Patents for H05K 1 - Printed circuits (98,583)
08/1988
08/30/1988US4768004 Electrical circuit interconnect system
08/30/1988US4767674 Metal cored board and method for manufacturing same
08/30/1988US4767672 Process for preparation of glazed ceramic substrate and glazing composition used therefor
08/30/1988US4767665 Article formed by electroless plating
08/30/1988US4767662 Copper etching process and product
08/30/1988US4767661 Using liquid etchant
08/30/1988US4767341 Printed circuit card reset switch
08/30/1988US4767338 Printed circuit board telephone interface
08/30/1988CA1241483A1 Unsaturated polyester resin compositions
08/30/1988CA1241453A1 Connecting apparatus for electrically connecting memory modules to a printed circuit board
08/30/1988CA1241402A1 Electrical contact pin for printed circuit board
08/30/1988CA1241396A1 Card holder
08/25/1988DE3804088A1 Baumaterial auf der basis eines wasserbestaendigen silikats und verfahren zu seiner herstellung Building material based on a silicate and wasserbestaendigen process for its preparation
08/24/1988EP0279769A2 Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material
08/24/1988EP0279601A2 Electrical conductor arrangement
08/24/1988EP0279504A2 Surface treating method for polyacetal resin molded articles
08/24/1988EP0279147A2 Silk-screen printing apparatus with optical reading device for detecting the registration marks of a printing support on a printing plane
08/24/1988EP0279001A1 Laminates
08/23/1988US4766481 Power semiconductor module
08/23/1988US4766268 Board for printed circuits and processes for manufacturing such printed boards
08/23/1988US4766027 Method for making a ceramic multilayer structure having internal copper conductors
08/23/1988US4766017 Process for the adhesive metallization of ceramic materials
08/23/1988US4766010 Improver decarbonization
08/23/1988US4765929 Mixture of electroconductive powder, binder silicon, and solvent system containing ethylene glycol diacetate
08/23/1988US4765860 Improved adhesive bonding strength between low-temperature plasma surface-exposed polymer and metal foil
08/23/1988US4765784 Electronic depth control for drill
08/23/1988US4765528 Plating process for an electronic part
08/23/1988CA1241127A1 Electric circuits having repairable circuit lines and method of making the same
08/23/1988CA1241079A1 Laminar electrical component with magnesium orthoborate
08/18/1988DE3703364A1 Arrangement of a printed circuit board fitting
08/17/1988EP0278869A2 Circuit board contact guide pattern
08/17/1988EP0278748A2 A printed circuit board and apparatus for recording data thereon
08/17/1988EP0278652A1 Heat-resistant insulating coating material
08/17/1988EP0278485A2 Process for making a digitalization board
08/17/1988EP0278484A2 Process for making a digitalization board
08/17/1988EP0278413A2 Method for making a connection between a bonding wire and a contact pad in hybrid thick-film circuits
08/17/1988EP0278390A2 Thick film electronic materials
08/17/1988EP0278077A2 Assembly with temperature sensitive devices
08/17/1988CN88100545A Transfer for automatic application
08/17/1988CN87108226A Photopolymerizable composition having superior adhesion, articles and processes
08/16/1988US4764848 Surface mounted array strain relief device
08/16/1988US4764659 Thermal head
08/16/1988US4764644 Microelectronics apparatus
08/16/1988US4764486 Sintered glass-powder product
08/16/1988US4764413 Dielectric of thin polymer film; electroconductive metal wiring; display panels
08/16/1988US4764341 Bonding of pure metal films to ceramics
08/16/1988US4764233 Sheets from mixtures of silica of different crystal forms scurried with binder; lamination, firing
08/16/1988US4764122 Data bus connector
08/11/1988WO1988005959A1 Ceramic substrate with conductively-filled vias and method for producing
08/11/1988DE3744453A1 Sammelschiene hoher kapazitaet mit mehrschichtkondensatorelementen Busbar, high-capacity multi-layer capacitor elements
08/10/1988EP0277873A1 Self-latching connection device for a card with an edge contact area
08/10/1988EP0277547A2 Polyimide having thermal dimensional stability
08/10/1988EP0277430A2 Circuit board systems, connectors used therein, and methods for making the connectors and systems
08/10/1988EP0277209A1 Wave solder finger shield apparatus.
08/10/1988EP0277118A1 Removable commoning bar.
08/10/1988EP0028657B1 Hollow multilayer printed wiring board, and method of fabricating same
08/10/1988CN87105998A Embedded catalyst receptors for metallization of dielectrics
08/09/1988US4763008 Ionization detector with conductive signal and ground traces
08/09/1988US4762869 Block polyethers with sulfones and carbonyls
08/09/1988US4762809 Low dielectric fiber glass composition having improved water resistance and heat resistance
08/09/1988US4762747 Good adhesion to polyimides
08/09/1988US4762732 Patters of silver solders in curable polymers
08/09/1988US4762606 Mini chip carrier slotted array
08/09/1988CA1240373A1 Surface mountable microwave ic package
08/03/1988EP0276965A1 Transfer for automatic application
08/03/1988EP0276788A2 Aluminium nitride sintered body formed with metallized layer and method of manufacturing the same
08/03/1988EP0276405A2 Polyimide having a thermal dimensional stability
08/03/1988EP0276291A1 A method of treating glass surfaces with coupling agents and resins to provide an improved surface for bonding a final resin
08/03/1988CN86106985A Method for integration of resistors in chemically deposited conductor networks
08/02/1988US4761517 Electrical connections with controlled thermal and electrical resistances
08/02/1988US4761460 Polymaleimide compound and composition containing the same
08/02/1988US4761388 Aluminum nitride and aluminum oxide, spinning viscose mixtures
08/02/1988US4761345 Aluminum nitride substrate
08/02/1988US4761332 Silicon nitride deposition
08/02/1988US4761325 Copper conductors separated by glass-ceramic insulating layers
08/02/1988US4761303 Dielectrics masking, applying copper
08/02/1988CA1240072A1 Metal cored circuit board with baked-on polymer layer
08/02/1988CA1240027A1 Hearing aid and apparatus used therein
08/02/1988CA1239859A1 Flexible multilayer polyimide laminates
07/1988
07/28/1988WO1988005428A1 Method for connecting leadless chip packages and articles
07/28/1988DE3742151A1 Electrical apparatus having overheating protection
07/28/1988DE3701310A1 Contact-making device for making contact with surface-mounted integrated circuits
07/27/1988EP0276004A2 Multilayer ceramic substrate and method for making the same
07/27/1988EP0275433A1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil
07/27/1988CN87108179A Method for inspecting printed circuit boards for missing or misplaced components
07/27/1988CN87105952A Conductive pattern producing method and its applications
07/26/1988US4759986 Associated with covellite copper sulfide
07/26/1988US4759978 Reaction product of a compound having three phenolic hydroxyl groups in a molecule, bisphenol epoxy resin and halogen containing epoxy resin
07/26/1988US4759965 Ceramic, preparation thereof and electronic circuit substrate by use thereof
07/26/1988US4759120 Method for surface mounting a coil
07/26/1988CA1239749A1 Fiber-reinforced syntactic foam composites and method for forming same
07/20/1988EP0275070A2 Multilayer printed wiring board and method for making same
07/20/1988EP0275052A2 Method for making a ceramic multilayer structure having internal copper conductors
07/20/1988EP0274646A1 Process for the preparation of prepregs, and their use
07/19/1988US4758922 High frequency circuit having a microstrip resonance element
07/19/1988US4758808 Impedance element mounted on a pc board
07/19/1988US4758459 Molded circuit board
07/19/1988US4758063 Optical device and circuit board set
07/19/1988US4757759 Multilayer ceramic bar printing and assembling apparatus
07/14/1988WO1988005252A1 Method for the manufacture of multilayer printed circuit boards