Patents for H05K 1 - Printed circuits (98,583)
10/1988
10/11/1988US4776883 Reducing silver and palladium compounds with hydrazine; heat treating
10/11/1988US4776805 Card biasing device for card edge connectors
10/11/1988US4776804 Circuit board systems, connectors used therein, and methods for making the connectors and systems
10/11/1988US4776087 For forming a shielded transmission line
10/06/1988WO1988007562A1 Homogeneous thermoset copolymers
10/06/1988WO1988007422A1 Low expansion copper alloys with high thermal conductivity
10/06/1988DE3809237A1 Entkopplungskondensator fuer schaltungspackungen mit oberflaechenmontierten kontaktstiftlosen chiptraegern, oberflaechenmontierten chiptraegern mit kontaktstiften und fuer schaltungspackungen mit kontaktstiftraster Decoupling capacitor for circuit packs with oberflaechenmontierten contact pinless chiptraegern, chiptraegern oberflaechenmontierten with contactless donate and for circuit packs with per-pin grid
10/06/1988DE3710223A1 Conductor track arrangement for an insulating plate of glass
10/05/1988EP0285127A2 Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
10/05/1988EP0285118A1 Physical quantity controller
10/05/1988EP0285051A2 Method for bonding integrated circuit chips
10/05/1988EP0284939A2 Finished laminates for high frequency circuits
10/05/1988EP0284855A1 Contact device and process for connecting a conducting foil
10/05/1988EP0284845A1 Electrical connections for the rear of printed circuits
10/05/1988EP0284844A1 Electrical connections for the rear of printed circuits
10/05/1988EP0284757A1 Circuit board
10/05/1988EP0187771B1 High frequency transformer
10/05/1988CN87214958U New type roofing clutch gold veneer sheet for printing curcuit
10/04/1988USRE32759 Backup material for small bore drilling
10/04/1988US4775917 Thermal compensated circuit board interconnect apparatus and method of forming the same
10/04/1988US4775611 Additive printed circuit boards with flat surface and indented primary wiring conductors
10/04/1988US4775573 Multilayer PC board using polymer thick films
10/04/1988US4775503 Process for the manufacture of an interconnecting substrate for electronic components
10/04/1988US4775439 Method of making high metal content circuit patterns on plastic boards
10/04/1988US4775435 Method of manufacturing a liquid level probe
10/04/1988CA1242844A1 Circuit board substrates prepared from poly(aryl ether)s
10/04/1988CA1242810A1 Surface mounted circuits including hybrid circuits, having cvd interconnects, and method of preparing the circuits
10/04/1988CA1242774A1 Compliant press fit electrical contact
09/1988
09/29/1988DE3709222A1 Printed circuit board
09/28/1988EP0284151A2 Interface device for electrical connections in washing and drying machines the device having rigid plane elements and flexible printed circuits
09/28/1988EP0283914A2 Aromatic polysulfone resin composition having excellent plating characteristics
09/28/1988EP0283608A1 Laminated products from inorganic papers
09/28/1988EP0283566A1 Circuit board
09/28/1988EP0283546A1 Method for producing micromechanical components of any form from plane parallel polymer plates or via holes therein
09/28/1988EP0283481A1 Trimming passive components buried in multilayer structures.
09/27/1988US4774634 Shock and vibration resistant
09/27/1988US4774633 Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device
09/27/1988US4774298 Process for producing biaxially oriented paraphenylene sulfide block copolymer film
09/27/1988US4774188 Control of circuit board quality
09/27/1988US4774127 Flexible printed circuit
09/27/1988US4774126 Solderable thermoplastic structure
09/27/1988US4773955 Printed wiring board for mounting electronic parts and process for producing the same
09/27/1988US4773868 Apparatus for use with stackable processor modules
09/22/1988WO1988007257A1 High-frequency component
09/22/1988WO1988006952A1 Biased grinding assembly
09/21/1988EP0283033A2 Ceramic substrate and preparation of the same
09/21/1988EP0282637A2 Computer system accepting feature cards
09/21/1988EP0282625A2 Method for producing rigid-type multilayer printed wiring board
09/21/1988EP0282622A1 Pluggable connector for contacting directly a printed circuit board
09/21/1988EP0282487A1 Means for use in manufacturing circuit cards and method for manufacturing the means.
09/20/1988US4772864 Multilayer circuit prototyping board
09/20/1988US4772762 Printed board
09/20/1988US4772574 Inks; integrated circuits; frits; oxides of lead, zinc, aluminum, boron, silicon
09/20/1988US4772509 Printed circuit board base material
09/20/1988US4772496 Molded product having printed circuit board
09/20/1988US4772488 Thick film dielectrics
09/20/1988US4772346 Method of bonding inorganic particulate material
09/20/1988US4772100 Liquid crystal display device having circuit boards extending along segment and column electrode directions
09/20/1988US4771537 Method of joining metallic components
09/20/1988CA1242253A1 Compliant lead clip
09/15/1988DE3806057A1 Dielectric paint for an integrated multilayer circuit
09/15/1988DE3707239A1 Distributor for telecommunication systems
09/15/1988DE3705462A1 Method and device for simultaneously making contact with components which can be set down and have a different temperature load capacity
09/14/1988EP0282396A1 Complex hybrid circuit structure, and its production method
09/14/1988EP0282285A2 A method of metallization for a nitride ceramic member
09/14/1988EP0282078A2 Process for making an electrical-circuit board comprising a metal core and basic material for the same
09/14/1988EP0281900A2 Removable holder and method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
09/14/1988EP0281899A2 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
09/14/1988EP0281807A2 Additive technique for multilayer wirings
09/14/1988EP0281704A2 Method and apparatus for preparing conductive screened through holes employing metalli-plated polymer thick films
09/14/1988CN88100872A Miniature motor
09/13/1988US4771366 Ceramic card assembly having enhanced power distribution and cooling
09/13/1988US4771261 Method for achieving the electrical and mechanical interconnection of two bodies, particularly the diaphragm and the support of a thick-film pressure sensor, and devices made by this method
09/13/1988US4771236 Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same
09/13/1988US4770953 Circuit substrates
09/13/1988US4770922 Printed circuit board base material
09/13/1988US4770921 Reducted noise levels; dielectrics, uniform voltage conductive pattern
09/13/1988US4770900 Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
09/13/1988US4769908 Method of manufacturing a plurality of contact terminals
09/13/1988US4769907 Method of making a circuit board pin
09/13/1988US4769883 Method for tuning a microwave integrated circuit
09/13/1988CA1242033A1 Circuit board made from cross-linked polycyanurate polymer, thermoplastic polymer and polyaramid fiber
09/07/1988WO1988006610A1 Fiber-reinforced heat-resistant polyolefin composition
09/07/1988EP0281038A2 Film carrier and method of manufacturing same
09/07/1988EP0280822A1 Sample with coated holes and method for its preparation
09/07/1988EP0280700A1 Circuit package attachment apparatus and method.
09/06/1988US4769741 Electrical module and method for the manufacture thereof
09/06/1988US4769690 Metallizing paste for silicon carbide sintered body and a semiconductor device including the same
09/06/1988US4769525 Circuit package attachment apparatus and method
09/06/1988US4769309 Electroplating to produce multilayer, interconnecting, fine line circuit boards; increasing dimensional integrity and circuit stability
09/06/1988US4769294 Alumina materials for low temperature co-sintering with refractory metallization
09/06/1988US4769270 Substrate for a printed circuit board
09/06/1988US4768961 Jackfield with front removable jack modules having lamp assemblies
09/06/1988CA1241745A1 Magnetic bubble memory module
09/01/1988DE3805598A1 Planarer, insbesondere elektrolumineszierender anzeigenaufbau Planar, in particular electroluminescent display assembly
09/01/1988DE3705106A1 Process for the production of prepregs
09/01/1988DE3705081A1 Method for measuring the solderability of through-plated holes in printed circuit boards, and a device for carrying out the method
08/1988
08/31/1988EP0280073A2 Circuit substrate with resistor elements
08/31/1988EP0279881A1 Method and connection device for joining a multipole terminal and a printed-circuit board together
08/31/1988CN87107196A Ceramic-glass-metal composite