| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/30/1989 | CA1254789A1 Multilayer hybrid integrated circuit |
| 05/24/1989 | EP0317469A2 Electrostatic discharge protection for electronics packages |
| 05/24/1989 | EP0317256A2 A printed circuit substrate |
| 05/24/1989 | EP0317081A2 Printed circuit card reset switch |
| 05/24/1989 | EP0317011A2 Multi-level circuits, methods for their fabrication, and display devices incorporating such circuits |
| 05/24/1989 | EP0316886A2 Printed circuit board manufacturing method |
| 05/24/1989 | EP0316775A1 Bismaleinimides and polyimides produced thereof |
| 05/24/1989 | EP0316534A1 Circuit element |
| 05/24/1989 | EP0316509A2 Curable composition containing a difunctional epoxy resin, a polyfunctional resin, a difunctional phenol and a polyfunctional phenol |
| 05/24/1989 | EP0224483B1 Hybrid mounting for electronic circuit |
| 05/24/1989 | DE3738051A1 Printed circuit board assembly |
| 05/24/1989 | DE3729532A1 Method for wiring small domestic electrical apparatuses |
| 05/24/1989 | CN1033130A Jackfield with front removable jack modules having lamp assemblies |
| 05/24/1989 | CN1033065A Compositions of thermosetting resin and presoaked material and layered products obtained from them |
| 05/23/1989 | US4833568 Three-dimensional circuit component assembly and method corresponding thereto |
| 05/23/1989 | US4833328 Forming contacts on diamonds |
| 05/23/1989 | US4833204 Epoxy resin composition for a copper-clad laminate |
| 05/23/1989 | US4833104 Glass-ceramic substrates for electronic packaging |
| 05/23/1989 | US4833039 Hermetic feedthrough in ceramic substrate |
| 05/23/1989 | US4833033 Resin coated copper powder for electroconductive paints |
| 05/23/1989 | US4833022 Polymer/copper laminate and method for fabrication thereof |
| 05/23/1989 | US4833005 Laminate of fiber-reinforced, crosslinked polypropylene |
| 05/23/1989 | US4833004 Structure of copper conductor and method of forming same |
| 05/23/1989 | US4832988 Process for chemically metallizing an inorganic substrate |
| 05/23/1989 | US4832621 Probe for in-circuit emulator |
| 05/23/1989 | US4832620 Electrical connector terminal for a flexible printed circuit board |
| 05/23/1989 | US4832455 Liquid crystal apparatus having an anisotropic conductive layer between the lead electrodes of the liquid crystal device and the circuit board |
| 05/23/1989 | US4831723 Direct bond circuit assembly with crimped lead frame |
| 05/18/1989 | WO1989004592A1 Chip carrier sockets having improved contact terminals |
| 05/18/1989 | WO1989004587A1 Computer bus |
| 05/18/1989 | WO1989004332A1 Ladder copolymers |
| 05/18/1989 | DE3738021A1 Computerbus Computer bus |
| 05/17/1989 | EP0315905A2 Electroluminescent device |
| 05/17/1989 | EP0315852A2 Printed circuit board with improved heat conductivity |
| 05/17/1989 | EP0315851A1 Laminate consisting of polymers resistant to high temperatures with metal layers directly applied to them |
| 05/17/1989 | EP0315792A2 Interconnection system for integrated circuit chips |
| 05/17/1989 | CN2037918U Network combined circuit board |
| 05/16/1989 | US4831497 Reduction of cross talk in interconnecting conductors |
| 05/16/1989 | US4831278 Wire harness for automobile |
| 05/16/1989 | US4831230 Surface shaping and finishing apparatus and method |
| 05/16/1989 | US4830988 Dielectric inks for multilayer copper circuits |
| 05/16/1989 | US4830878 Method of manufacturing a substrate coated with multiple thick films |
| 05/16/1989 | US4830554 Routing apparatus for cutting printed circuit boards |
| 05/16/1989 | US4830264 Method of forming solder terminals for a pinless ceramic module |
| 05/16/1989 | CA1254342A1 Polymide prepolymer of addition reacted type, prepreg obtained therefrom, and the method of producing laminate from said prepreg |
| 05/16/1989 | CA1254323A1 Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates |
| 05/11/1989 | DE3836480A1 Anhaenger bzw. etikett und verfahren zu seiner herstellung Trailers or label and process for its manufacture |
| 05/10/1989 | EP0315478A2 High-lubricity film |
| 05/10/1989 | EP0315320A2 Thick-film high frequency signal circuit apparatus with feedthrough capacitor |
| 05/10/1989 | EP0315314A1 Silver-glass paste |
| 05/10/1989 | EP0315211A1 Thermosetting resin composition, and prepreg and laminated sheet which use the same |
| 05/10/1989 | CN1032880A 旋转变压器 Resolver |
| 05/09/1989 | US4829405 Tape automated bonding package |
| 05/09/1989 | US4829404 Method of producing a flexible circuit and master grid therefor |
| 05/09/1989 | US4829401 Rotating transformer with foil windings |
| 05/09/1989 | US4829375 Method for punching in printed circuit board laminates and related apparatus and articles of manufacture |
| 05/09/1989 | US4829029 Low temperature sintering ceramic material composition and process for producing the low temperature sintering ceramic |
| 05/09/1989 | US4828961 Imaging process for forming ceramic electronic circuits |
| 05/09/1989 | US4828877 Forming conductive link in gap left by vaporizable plug |
| 05/09/1989 | US4827611 Compliant S-leads for chip carriers |
| 05/09/1989 | US4827609 Method and apparatus for mounting components on a printed circuit board or similar mounting surface |
| 05/09/1989 | CA1253930A1 Flexible electrical connectors |
| 05/09/1989 | CA1253660A1 Copper conductive composition capable of bonding to ceramic and glass |
| 05/03/1989 | EP0314543A1 Device for electrostatic protection for printed electric circuits |
| 05/03/1989 | EP0313961A2 Glass fiber reinforced fluoropolymeric circuit laminate |
| 05/03/1989 | EP0313860A2 An edge support and power distribution structure |
| 05/02/1989 | US4827377 Multi-layer circuitry |
| 05/02/1989 | US4827328 Hybrid IC device |
| 05/02/1989 | US4827327 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough |
| 05/02/1989 | US4827083 Silver-palladium alloy |
| 05/02/1989 | US4826720 Polyetherimide or polyether ketone polymers |
| 05/02/1989 | US4826445 Card reader holder |
| 05/02/1989 | US4825539 Process for manufacturing a multilayer substrate |
| 05/02/1989 | CA1253628A1 Hybrid and multi-layer circuitry |
| 04/27/1989 | DE3733860A1 Thin-film resistor |
| 04/26/1989 | EP0313239A1 Jackfield with front removable jack modules having lamp assemblies |
| 04/26/1989 | EP0313139A1 Rotating transformer |
| 04/26/1989 | EP0312994A2 Process for producing a molded article of thermoplastic resin |
| 04/26/1989 | EP0312824A2 Ceramic structure with copper based conductors and method for forming such a structure |
| 04/26/1989 | EP0312682A2 Printed circuit board |
| 04/26/1989 | EP0312631A1 Method for manufacturing electrical connection between flat electrical conducting paths and circuit board manufactured with this method |
| 04/26/1989 | EP0312607A1 Power circuit board and manufacturing method |
| 04/25/1989 | US4825395 Apparatus with torsionally stressed conductors routed through a hollow articulated hinge |
| 04/25/1989 | US4825340 Electrical conductor arrangement |
| 04/25/1989 | US4824920 Vinyl-benzyl ethers of phenol-dicyclopentadiene adducts as new thermosetting resins for composites |
| 04/25/1989 | US4824806 Printed circuit reinforcement |
| 04/25/1989 | US4824511 Multilayer circuit board with fluoropolymer interlayers |
| 04/25/1989 | US4824397 Electrical connecting device |
| 04/25/1989 | US4824381 Circuit board containing a metal net |
| 04/25/1989 | CA1253259A1 Board for printed circuits and processes for manufacturing such printed circuit boards |
| 04/25/1989 | CA1253238A1 Printed wiring board means with isolated voltage source means |
| 04/20/1989 | WO1989003634A1 An arrangement for deactivating integrated circuits electrically |
| 04/20/1989 | DE3828873A1 Circuit board with a printed electric circuit and a transparent protective layer and also a process for producing the same |
| 04/20/1989 | DE3734041A1 Multilayer panel |
| 04/19/1989 | EP0312415A1 Circuit board for high currents and process of making the same |
| 04/19/1989 | EP0312268A2 Method of treating surface of molded article comprising liquid crystal polyester resin |
| 04/19/1989 | EP0311989A1 Surface treatment of polyethylene fibers |
| 04/19/1989 | EP0311970A2 Printed circuit board |
| 04/19/1989 | CN1032470A Arrangement for deactivating integrated circuits |
| 04/18/1989 | US4823233 Circuit assembly |