Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/1989
11/16/1989WO1989011114A1 Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
11/16/1989WO1989010985A1 Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
11/16/1989DE3815736A1 Multilayer circuit board
11/16/1989DE3814863A1 Process for producing multilayer ceramic based on silicate
11/16/1989DE3814486A1 Keramische platte (substrat) die wenigstens einseitig mit metall beschichtet ist Ceramic plate (substrate) is at least one side coated with metal
11/15/1989EP0341629A2 Printed circuit board and a method of recognizing the position of surface mounted parts
11/15/1989EP0341591A2 Black level drift compensator for use in a television receiver
11/15/1989EP0341458A1 Double-sided board circuit
11/15/1989EP0341246A1 Ceramic-glass-metal composite
11/15/1989CN1037163A Carbon black-filled and process of preparing same
11/14/1989US4880589 A homopolymer or copolymer of 4-methylpentene
11/14/1989US4880567 Multilayer circuits, glass frits
11/14/1989US4880349 Method for locating and supporting ceramic substrates
11/14/1989US4880170 Process for producing fine copper powder with enhanced sinterability
11/08/1989EP0341177A1 Regulation module for electric tracing means
11/08/1989EP0340997A2 Electrically insulating polymer matrix with conductive path formed in situ
11/08/1989EP0340737A2 Composite materials
11/08/1989EP0340713A1 Device for the distribution of very high-speed digital signals
11/08/1989EP0340392A2 Beta-diketo-compound-polymer reaction product and use thereof
11/08/1989EP0340376A1 Electric circuit for electronic machines, printed by means of a silk-screen process onto a polyester film with a multi-layered structure
11/08/1989EP0176378B1 Phenolic-resin compositions
11/07/1989US4879631 Short-resistant decoupling capacitor system for semiconductor circuits
11/07/1989US4879630 Housing for an electronic circuit
11/07/1989US4879433 Parallel cable bus with internal path length compensation
11/07/1989US4879261 Ceramics, dielectrics, silica, zinc borate flux
11/07/1989US4879164 Circuit boards
11/07/1989US4879156 Multilayered ceramic substrate having solid non-porous metal conductors
11/07/1989US4878851 Electrical socket apparatus with temporary housing
11/07/1989US4878847 Patchfield system
11/07/1989US4878315 Griding guide and method
11/07/1989US4878293 Method of interconnecting assemblies using torsionly stressed conductors routed through a hollow articulated hinge
11/07/1989EP0290598A4 Ceramic/organic multilayer interconnection board.
11/07/1989CA1262676A1 Fluoropolymer composites and method for making them
11/02/1989WO1989010593A1 Memory testing system
11/02/1989WO1989010339A1 Ceramic plate (substrate) coated on at least one side with metal
11/02/1989EP0339881A1 Method of making a ciccuit board
11/02/1989EP0339653A1 Matrix switching device and method of manufacturing the same
11/02/1989EP0339154A2 Memory card
11/02/1989DE3817879A1 Mounting plate
11/02/1989DE3813566A1 Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production
11/02/1989DE3813565A1 Electrical connection of hybrid assemblies
11/02/1989DE3813396A1 Housing for electronic apparatuses
10/1989
10/31/1989US4878155 High speed discrete wire pin panel assembly with embedded capacitors
10/31/1989US4878152 Compressed graphite sheet sandwiched between two thin layers of carbon fibers embedded in resin matrix
10/31/1989US4877971 Method and apparatus for distributing a signal
10/31/1989US4877936 Soldered structure of fine wire, and method of and apparatus for soldering fine wire
10/31/1989US4877822 Molding materials; crack resistance
10/31/1989US4877565 Method of manufacturing circuit component such as stator for variable resistor
10/31/1989US4877555 Conductor composition and method of manufacturing a ceramic multilayer structure using the same
10/31/1989US4877484 Flocced 2:1 layered silicates and water-resistant articles made therefrom
10/31/1989CA1262577A1 Process for preparing multilayer printed circuit boards
10/31/1989CA1262576A1 Porous bottom-layer dielectric composite structure
10/25/1989EP0338641A1 Method of mounting optical elements on a support and optical circuit obtained in this way
10/25/1989EP0338447A2 Device for dissipating heat of components on a printed-circuit board
10/25/1989EP0338150A1 A method of producing electronic basic blocks with a high degree of compaction and basic blocks produced according to method
10/25/1989EP0338131A2 Carbon black-filled foam and process of preparing same
10/24/1989US4876630 Mid-plane board and assembly therefor
10/24/1989US4876322 Irradiation cross-linkable thermostable polymer system, for microelectronic applications
10/24/1989US4876319 Synthetic resin composition, substrate material for printed circuit boards and method of manufacturing a synthetic resin composition
10/24/1989US4876120 Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion
10/24/1989US4876119 Method of coating a nitride ceramic member
10/24/1989US4875862 Surface mountable connector
10/24/1989US4875282 Method of making multilayer printed circuit board
10/24/1989US4875279 Die attach pickup tools
10/19/1989WO1989010005A1 Pre-formed chip carrier cavity package
10/19/1989DE3811313A1 Housing for hybrid circuits
10/18/1989EP0337686A2 Semiconductor chip module
10/18/1989EP0337412A2 Encapsulant composition
10/18/1989EP0337331A1 Method for producing an allround-shielded transmission line
10/18/1989EP0337316A1 Resin laminates and a process for production thereof
10/18/1989EP0336969A1 Flexible metal/plastic laminate and method and apparatus for manufacturing same
10/17/1989US4875138 Variable pitch IC bond pad arrangement
10/17/1989US4875137 Uniform current and voltage distribution device
10/17/1989US4875087 Integrated circuit device having strip line structure therein
10/17/1989US4874907 Printed circuit board
10/17/1989US4874809 Containing polyethylene terephthalate, cyclohexanedimethylene terephthalate, glass fibers, mica
10/17/1989US4874669 Electrical laminates
10/17/1989US4874550 Thick-film copper conductor inks
10/17/1989US4874086 Film carrier and a method for manufacturing a semiconductor device utilizing the same
10/17/1989US4873764 Component mounting process for printed circuit boards
10/12/1989DE3906690A1 Ceramic plate for power semiconductor modules
10/11/1989EP0336704A2 Polymethylpentene release sheet
10/11/1989EP0336613A2 Unitary tuning structure
10/11/1989EP0336530A2 Radio interference suppression
10/11/1989EP0336528A2 Automated discretionary bonding of multiple parallel elements
10/11/1989EP0336360A2 Process for producing prepreg and laminated sheet
10/11/1989EP0336266A2 Electrical laminate produced by using special thermosetting resin compostions
10/11/1989EP0336072A2 Base material of epoxy resin
10/11/1989CN2045748U Control device structure for industrial sewing machine
10/10/1989US4873309 Stabilized flame-retardant epoxy resin composition from a brominated epoxy resin and a vinyl monomer diluent
10/10/1989US4873302 Laminates in electrical and electronic circuit boards
10/10/1989US4873151 Aluminum nitride circuit substrate
10/10/1989US4873123 Forming circuit line having terminus with stress relief bend on low adhesion area of substrate
10/10/1989US4873022 Electrically conductive paste, electronic circuit component and method for producing same
10/10/1989US4872845 Retention means for chip carrier sockets
10/10/1989US4872844 Component-carrying adapter for chip carrier socket
10/10/1989US4872381 Programmable magnetic repulsion punching apparatus
10/05/1989WO1989009534A1 Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier
10/05/1989DE3809972A1 Method for transmitting information signals between modules, especially between plug-in modules of a communications system
10/05/1989DE3808781A1 Heterocyclically substituted diamines and bismaleimides, and polyimides prepared therefrom
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