H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/1988
11/15/1988	US4785057 Molding materials, dielectric seals
11/15/1988	US4784917 Hydroxystyrene ether or ester, butadiene copolymer
11/15/1988	US4784901 Polytetrafluoroethylene and bismaleimide-triazine resin
11/15/1988	US4784893 Heat conductive circuit board and method for manufacturing the same
11/15/1988	US4784377 Apparatus for locating and supporting ceramic substrates
11/10/1988	DE3812424A1 Pinboard switching device
11/10/1988	DE3713988A1 Arrangement for the surface joining of thermally incompatible materials
11/10/1988	DE3713318A1 Electrical switch
11/09/1988	EP0290148A2 Surface coating with very high rf loss for microwave components
11/09/1988	EP0289903A1 Ceramic coated metal subtrates for electronic applications
11/08/1988	US4783815 Manufacturing miniature hearing aid having a multi-layer circuit arrangement
11/08/1988	US4783722 Interboard connection terminal and method of manufacturing the same
11/08/1988	US4783697 Leadless chip carrier for RF power transistors or the like
11/08/1988	US4783642 Hybrid integrated circuit substrate and method of manufacturing the same
11/08/1988	US4783579 Thermoplastic elastomer exterior and jonomer interior
11/08/1988	US4783431 Insulative ceramic composition
11/08/1988	US4783380 Oxides of aluminum, tantalum, silicon, calcium and magnesium
11/08/1988	US4783368 High heat conductive insulated substrate and method of manufacturing the same
11/08/1988	US4783363 Curable compositions containing a polyepoxide and a halogenated bisphenol
11/08/1988	US4783359 Heat sealing circuit with low dielectric bonding layer
11/08/1988	US4783358 Ceramic wiring substrate
11/08/1988	US4783345 Method for the manufacture of prepregs and their use
11/08/1988	US4783247 Method and manufacture for electrically insulating base material used in plated-through printed circuit panels
11/08/1988	US4783243 Articles comprising metal-coated polymeric substrates and process
11/08/1988	US4782751 Silk-screen printing apparatus with optical reading device for registration
11/03/1988	WO1988008660A1 Power circuit board and manufacturing method
11/03/1988	WO1988008360A1 Process for manufacturing a structured ceramic film or a ceramic object composed of such films
11/03/1988	DE3713199A1 Printed circuit board for an electric circuit
11/02/1988	EP0289222A1 Glass-ceramics for electronic packaging
11/02/1988	EP0289137A2 Manufacturing printed-circuit components
11/02/1988	EP0288767A2 Method for forming a shielded transmission line
11/02/1988	EP0288753A1 Bonding of pure metal films to ceramics
11/02/1988	EP0288507A1 Process for preparing multilayer printed circuit boards.
11/01/1988	US4782310 High frequency filter assembly for electric instrument
11/01/1988	US4782193 Polygonal wiring for improved package performance
11/01/1988	US4782116 Homogeneous thermoset terpolymers
11/01/1988	US4781980 Anti-oxidation film of organic acid salt of higher alipratic amine, and surface film of dispersing agent
11/01/1988	US4781970 Strengthening a ceramic by post sinter coating with a compressive surface layer
11/01/1988	US4781969 Aluminum and copper, polytetrafluoroethylene
11/01/1988	US4781968 Micro-electronics devices and methods of manufacturing same
11/01/1988	US4781624 Filter arrangements and connectors
11/01/1988	US4781601 Header for an electronic circuit
11/01/1988	US4780957 Method for producing rigid-type multilayer printed wiring board
10/1988
10/27/1988	DE3716531A1 Process for the continuous production of strip-shaped base material
10/26/1988	EP0287859A2 Method and apparatus for forming pins of an extrudable material in a substrate
10/26/1988	EP0287843A1 Process for manufacturing printed-circuit boards
10/26/1988	EP0287681A1 Multi-layer printed circuit board and a method of fabricating the same
10/26/1988	EP0135534B1 Thick film resistor circuits
10/25/1988	US4780795 Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
10/25/1988	US4780754 Alumina, h2o, and silanol endcapped siloxane; integrated circuits
10/25/1988	US4780631 Device for the electronic control and regulation of machines
10/25/1988	US4780507 Curable thermosetting cyanate ester composition
10/25/1988	US4780332 Forming spinel intemediate layer
10/25/1988	US4780248 Thick film electronic materials
10/25/1988	US4780087 Electrical connector for circuit boards
10/25/1988	US4779340 Programmable electronic interconnect system and method of making
10/25/1988	US4779339 Method of producing printed circuit boards
10/25/1988	US4779338 Method of mounting LSI
10/20/1988	WO1988008180A1 Electronic alarm label
10/20/1988	WO1988007983A1 Ceramic base and process for its production
10/20/1988	WO1988007937A1 Pattern forming sheet and formed pattern fixing process
10/20/1988	DE3711160A1 Circuit arrangement
10/20/1988	DE3711023A1 Device for electrically conducting connection of the components of two parallel printed circuit boards
10/20/1988	DE3710708A1 Electric switching device for installation in distribution boards
10/19/1988	EP0287412A2 Microlithographic process for circuits using organic conductive films sensitive to electromagnetic radiations and to charged particles
10/19/1988	EP0287274A2 Semiconductor hybrid device
10/19/1988	EP0287231A2 Methods for accelerating burnout of organic materials
10/19/1988	EP0287111A2 Method for manufacturing an electronic part
10/19/1988	EP0286854A1 Method for making a multilayer thin-film circuit
10/19/1988	EP0286829A2 Electronic device comprising a polyimide layer, and method for its production
10/18/1988	US4779164 Printed circuit board
10/18/1988	US4778872 Biphenyltetracarboxylic acids, pyromellitic acid, phenylenediamine, diaminodiphenyl ethers
10/18/1988	US4778556 Stitching pad is heat bonded by adhesive layer; other surface is weldable
10/18/1988	US4778552 Alarm tag and method of making and deactivating it
10/18/1988	US4778549 Ruthenium, rhodium, palladium, osmium, iridium; or platinum; combustion with low oxygen levels
10/18/1988	US4778393 Pin board matrix
10/18/1988	US4777718 Method of forming and connecting a resistive layer on a pc board
10/18/1988	CA1243414A2 Printing ink
10/12/1988	EP0286440A2 Connector assembly
10/12/1988	EP0286422A2 Electrical connector terminal for a flexible printed circuit board
10/12/1988	EP0286258A2 Hybrid interconnect lead frame for thermal ink jet printhead and methods of manufacture and connection
10/12/1988	EP0285854A1 Thin film capacitor
10/12/1988	EP0285850A2 Improved screen printing method for producing lines of uniform width and height
10/12/1988	EP0285849A2 Fluorine containing dicyanate resins
10/12/1988	EP0285820A2 Method and structure for identifying non-functional chip connect pads
10/12/1988	EP0285714A1 Laminated synthetic mica articles
10/12/1988	EP0285669A1 Functional film and process for its production
10/12/1988	EP0148820B1 Electronic circuit chip connection assembly and method
10/11/1988	US4777615 Backplane structure for a computer superpositioning scalar and vector operations
10/11/1988	US4777564 Leadform for use with surface mounted components
10/11/1988	US4777562 Wire wrap single in-line package
10/11/1988	US4777465 Square toroid transformer for hybrid integrated circuit
10/11/1988	US4777228 Shrinkage inhibition
10/11/1988	US4777227 High temperature thermosetting resin compositions
10/11/1988	US4777226 Terpolymer from (1) a poly(vinylbenzylether) of a polyphenol (2) a cyanate ester of a polyphenol and (3) alkenyl aryl compound
10/11/1988	US4777201 Homo-or copolymer of 4-methyl-1-pentene; printed circuits
10/11/1988	US4777092 Composition for ceramic substrate and substrate
10/11/1988	US4777078 Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating
10/11/1988	US4777060 Multilayer-metal core, dielectric, and conductor
10/11/1988	US4776978 Method of controlling the sintering of metal particles

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