| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/09/1989 | EP0327399A1 Method of manufacturing an uniaxially electrically conductive article |
| 08/09/1989 | EP0327398A1 Laser-machining polymers |
| 08/09/1989 | EP0327106A1 Glass ceramic for coating metal substrate |
| 08/09/1989 | EP0327068A2 Substrate used for fabrication of thick film circuit |
| 08/09/1989 | EP0326918A2 Process for metallising moulded articles of polyarylene sulfide |
| 08/09/1989 | EP0326737A2 Copper powder for electroconductive paints and electroconductive paint compositions |
| 08/09/1989 | EP0326577A1 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products. |
| 08/09/1989 | EP0326571A1 Method and apparatus for producing a stamped substrate. |
| 08/08/1989 | US4856060 Solid state telephone protector module |
| 08/08/1989 | US4855872 Leadless ceramic chip carrier printed wiring board adapter |
| 08/08/1989 | US4855537 Wiring substrate having mesh-shaped earth line |
| 08/08/1989 | US4855450 Process for the preparation of aromatic ether bismaleimides |
| 08/08/1989 | US4855375 Styrene terminated multifunctional oligomeric phenols as new thermosetting resins for composites |
| 08/08/1989 | US4855002 Process of bonding surfaces employing/anaerobic aluminum filled compositions |
| 08/08/1989 | US4854040 Copper solder pads, polymeric ink, overcoating with photoresists |
| 08/08/1989 | US4854038 Modularized fabrication of high performance printed circuit boards |
| 08/03/1989 | DE3908786A1 Method for data transfer between boards of an electronic circuit |
| 08/02/1989 | EP0326499A1 Sintering process of conductors made of copper or copper-based alloys and of their cordierite ceramic substrate |
| 08/02/1989 | EP0326311A1 Fiber reinforced composites with improved glass transition temperatures |
| 08/02/1989 | EP0326077A2 Circuit board |
| 08/02/1989 | EP0325798A1 A metallic powder and a paste made from it, and a metallic powder manufacture device |
| 08/01/1989 | US4853831 Bus connection structure for interruption control system |
| 08/01/1989 | US4853828 Solid state device package mounting apparatus |
| 08/01/1989 | US4853827 High dielectric multilayer capacitor |
| 08/01/1989 | US4853826 Low inductance decoupling capacitor |
| 08/01/1989 | US4853734 Disposition of a flexible printed circuit board in a camera |
| 08/01/1989 | US4853568 Miniature motor |
| 08/01/1989 | US4853514 Beam apparatus and method |
| 08/01/1989 | US4853423 Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| 08/01/1989 | US4853349 Glass-ceramics suitable for dielectric substrates |
| 08/01/1989 | US4853317 Printing masking ink on photoresist; identification |
| 07/27/1989 | DE3903346A1 Arrangement having two parallel-connected transistors |
| 07/27/1989 | DE3801352A1 Printed circuit board |
| 07/26/1989 | EP0325355A1 Inspection of multipattern circuit boards |
| 07/26/1989 | EP0325097A1 Chemical polishing bath and method for aluminum alloys |
| 07/26/1989 | EP0325068A1 Modular hybrid microelectronic structure with high integration density |
| 07/26/1989 | EP0324890A1 Printed wiring board |
| 07/26/1989 | EP0145785B1 Solderable plated plastic components |
| 07/26/1989 | CN2041876U Electrothermal element |
| 07/26/1989 | CN1004910B Electrical interconnection means |
| 07/25/1989 | US4851966 Method and apparatus of printed circuit board assembly with optimal placement of components |
| 07/25/1989 | US4851964 Connecting mechanism for electronic circuit board blanks |
| 07/25/1989 | US4851798 Unitary tuning structure |
| 07/25/1989 | US4851712 Semiconductor circuit for driving a load circuit with power supplied independently |
| 07/25/1989 | US4851615 Printed circuit board |
| 07/25/1989 | US4851614 Non-occluding mounting hole with solder pad for printed circuit boards |
| 07/25/1989 | US4851613 Dielectric substrate with polyaramid layer, conductive layer spaced panels of woven polyaramid insulating layer; good dimensional stability |
| 07/25/1989 | US4851481 Epoxy resin composition |
| 07/25/1989 | US4851320 Method of forming a pattern of conductor runs on a dielectric sheet |
| 07/25/1989 | US4851301 Thick film circuitry |
| 07/25/1989 | US4851021 Multi-ply composites and sheets of epoxy and flocced 2:1 layered silicates and methods for them |
| 07/25/1989 | US4850103 Method for manufacturing an electronic part |
| 07/19/1989 | EP0324599A2 Process for preparing polymeric materials for application to printed circuits |
| 07/19/1989 | EP0324596A2 Method of and apparatus for applying polymeric materials to printed circuits |
| 07/19/1989 | EP0324555A2 Substrate for hybrid IC, hybrid IC using the substrate and its application |
| 07/19/1989 | EP0324352A2 Process for making a metal core circuit board |
| 07/19/1989 | EP0324325A1 Anodic coatings on aluminum for circuit packaging |
| 07/19/1989 | CN1034085A Apparatus and method for tracking and identifying printed circuit assemblies |
| 07/18/1989 | US4849944 Connecting structure for connecting a memory unit to a memory unit controller |
| 07/18/1989 | US4849858 Composite heat transfer means |
| 07/18/1989 | US4849492 Heat resistant films |
| 07/18/1989 | US4849302 Electrolytically metallized article and processes therefore |
| 07/18/1989 | US4849292 Using bonding agent; heating |
| 07/18/1989 | US4849284 Electrical substrate material |
| 07/18/1989 | US4849247 Enhanced adhesion of substrate materials using ion-beam implantation |
| 07/18/1989 | US4847986 Method of making square toroid transformer for hybrid integrated circuit |
| 07/18/1989 | US4847984 Method of assembling a flexible circuit magnetic core winding onto a core member |
| 07/18/1989 | CA1257711A1 Mounting of semiconductor chips on a molded plastic substrate |
| 07/13/1989 | WO1989006201A1 Central circuit arrangement for motor vehicles |
| 07/13/1989 | DE3814224C1 Process for pretreating aluminium nitride ceramic to be metallised |
| 07/13/1989 | DE3744617A1 Contact-making part |
| 07/13/1989 | DE3743841A1 Electrooptic display device |
| 07/12/1989 | EP0323671A1 Moulded printed circuit board |
| 07/12/1989 | EP0323584A2 Processes for preparing laminated plastics |
| 07/12/1989 | EP0323505A1 Cathode surface treatment for electroforming metallic foil or strip. |
| 07/11/1989 | US4847446 Printed circuit boards and method for manufacturing printed circuit boards |
| 07/11/1989 | US4847445 Zirconium thin-film metal conductor systems |
| 07/11/1989 | US4847353 Resins of low thermal expansivity |
| 07/11/1989 | US4847146 Process for fabricating compliant layer board with selectively isolated solder pads |
| 07/11/1989 | US4847139 Flexible circuits |
| 07/11/1989 | US4847138 Thermal writing on glass and glass-ceramic substrates |
| 07/11/1989 | US4847136 Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier |
| 07/11/1989 | US4847003 Silver-palladium films, multilayer, aluminum oxide, silicon oxide |
| 07/11/1989 | US4846929 Wet etching of thermally or chemically cured polyimide |
| 07/11/1989 | US4846922 Method of making deactivatable tags |
| 07/11/1989 | US4846918 Copper etching process and product with controlled nitrous acid reaction |
| 07/11/1989 | CA1257448A1 Poly(amide-amide acids), polyamide acids, poly- (esteramide acids), poly(amide-imides), polyimides, poly(esterimides) |
| 07/11/1989 | CA1257433A1 Molded electrical device and composition therefore |
| 07/11/1989 | CA1257347A1 Microwave connector assembly capable of being readily connected to microwave circuit components |
| 07/11/1989 | CA1257154A1 Planarized ceramic substrates |
| 07/06/1989 | DE3842881A1 Harzmasse fuer laminierte folien Resin composition for laminated sheets |
| 07/06/1989 | DE3837009A1 Method for producing a thin-film circuit |
| 07/05/1989 | EP0322997A2 Process for making printed circuit boards |
| 07/05/1989 | EP0322967A1 Process of metallising a silica, quartz, glass or saphire substrate, and substrate obtained by this process |
| 07/05/1989 | EP0322696A1 Contact pad for connecting a clip-on terminal to a hybrid circuit substrate wafer |
| 07/05/1989 | EP0322641A2 Process for improving the adhesion of electrolessly plated metal layers to polyimide surfaces |
| 07/05/1989 | CN1004747B Printed circuit board unit |
| 07/04/1989 | US4845479 High reliability PWB interconnection for touch input systems |
| 07/04/1989 | US4845474 Smoke and fire detector |
| 07/04/1989 | US4845452 Composite bead element |