method of fabricating a multilayered ceramic substrate having solid non-porous metal conductors
11/10/1987US4706167 Printed circuits, high density
11/10/1987US4706165 Multilayer circuit board
11/10/1987US4706164 Printed circuit card with heat exchanger and method for making such a card
11/10/1987US4706162 Multilayer capacitor elements
11/10/1987US4706097 Near-linear spring connect structure for flexible interconnect circuits
11/10/1987US4705720 For printed circuits
11/10/1987US4705647 Copper-type conductive coating composition
11/10/1987US4705606 Thin-film electrical connections for integrated circuits
11/10/1987CA1229179A1 High density multi-layer printed circuit arrangement
11/10/1987CA1229178A1 Low profile stacking connector for printed circuit boards
11/05/1987WO1987006771A1 A contact means
11/05/1987WO1987006767A1 Surface mountable diode
11/05/1987WO1987006766A1 Multiple integrated circuit interconnection arrangement
11/05/1987WO1987006760A1 Flat multi-conductor power cable with two insulating layers
11/05/1987WO1987006091A3 Stacked circuit cards and guided vehicle configurations
11/05/1987DE3614689A1 Arrangement of electrical assemblies of different formats
11/05/1987DE3614602A1 Use of high-temperature-resistant copolycondensates for the production of circuit boards and electrical connections
11/04/1987EP0244259A1 Method of detecting the presence or absence of defect of transparent circuit board having fine transparent electric conductive circuit
11/04/1987EP0244040A2 Method to separate non-crystalline objects, in particular thick-film substrates
11/04/1987EP0243833A2 High-temperature-resistant moulding composition based on a cocondensate
11/04/1987EP0243831A2 High-temperature-resistant moulding composition
11/04/1987EP0243709A1 A Method of forming a substrate for printed circuitry
11/04/1987EP0243626A2 Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
11/04/1987EP0243507A1 Flexible laminate for printed circuit board and process for its production
11/04/1987EP0243486A1 Programmable integrated crosspoint switch
11/03/1987US4704505 Electrical apparatus configured for predetermined encoding
11/03/1987US4704449 Poly(iminomethylene) copolymer from isocyanides
11/03/1987US4704320 Semiconductors, gap between ceramic base and conductor layer relieves stress
11/03/1987US4704318 Print circuit board
11/03/1987US4703984 Flexible access connector with miniature slotted pads
11/03/1987CA1228933A1 High density multi-layer circuit arrangement
11/03/1987CA1228932A1 Injection molded multi-layer circuit board and method of making same
11/03/1987CA1228920A1 Key card apparatus
10/1987
10/29/1987DE3705828A1 Device for connecting an integrated circuit, whose connection is incompatible, to a printed circuit board
10/29/1987DE3614366A1 Arrangement for avoiding undesired solder links on printed circuits
10/28/1987EP0242369A1 Surface mountable integrated circuit packages having solder bearing leads.
10/27/1987US4703395 Breadboard panel construction for electronic circuitry
10/27/1987US4703393 Mounting structure of flat-lead package-type electronic component
10/27/1987US4703392 Microstrip line and method for fabrication
10/27/1987US4702953 Laminates of polyhydantoins
10/27/1987CA1228475A1 Thick film conductor compositions
10/27/1987CA1228474A1 Resistor compositions
10/21/1987EP0242226A2 Glass-ceramic materials with low firing temperature
10/21/1987EP0242020A2 Electrical circuits
10/21/1987EP0241905A2 Circuit board for on-line insertion in computer system
10/21/1987CN87101985A Bonding of microelectronic circuits
10/20/1987US4701830 Electronic circuit module
10/20/1987US4701723 Connection construction for electronic component
10/20/1987US4701362 Porous ptfe for electronic devices
10/20/1987US4701352 Adhesion promoting with alkali metal compounds
10/20/1987US4700880 Process for manufacturing electrical equipment utilizing printed circuit boards
10/20/1987US4700473 Method of making an ultra high density pad array chip carrier
10/20/1987CA1228443A1 Unsaturated polyester resin composition and laminates
10/15/1987DE3711238A1 Printed circuit board
10/15/1987DE3620781A1 Printed circuit board with a plug device
10/15/1987DE3619530A1 Data carrier, particularly in label or card form
10/15/1987DE3611990A1 Process for the preparation of synthetic resin moulding compositions having a high degree of filling
10/14/1987EP0241133A2 Polymaleimide compound and a composition containing the same
10/14/1987EP0240919A2 Method for coating fibers
10/14/1987EP0240746A2 Metal layers for use in electronic circuit interconnection system
10/14/1987EP0240710A2 Near-linear spring connect structure for flexible interconnect circuits
10/14/1987EP0240654A1 Copper conductor compositions
10/13/1987US4700276 Ultra high density pad array chip carrier
10/13/1987US4700274 Ring-connected circuit module assembly
10/13/1987US4700214 Electrical circuitry
10/13/1987US4700044 Laser soldering apparatus and method
10/13/1987US4700016 Printed circuit board with vias at fixed and selectable locations
10/13/1987US4699841 Printed circuits
10/13/1987US4699827 Electric device provided with a silk-screening dielectric coated conductive laminate
10/13/1987US4699803 Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers
10/08/1987WO1987006091A2 Stacked circuit cards and guided vehicle configurations
10/08/1987WO1987005859A1 Method for correcting curl and improving dimensional stability of flexible metal foil laminated plate
10/08/1987EP0229159A4 Method for producing enhanced bonds between surfaces and articles produced by the method.
10/08/1987DE3709868A1 Glasfasern mit niedriger dielektrizitaetskonstante Glass fibers with a low dielectric constant
10/08/1987DE3610886A1 Fuse having a fuse body which is constructed as a printed circuit board
10/07/1987EP0240453A1 Programmable junction box
10/07/1987EP0239901A2 Conductive copper paste composition
10/07/1987EP0239839A1 Electrophoretic insulation of metal circuit board core
10/07/1987EP0239784A2 Curable compositions containing a polyepoxide and a halogenated bisphenol
10/06/1987US4698267 High density para-aramid papers
10/06/1987US4698192 Applying ceramic slurry to endless belt, drying, printing conductive paste, repeating
10/06/1987US4697923 Method for visual inspection of multilayer printed circuit boards
10/06/1987US4697885 Layers of low and high conductive material and resin; wet or dry transfer mounting
10/06/1987US4697858 Active bus backplane
10/06/1987US4697335 Applying film pattern to backing, dissolving and transferring
10/06/1987EP0227746A4 Process for conditioning the surface of plastic substrates prior to metal plating.