| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/12/1989 | US4866134 Laminate with layer of rubber-modified vinyl ester and unsaturated polyester |
| 09/12/1989 | US4866108 Blend of polyepoxide with polyamine curing agent |
| 09/12/1989 | US4865910 Pretreated with perfluoroalkylsilane to increase adhesion |
| 09/12/1989 | US4865877 Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate |
| 09/12/1989 | US4865875 Micro-electronics devices and methods of manufacturing same |
| 09/12/1989 | US4865795 Process for producing thermosetting resins |
| 09/12/1989 | US4865772 Copper thick film conductor composition |
| 09/12/1989 | US4865686 Eliminating a border portion from the expanded beam; spherical aberration is supressed |
| 09/12/1989 | US4865494 Numerically controlled machine for processing printed circuit boards |
| 09/12/1989 | US4865241 Method and apparatus for subdividing into pieces a ceramic plate |
| 09/12/1989 | US4864722 Low dielectric printed circuit boards |
| 09/12/1989 | CA1259439A1 Flame retarded epoxy resin composition for use in the manufacture of electrical laminates |
| 09/12/1989 | CA1259168A1 Method of assembly of at least two components of ceramic material each having at least one flat surface |
| 09/08/1989 | WO1989008374A1 Substrate for mounting optical parts and electric circuitry parts and method of producing the same |
| 09/08/1989 | WO1989008107A1 Diamines and bismaleinimides, and polyimides prepared therefrom |
| 09/07/1989 | DE3546604C2 A device for a motor vehicle |
| 09/06/1989 | EP0331486A2 Aerials |
| 09/06/1989 | EP0331436A2 Optical communication apparatus |
| 09/06/1989 | EP0331429A2 A laminated printed circuit board and process for its manufacture |
| 09/06/1989 | EP0331161A1 Method for fabricating multilayer circuits |
| 09/06/1989 | EP0331160A2 Functional ceramic shaped article and process for producing the same |
| 09/06/1989 | EP0330848A1 Heat-conductive aluminium nitride sintered body and method of manufacturing the same |
| 09/06/1989 | CN1035409A Apparatus and method for manufacture of printed circuit prototypes |
| 09/06/1989 | CN1035307A Process for improving adhesion to polyacetal articles |
| 09/05/1989 | US4864348 Structure for installing flexible printed circuit board |
| 09/05/1989 | US4864259 Ladder-type electric filter circuit apparatus |
| 09/05/1989 | US4864106 Heating resistor |
| 09/05/1989 | US4863808 Undercutting resistance from gold and tin plating baths |
| 09/05/1989 | US4863757 Printed circuit board |
| 09/05/1989 | US4863683 Oxidation, reduction, sintering |
| 09/05/1989 | US4863517 Via fill ink composition for integrated circuits |
| 09/05/1989 | US4863389 Terminal for connecting electronic components |
| 09/05/1989 | US4862588 Method of making a flexible interconnect |
| 08/31/1989 | DE3805121A1 Strain-relieved, especially tension-relieved and pressure-relieved soldered connection |
| 08/31/1989 | DE3805120A1 Base material for printed circuit boards |
| 08/30/1989 | EP0330210A2 Resistive metal layers and method for making same |
| 08/30/1989 | EP0330020A1 Diamines and bismaleimides, as well as polyimides prepared therefrom |
| 08/30/1989 | EP0329823A2 Die attach pickup tools |
| 08/30/1989 | CN1035102A Method of producing thin film patterns on glass substrate |
| 08/29/1989 | US4862400 Microcomputer bus assembly |
| 08/29/1989 | US4862326 Power supply contact |
| 08/29/1989 | US4862325 Printed wiring board mounted electronic component |
| 08/29/1989 | US4862323 Chip carrier |
| 08/29/1989 | US4862161 Three-stage coupling arrangement |
| 08/29/1989 | US4861964 Laser scribing system and method |
| 08/29/1989 | US4861944 Low cost, hermetic pin grid array package |
| 08/29/1989 | US4861941 Shielding device |
| 08/29/1989 | US4861734 Alkaline earth aluminoborate glass-ceramics |
| 08/29/1989 | US4861646 Co-fired metal-ceramic package |
| 08/29/1989 | US4861641 Substrates with dense metal vias |
| 08/29/1989 | US4861625 Method of manufacturing a thermal printing head having a partially-glazed ceramic substrate |
| 08/29/1989 | US4861515 Polyester composition |
| 08/29/1989 | US4861407 Meting or vaporization to form projections |
| 08/29/1989 | US4861274 Backplane having a movable contact means |
| 08/29/1989 | US4861272 Impedance controlled connector interface |
| 08/29/1989 | US4860939 Method for bonding a copper sheet to a substrate made of an electrically insulating material |
| 08/29/1989 | US4860442 Methods for mounting components on convoluted three-dimensional structures |
| 08/24/1989 | WO1989007834A1 Module for electrically interconnecting integrated circuit chips |
| 08/24/1989 | WO1989007779A1 Method of fastening cylindrical optical parts and electric parts |
| 08/23/1989 | EP0329484A2 Method of manufacturing ceramic laminate |
| 08/23/1989 | EP0329417A2 Process for improving the adhesion to polyacetal articles |
| 08/23/1989 | EP0329414A2 An improved circuit board |
| 08/23/1989 | EP0329406A1 Metal coated laminate products made from textured polymide film |
| 08/23/1989 | EP0329314A1 Uses of uniaxially electrically conductive articles |
| 08/23/1989 | EP0329133A2 Flip substrate for chip mount |
| 08/23/1989 | EP0329018A2 Customizable circuitry |
| 08/23/1989 | EP0187765B1 Process to increase the reliability of the metallization of borings in the production of multilayer printed circuits |
| 08/22/1989 | US4860166 Integrated circuit termination device |
| 08/22/1989 | US4859806 Discretionary interconnect |
| 08/22/1989 | US4859805 Printed wiring board |
| 08/22/1989 | US4859571 Embedded catalyst receptors for metallization of dielectrics |
| 08/22/1989 | US4859520 Monolithic substrate for an electronic power component and process for the production thereof |
| 08/22/1989 | US4859364 Conductive paste composition |
| 08/22/1989 | US4859190 Dual connector printed circuit board assembly and method |
| 08/22/1989 | US4858479 Methods and means for use in examining the quality of plated-through holes in circuit boards |
| 08/22/1989 | CA1258723A1 Photosensitive conductive metal composition |
| 08/16/1989 | EP0328325A1 Laminar polymeric sheet |
| 08/16/1989 | EP0327994A2 Modular programmer device with integrated interconnection to organize and transfer output contacts |
| 08/16/1989 | EP0327892A1 Three-way power splitter using directional couplers |
| 08/16/1989 | EP0327816A2 Non-oxidizable copper thick film conductor |
| 08/15/1989 | US4858077 Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board |
| 08/15/1989 | US4858073 Metal substrated printed circuit |
| 08/15/1989 | US4858072 Interconnection system for integrated circuit chips |
| 08/15/1989 | US4858071 Electronic circuit apparatus |
| 08/15/1989 | US4858064 Thick-film high frequency signal circuit apparatus with feedthrough capacitor |
| 08/15/1989 | US4857387 Compensating element for stresses of thermal or mechanical orgin, especially for printed circuits, and process for making such an element employed in a printed circuit |
| 08/15/1989 | US4857381 Expanded porous polytetrafluoroethylene; for printed circuits |
| 08/15/1989 | US4857233 Nickel particle plating system |
| 08/15/1989 | US4857143 Wet etching of cured polyimide |
| 08/15/1989 | US4857002 Terminator assembly for interconnecting computer devices |
| 08/15/1989 | US4856185 Method for fastening electronic components to a substrate using a film |
| 08/15/1989 | US4856184 Method of fabricating a circuit board |
| 08/10/1989 | WO1989007382A1 Three-dimensional circuit component assembly and method corresponding thereto |
| 08/10/1989 | WO1989007369A1 Three-way power splitter using directional couplers |
| 08/10/1989 | WO1989007339A1 Uses of uniaxially electrically conductive articles |
| 08/10/1989 | WO1989007338A1 Uses of uniaxially electrically conductive articles |
| 08/10/1989 | WO1989007337A1 Laser-machining polymers |
| 08/10/1989 | WO1989007336A1 Laminar polymeric sheet |
| 08/10/1989 | WO1989007319A1 Memory module |
| 08/10/1989 | WO1989005288A3 Complete ether capping of oligomeric polyphenols |