| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/04/1989 | US4845315 Cable system |
| 07/04/1989 | US4845313 Metallic core wiring substrate |
| 07/04/1989 | US4845311 Flexible coaxial cable apparatus and method |
| 07/04/1989 | US4844784 Precise bonding |
| 07/04/1989 | CA1257010A1 Heat dissipation for electronic components on a ceramic substrate |
| 06/29/1989 | WO1989006087A1 Improvements in or relating to the repair of electrical circuits |
| 06/29/1989 | WO1989005984A1 Process for adapting the frequency band of an oscillating circuit made from a metal-plastic-metal sandwich foil useful as an identification label, and sandwich foil for implementing the process |
| 06/29/1989 | DE3743335A1 Printed circuit board |
| 06/29/1989 | DE3743163A1 Printed circuit board for an electrical circuit, especially in an office machine |
| 06/28/1989 | EP0322258A2 Method for producing thin film patterns on substrates |
| 06/28/1989 | EP0322165A1 Thermally conductive ceramic/polymer composites |
| 06/28/1989 | EP0322121A1 Surface mounting leadless components on conductor pattern supporting substrates |
| 06/28/1989 | EP0321977A2 Laminating material for printed circuit board of low dielectric constant |
| 06/28/1989 | EP0321899A1 Method and cooling device for an integrated-circuit housing |
| 06/28/1989 | EP0321668A2 Circuit board with conductor |
| 06/28/1989 | EP0321552A1 Automatic clock de-skewing on a circuit board |
| 06/28/1989 | CN1004678B Electric component part having lead terminals |
| 06/27/1989 | US4843520 Electronic circuit module |
| 06/27/1989 | US4843404 Tag web of spiral conductors |
| 06/27/1989 | US4843191 Interconnection technique using dielectric layers |
| 06/27/1989 | US4843190 Circuit board substrate with gold plated contact elements and a method for mounting gold plated contact elements to the substrate |
| 06/27/1989 | US4843113 Containing wollastonite and alkaline earth metal carbonate |
| 06/27/1989 | US4842959 Aluminum enamel board |
| 06/27/1989 | US4842412 Exposure apparatus employed for fabricating printed circuit boards |
| 06/27/1989 | US4841633 Method of mounting electronic parts onto single-sided printed wiring board |
| 06/27/1989 | CA1256628A1 Electrically conductive microspheres and compositions incorporating same |
| 06/27/1989 | CA1256589A1 Hermetic high frequency surface mount microelectronic package |
| 06/27/1989 | CA1256502A1 Low rf emission fiber optic transmission system |
| 06/22/1989 | DE3741918A1 Method for producing an electronic circuit device |
| 06/22/1989 | DE3741916A1 Method of curing polymer-based adhesives |
| 06/22/1989 | DE3741706A1 Method for producing spiral thin-film flat coils |
| 06/22/1989 | DE3740741A1 Method for applying contact decks to a substrate |
| 06/21/1989 | EP0321446A2 Printed wiring board |
| 06/21/1989 | EP0321067A1 Process for treating copper surface |
| 06/21/1989 | EP0320901A2 Low dielectric constant laminate of fluoropolymer and polyaramid |
| 06/20/1989 | US4841275 Thick-film integrated circuit device capable of being manufactured by means of easy-to-perform trimming operation |
| 06/20/1989 | US4841170 Temperature controlled hybrid assembly |
| 06/20/1989 | US4841099 Electrically insulating polymer matrix with conductive path formed in situ |
| 06/20/1989 | US4840924 Method of fabricating a multichip package |
| 06/20/1989 | US4840853 Surface structure of AlN substrate and a process for producing the same |
| 06/20/1989 | CA1256175A1 Circuit to post interconnection device |
| 06/15/1989 | WO1989005571A1 Low cost, hermetic pin grid array package |
| 06/15/1989 | WO1989005570A1 Mounting substrate for leadless ceramic chip carrier |
| 06/15/1989 | WO1989005566A1 Apparatus and method for the manufacture of printed circuit board prototypes |
| 06/15/1989 | WO1989005318A1 Ethers of the condensation products of phenoldicyclopentadiene adducts as thermosetting resins |
| 06/15/1989 | WO1989005317A1 Ethers of oligomeric phenol-dialdehyde condensation products as thermosetting resins for composites |
| 06/15/1989 | WO1989005288A2 Complete ether capping of oligomeric polyphenols |
| 06/14/1989 | EP0320250A1 Electric connector for flat flexible cables |
| 06/14/1989 | EP0320238A1 Imide type prepolymer compositions and processes for preparing same |
| 06/13/1989 | US4839775 Thick-film circuit arrangement having a ceramic substrate plate |
| 06/13/1989 | US4839774 Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board |
| 06/13/1989 | US4839558 Integrated DC electroluminescent display system |
| 06/13/1989 | US4839232 Flexible laminate printed-circuit board and methods of making same |
| 06/13/1989 | US4839218 Multilayer; containing a vinyl chloride plastisol and adhesive |
| 06/13/1989 | US4838798 High density board to board interconnection system |
| 06/13/1989 | EP0288507A4 Process for preparing multilayer printed circuit boards. |
| 06/13/1989 | CA1255812A1 Semiconductor chip package with semiconducting lead alignment bars |
| 06/13/1989 | CA1255810A1 Molded articles having areas catalytic, and non-catalytic, for adherent metallization |
| 06/08/1989 | DE3739863A1 Special crossbar distribution section designs with respect to the rail and plug shape |
| 06/07/1989 | EP0319146A2 Glass-ceramic substrates for electronic packaging and thermally crystallizable glass compositions of use in the production thereof |
| 06/07/1989 | EP0319008A2 Epoxy resin compositions as used in producing composites with high wet glass transition temperatures and in adhesive applications |
| 06/07/1989 | EP0318876A2 Method for improving the adhesion of a metal to a fluoropolymer |
| 06/07/1989 | EP0318862A2 Glass fiber product for use in the reinforcement of fluororesin |
| 06/07/1989 | EP0318485A1 Apparatus and method for high density interconnection substrates using stacked modules. |
| 06/06/1989 | USRE32942 Printed circuits, semiconductors |
| 06/06/1989 | US4837412 Keyboard of a membrane contact type |
| 06/06/1989 | US4837408 High density multilayer wiring board and the manufacturing thereof |
| 06/06/1989 | US4837407 Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof |
| 06/06/1989 | US4837129 Process for producing conductor patterns on three dimensional articles |
| 06/06/1989 | US4837050 Method for producing electrically conductive circuits on a base board |
| 06/06/1989 | US4836979 Cold compacting, annealing, working to produce a high density |
| 06/06/1989 | US4836889 Containing metal oxides; inorganic acid etching |
| 06/06/1989 | US4836651 Flexible circuit interconnection for a matrix addressed liquid crystal panel |
| 06/06/1989 | US4836435 Component self alignment |
| 06/06/1989 | US4836107 Arrangement of modular subassemblies |
| 06/06/1989 | US4835859 Method of forming a contact bump |
| 06/06/1989 | US4835846 Method of manufacture of electronic modules for cards with microcircuits |
| 06/06/1989 | CA1255433A1 Polymer useful for molding into a circuit board substrate |
| 06/06/1989 | CA1255421A1 Phenolic resin compositions |
| 06/01/1989 | WO1989005087A1 Printed circuit board label holder |
| 06/01/1989 | WO1989005066A1 Moldable/foldable radio housing |
| 06/01/1989 | WO1989005034A1 Z-folded capacitor construction |
| 06/01/1989 | WO1989004850A1 Bismaleinimides and polyimides prepared therefrom |
| 06/01/1989 | DE3839105A1 Epoxy resin composition |
| 06/01/1989 | DE3804558A1 Circuit element |
| 05/31/1989 | EP0318209A2 Interconnection technique using dielectric layers |
| 05/31/1989 | CN2038646U Integrated power supply for providing regulated dc voltage |
| 05/30/1989 | US4835598 Wiring board |
| 05/30/1989 | US4835593 Multilayer thin film metallurgy for pin brazing |
| 05/30/1989 | US4835394 Cable assembly for an electrical signal transmission system |
| 05/30/1989 | US4835345 Printed wiring board having robber pads for excess solder |
| 05/30/1989 | US4835065 Composite alumina-aluminum nitride circuit substrate |
| 05/30/1989 | US4835039 Tungsten paste for co-sintering with pure alumina and method for producing same |
| 05/30/1989 | US4835038 Substrate coated with multiple thick films |
| 05/30/1989 | US4834835 Glass fiber reinforcement, dry etching |
| 05/30/1989 | US4834821 Process for preparing polymeric materials for application to printed circuits |
| 05/30/1989 | US4834662 Method and arrangement for the connection of a multipole connector to a circuit board |
| 05/30/1989 | US4833913 Sample having coated perforations intended to be examined under the microscope and its preparation process, particularly for printed circuit boards |
| 05/30/1989 | CA1255014A1 Round solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads |
| 05/30/1989 | CA1255012A1 Self-soldering, flexible circuit connector |