Patents for H05K 1 - Printed circuits (98,583) |
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08/30/1988 | US4768004 Electrical circuit interconnect system |
08/30/1988 | US4767674 Metal cored board and method for manufacturing same |
08/30/1988 | US4767672 Process for preparation of glazed ceramic substrate and glazing composition used therefor |
08/30/1988 | US4767665 Article formed by electroless plating |
08/30/1988 | US4767662 Copper etching process and product |
08/30/1988 | US4767661 Using liquid etchant |
08/30/1988 | US4767341 Printed circuit card reset switch |
08/30/1988 | US4767338 Printed circuit board telephone interface |
08/30/1988 | CA1241483A1 Unsaturated polyester resin compositions |
08/30/1988 | CA1241453A1 Connecting apparatus for electrically connecting memory modules to a printed circuit board |
08/30/1988 | CA1241402A1 Electrical contact pin for printed circuit board |
08/30/1988 | CA1241396A1 Card holder |
08/25/1988 | DE3804088A1 Baumaterial auf der basis eines wasserbestaendigen silikats und verfahren zu seiner herstellung Building material based on a silicate and wasserbestaendigen process for its preparation |
08/24/1988 | EP0279769A2 Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material |
08/24/1988 | EP0279601A2 Electrical conductor arrangement |
08/24/1988 | EP0279504A2 Surface treating method for polyacetal resin molded articles |
08/24/1988 | EP0279147A2 Silk-screen printing apparatus with optical reading device for detecting the registration marks of a printing support on a printing plane |
08/24/1988 | EP0279001A1 Laminates |
08/23/1988 | US4766481 Power semiconductor module |
08/23/1988 | US4766268 Board for printed circuits and processes for manufacturing such printed boards |
08/23/1988 | US4766027 Method for making a ceramic multilayer structure having internal copper conductors |
08/23/1988 | US4766017 Process for the adhesive metallization of ceramic materials |
08/23/1988 | US4766010 Improver decarbonization |
08/23/1988 | US4765929 Mixture of electroconductive powder, binder silicon, and solvent system containing ethylene glycol diacetate |
08/23/1988 | US4765860 Improved adhesive bonding strength between low-temperature plasma surface-exposed polymer and metal foil |
08/23/1988 | US4765784 Electronic depth control for drill |
08/23/1988 | US4765528 Plating process for an electronic part |
08/23/1988 | CA1241127A1 Electric circuits having repairable circuit lines and method of making the same |
08/23/1988 | CA1241079A1 Laminar electrical component with magnesium orthoborate |
08/18/1988 | DE3703364A1 Arrangement of a printed circuit board fitting |
08/17/1988 | EP0278869A2 Circuit board contact guide pattern |
08/17/1988 | EP0278748A2 A printed circuit board and apparatus for recording data thereon |
08/17/1988 | EP0278652A1 Heat-resistant insulating coating material |
08/17/1988 | EP0278485A2 Process for making a digitalization board |
08/17/1988 | EP0278484A2 Process for making a digitalization board |
08/17/1988 | EP0278413A2 Method for making a connection between a bonding wire and a contact pad in hybrid thick-film circuits |
08/17/1988 | EP0278390A2 Thick film electronic materials |
08/17/1988 | EP0278077A2 Assembly with temperature sensitive devices |
08/17/1988 | CN88100545A Transfer for automatic application |
08/17/1988 | CN87108226A Photopolymerizable composition having superior adhesion, articles and processes |
08/16/1988 | US4764848 Surface mounted array strain relief device |
08/16/1988 | US4764659 Thermal head |
08/16/1988 | US4764644 Microelectronics apparatus |
08/16/1988 | US4764486 Sintered glass-powder product |
08/16/1988 | US4764413 Dielectric of thin polymer film; electroconductive metal wiring; display panels |
08/16/1988 | US4764341 Bonding of pure metal films to ceramics |
08/16/1988 | US4764233 Sheets from mixtures of silica of different crystal forms scurried with binder; lamination, firing |
08/16/1988 | US4764122 Data bus connector |
08/11/1988 | WO1988005959A1 Ceramic substrate with conductively-filled vias and method for producing |
08/11/1988 | DE3744453A1 Sammelschiene hoher kapazitaet mit mehrschichtkondensatorelementen Busbar, high-capacity multi-layer capacitor elements |
08/10/1988 | EP0277873A1 Self-latching connection device for a card with an edge contact area |
08/10/1988 | EP0277547A2 Polyimide having thermal dimensional stability |
08/10/1988 | EP0277430A2 Circuit board systems, connectors used therein, and methods for making the connectors and systems |
08/10/1988 | EP0277209A1 Wave solder finger shield apparatus. |
08/10/1988 | EP0277118A1 Removable commoning bar. |
08/10/1988 | EP0028657B1 Hollow multilayer printed wiring board, and method of fabricating same |
08/10/1988 | CN87105998A Embedded catalyst receptors for metallization of dielectrics |
08/09/1988 | US4763008 Ionization detector with conductive signal and ground traces |
08/09/1988 | US4762869 Block polyethers with sulfones and carbonyls |
08/09/1988 | US4762809 Low dielectric fiber glass composition having improved water resistance and heat resistance |
08/09/1988 | US4762747 Good adhesion to polyimides |
08/09/1988 | US4762732 Patters of silver solders in curable polymers |
08/09/1988 | US4762606 Mini chip carrier slotted array |
08/09/1988 | CA1240373A1 Surface mountable microwave ic package |
08/03/1988 | EP0276965A1 Transfer for automatic application |
08/03/1988 | EP0276788A2 Aluminium nitride sintered body formed with metallized layer and method of manufacturing the same |
08/03/1988 | EP0276405A2 Polyimide having a thermal dimensional stability |
08/03/1988 | EP0276291A1 A method of treating glass surfaces with coupling agents and resins to provide an improved surface for bonding a final resin |
08/03/1988 | CN86106985A Method for integration of resistors in chemically deposited conductor networks |
08/02/1988 | US4761517 Electrical connections with controlled thermal and electrical resistances |
08/02/1988 | US4761460 Polymaleimide compound and composition containing the same |
08/02/1988 | US4761388 Aluminum nitride and aluminum oxide, spinning viscose mixtures |
08/02/1988 | US4761345 Aluminum nitride substrate |
08/02/1988 | US4761332 Silicon nitride deposition |
08/02/1988 | US4761325 Copper conductors separated by glass-ceramic insulating layers |
08/02/1988 | US4761303 Dielectrics masking, applying copper |
08/02/1988 | CA1240072A1 Metal cored circuit board with baked-on polymer layer |
08/02/1988 | CA1240027A1 Hearing aid and apparatus used therein |
08/02/1988 | CA1239859A1 Flexible multilayer polyimide laminates |
07/28/1988 | WO1988005428A1 Method for connecting leadless chip packages and articles |
07/28/1988 | DE3742151A1 Electrical apparatus having overheating protection |
07/28/1988 | DE3701310A1 Contact-making device for making contact with surface-mounted integrated circuits |
07/27/1988 | EP0276004A2 Multilayer ceramic substrate and method for making the same |
07/27/1988 | EP0275433A1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil |
07/27/1988 | CN87108179A Method for inspecting printed circuit boards for missing or misplaced components |
07/27/1988 | CN87105952A Conductive pattern producing method and its applications |
07/26/1988 | US4759986 Associated with covellite copper sulfide |
07/26/1988 | US4759978 Reaction product of a compound having three phenolic hydroxyl groups in a molecule, bisphenol epoxy resin and halogen containing epoxy resin |
07/26/1988 | US4759965 Ceramic, preparation thereof and electronic circuit substrate by use thereof |
07/26/1988 | US4759120 Method for surface mounting a coil |
07/26/1988 | CA1239749A1 Fiber-reinforced syntactic foam composites and method for forming same |
07/20/1988 | EP0275070A2 Multilayer printed wiring board and method for making same |
07/20/1988 | EP0275052A2 Method for making a ceramic multilayer structure having internal copper conductors |
07/20/1988 | EP0274646A1 Process for the preparation of prepregs, and their use |
07/19/1988 | US4758922 High frequency circuit having a microstrip resonance element |
07/19/1988 | US4758808 Impedance element mounted on a pc board |
07/19/1988 | US4758459 Molded circuit board |
07/19/1988 | US4758063 Optical device and circuit board set |
07/19/1988 | US4757759 Multilayer ceramic bar printing and assembling apparatus |
07/14/1988 | WO1988005252A1 Method for the manufacture of multilayer printed circuit boards |