Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
12/1989
12/27/1989EP0347824A2 A thick film forming process
12/27/1989EP0347616A1 Photosensitive aqueous developable ceramic coating composition
12/27/1989EP0347615A1 Photosensitive semi-aqueous developable ceramic coating composition
12/26/1989US4890329 Hearing aid comprising printed circuit board
12/26/1989US4890194 A chip carrier and mounting structure connected to the chip carrier
12/26/1989US4890192 Thin film capacitor
12/26/1989US4890157 Integrated circuit product having a polyimide film interconnection structure
12/26/1989US4889962 Electrically insulative substrate with a groove having a plating of conductive material
12/26/1989US4889961 Graphite trace electrical interconnect
12/26/1989US4889659 Nitrogenized electronic conductive polymers, their preparation processes, electrochromic display cell and electrochemical generator using these polymers
12/26/1989US4889585 Method for selectively forming small diameter holes in polyimide/Kevlar substrates
12/26/1989US4889573 Detaching coating material from carrier foil
12/20/1989EP0347077A1 High density board to board interconnection system
12/20/1989EP0347062A2 Heat-resistant stretched film and production process thereof
12/20/1989EP0346997A2 Apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits
12/20/1989EP0346617A2 Formation of metallic interconnects by grit blasting
12/19/1989US4888665 Customizable circuitry
12/19/1989US4888663 Cooling system for electronic assembly
12/19/1989US4888574 Electrodepositing nickel-phosphorous from a plating bath free of sulfate and chloride salt
12/19/1989US4888450 Circuit board fabrication leading to increased capacity
12/19/1989US4888216 Copper powder for electroconductive paints and process for production thereof
12/19/1989US4888208 Ceramic substrate for printed circuits and production thereof
12/19/1989US4888135 Oxidation resistance, storage stability
12/19/1989EP0268643A4 Electrical circuit interconnection.
12/19/1989CA1263970A1 Connecting block for digital system cross-connect frame
12/14/1989WO1989012310A1 Electric or electronic control keyboard
12/14/1989WO1989012071A1 Amorphous copolymers or perfluoro-2,2-dimethyl-1,3-dioxole
12/13/1989EP0346206A1 Active connector for printed-circuit boards
12/13/1989EP0346127A2 Integrated heatable sensor
12/13/1989EP0346038A1 Ternary metal matrix composite
12/13/1989EP0345809A1 Ceramic laminated circuit substrate, method for making same and use of the substrate
12/13/1989EP0345427A2 Circuit support for electrical components, e.g. circuit foils, boards or the like
12/13/1989EP0345342A1 Low cost, hermetic pin grid array package
12/12/1989US4886942 Strain relief structure for connecting flat flexible cable to a circuit board
12/12/1989US4886874 Block polymer containing phenylenediamine and oxydianiline units
12/12/1989US4886858 Poly(p-hydroxystyrene); printed circuits
12/12/1989US4886705 Polyphenylene sulfide film
12/12/1989US4886700 Compression molding; printed circuits
12/12/1989US4886699 Multilayer; fluoropolymer impregnated glass cloth with glass fibers reinforcement
12/12/1989US4886686 Composite of insulating plastic with heat conductive filler
12/12/1989US4886644 Liquid degaser in an ebullated bed process
12/12/1989US4886578 High heat resistant oil-impregnatable electrical insulating board
12/12/1989CA1263896A1 Wave solder finger shield apparatus
12/07/1989DE3844310A1 Holder for free-standing (exposed) electronic components
12/06/1989EP0344504A2 Article comprising a polyimide and a metal layer and methods of making such articles
12/06/1989EP0344165A1 Thermoset polymers of styrene terminated tetrakis phenols.
12/06/1989CN2049065U Full film plane combined switch
12/05/1989US4885482 Multiple computer interface circuit board
12/05/1989US4885431 Printed circuit board
12/05/1989US4885430 Flexible printed circuit assembly with torsionly rotated conductors
12/05/1989US4885053 Etching ceramic substrate by applying organic alkali or alkaline earth compound; for surface roughness before plating
12/05/1989US4885038 Coating conductor with polymer which decomposes upon heating
12/05/1989US4884754 Milling in presence of surfactant
12/05/1989CA1263786A1 Thermoplastic polycarbonate-polysulfone carbonate molding compositions
12/05/1989CA1263763A1 Printed circuit with chromium adhesion layer
11/1989
11/30/1989DE3817267A1 Leiterplatte Circuit board
11/30/1989DE3816614A1 Method and device for coating printed circuit board assemblies
11/29/1989EP0343836A1 Particulate material useful in an electroconductive body and method of making such particles
11/29/1989EP0343771A1 Transmission line
11/29/1989EP0343722A1 Screen-printed superconductor device
11/29/1989EP0343400A2 Electronic package assembly with flexible carrier and method of making it
11/29/1989EP0343379A2 Thin film package for mixed bonding of a chip
11/29/1989EP0343374A1 Method of cancelling interruptions in conducting paths by means of a congruent element
11/29/1989EP0343299A2 Glass-ceramics suitable for dielectric substrates
11/29/1989EP0209748B1 Process for chemically treating ceramic work pieces for subsequent metallization
11/29/1989CN1037483A Resin laminates and process for production thereof
11/29/1989CN1005958B Integrated backplane
11/28/1989US4884170 Multilayer printed circuit board and method of producing the same
11/28/1989US4884125 Hybrid integrated circuit device capable of being inserted into socket
11/28/1989US4883778 Products formed of a ceramic-glass-metal composite
11/28/1989US4883744 Forming a polymide pattern on a substrate
11/28/1989US4883718 Flexible copper-clad circuit substrate
11/28/1989US4883708 Meta-aramide fibers, polyethylene terephthalate fibers, acrylonitrile-butadiene copolymer
11/28/1989US4883705 Glass powders, aluminum silicates, zinc oxide, refractory fillers
11/28/1989US4883704 Aluminum nitrides, ceramics
11/28/1989US4883702 Glass fibers, potassium titanate fibers
11/28/1989CA1263460A1 Electronic package assembly and accessory component therefor
11/23/1989EP0343030A1 Flexible printed circuit, particularly for electronic microcircuit cards, and card incorporating this circuit
11/23/1989EP0342873A2 Surface mount connector
11/23/1989EP0342842A1 Process for producing imide-based prepolymers and varnish using such prepolymers
11/23/1989EP0342595A2 Sintered body of aluminium nitride
11/23/1989EP0342594A2 An optical semiconductor device
11/23/1989EP0342393A2 Process for forming a polyimide pattern on a substrate
11/21/1989US4882656 Surface mounted decoupling capacitor
11/21/1989US4882650 Capacitors
11/21/1989US4882550 Oscillator/amplifier connecting structure
11/21/1989US4882455 Electronic circuit substrates
11/21/1989US4882454 Thermal interface for a printed wiring board
11/21/1989US4882389 Cured butadiene polymer
11/21/1989US4882370 Fiber reinforced composites with improved glass transition temperatures
11/21/1989US4882237 Aluminum-ceramic complex material
11/21/1989US4882216 Epoxy resin film covered with metal foil and flexible printed wiring board
11/21/1989US4882212 Electronic packaging of components incorporating a ceramic-glass-metal composite
11/21/1989US4882089 Compositions convertible to reinforced conductive components and articles incorporating same
11/21/1989US4882000 Method of manufacturing printed circuit boards
11/21/1989US4881974 Silver-glass paste
11/21/1989US4881906 Method for obtaining electrical interconnect using a solderable mechanical fastener
11/21/1989CA1263196A1 Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method
11/16/1989WO1989011209A1 Circuit writer
11/16/1989WO1989011208A1 Epoxy resin-impregnated prepreg
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